JPS6322773U - - Google Patents
Info
- Publication number
- JPS6322773U JPS6322773U JP11600086U JP11600086U JPS6322773U JP S6322773 U JPS6322773 U JP S6322773U JP 11600086 U JP11600086 U JP 11600086U JP 11600086 U JP11600086 U JP 11600086U JP S6322773 U JPS6322773 U JP S6322773U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- circuit board
- printed circuit
- contact surface
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案によるプリント基板におけるシ
ヤーシとの接触部パターンの説明図、第２図は従
来のプリント基板とシヤーシや金具などとの接触
部パターンの説明図である。
１……プリント基板、２……シヤーシや金具、
３……接触部、４……はんだレジスト、５……は
んだ、６……本考案による楕円形接触部。
FIG. 1 is an explanatory diagram of a pattern of a contact portion between a printed circuit board and a chassis according to the present invention, and FIG. 2 is an explanatory diagram of a pattern of a contact portion between a conventional printed circuit board and a chassis, metal fittings, etc. 1... Printed circuit board, 2... Chassis and metal fittings,
3...Contact portion, 4...Solder resist, 5...Solder, 6...Oval contact portion according to the present invention.
Claims (1)
金属体の接触面と接触する部位に設けられ、前記
プリント基板表面上にレジストとはんだづけにて
形成される接触部のパターンを、前記金属体接触
面の長さ方向に沿つて短軸長が約０．５〜１mm、
前記長さ方向と直角な長軸長が前記接触面の幅よ
り約１〜５mm長い楕円形状の接触部を間隔約２〜
５mmにて多数並べて形成した接触部パターンを有
することを特徴とするプリント基板。 The pattern of the contact part, which is provided at a part that comes into contact with the contact surface of a metal body such as a chassis or metal fittings attached to a printed circuit board, and is formed on the surface of the printed circuit board by resist and soldering, is determined by the length of the contact surface of the metal body. The short axis length is about 0.5 to 1 mm along the direction,
Oval-shaped contact portions whose long axis length perpendicular to the length direction is approximately 1 to 5 mm longer than the width of the contact surface are arranged at intervals of approximately 2 to 5 mm.
A printed circuit board characterized by having a plurality of contact pattern patterns arranged side by side with a width of 5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11600086U JPS6322773U (en) | 1986-07-30 | 1986-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11600086U JPS6322773U (en) | 1986-07-30 | 1986-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322773U true JPS6322773U (en) | 1988-02-15 |
Family
ID=31000187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11600086U Pending JPS6322773U (en) | 1986-07-30 | 1986-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176646A1 (en) * | 2011-06-23 | 2012-12-27 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | Shield frame, sealed frame mounting structure, and electronic portable device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54101163A (en) * | 1978-01-26 | 1979-08-09 | Nippon Electric Co | Circuit board |
-
1986
- 1986-07-30 JP JP11600086U patent/JPS6322773U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54101163A (en) * | 1978-01-26 | 1979-08-09 | Nippon Electric Co | Circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176646A1 (en) * | 2011-06-23 | 2012-12-27 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | Shield frame, sealed frame mounting structure, and electronic portable device |