JPS6322759U - - Google Patents

Info

Publication number
JPS6322759U
JPS6322759U JP1986114702U JP11470286U JPS6322759U JP S6322759 U JPS6322759 U JP S6322759U JP 1986114702 U JP1986114702 U JP 1986114702U JP 11470286 U JP11470286 U JP 11470286U JP S6322759 U JPS6322759 U JP S6322759U
Authority
JP
Japan
Prior art keywords
stem electrode
light emitting
emitting diode
diode element
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986114702U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986114702U priority Critical patent/JPS6322759U/ja
Publication of JPS6322759U publication Critical patent/JPS6322759U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第１図は本考案の発光ダイオード素子（ＬＥＤ
素子）用ステム電極の一実施例を示し、ａは凹状
面の底部面が左方向に傾斜している場合の断面図
、ｂは右方向に傾斜している場合の断面図、第２
図は自動車のストツプランプを多数のＬＥＤ素子
により構成すべく第１図ａ，ｂに示したステム電
極を用いたストツプランプの平面図、第３図は第
２図に示したストツプランプに使用するステム電
極の各区分に対する取付状態を示す一部破断断面
図、第４図は第２図に示したストツプランプに拡
散カバーを取付けた時の縦断面図、第５図は第４
図に示したものをハイマウント・ストツプランプ
のケーシングに組み込んだ時の斜視図、第６図は
通常のステム電極の断面図、第７図ａはストツプ
ランプの指向性を示す図、第７図ｂはストツプラ
ンプの配光パターンを示す図である。 １：発光ダイオード素子、７：基板、８：拡散
カバー、９：ケーシング、１１ａ，１１ｂ，３１
：ステム電極、１２，３２：凹状面の底部面。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 凹状面を有し、該凹状面の底部面に発光ダ
    イオード素子が取付けられる発光ダイオード素子
    用ステム電極において、前記凹状面の底部面がス
    テム電極本体の底面に対して非平行であることを
    特徴とする発光ダイオード素子用ステム電極。 (2) 前記凹状面の底部面とステム電極本体の底
    面とのなす角度が約５度であることを特徴とする
    実用新案登録請求の範囲第(1)項記載の発光ダイ
    オード素子用ステム電極。
JP1986114702U 1986-07-26 1986-07-26 Pending JPS6322759U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986114702U JPS6322759U (ja) 1986-07-26 1986-07-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986114702U JPS6322759U (ja) 1986-07-26 1986-07-26

Publications (1)

Publication Number Publication Date
JPS6322759U true JPS6322759U (ja) 1988-02-15

Family

ID=30997679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986114702U Pending JPS6322759U (ja) 1986-07-26 1986-07-26

Country Status (1)

Country Link
JP (1) JPS6322759U (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492660U (ja) * 1990-12-28 1992-08-12
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
JP2011177974A (ja) * 2010-02-26 2011-09-15 Kyocera Corp 発光素子アレイおよび印刷装置
DE102012216983B4 (de) 2011-09-22 2024-03-14 Citizen Electronics Co., Ltd. Licht aussendendes Element und Beleuchtungsvorrichtung, die dieses verwendet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492660U (ja) * 1990-12-28 1992-08-12
JPH11163412A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd Ｌｅｄ照明装置
JP2011177974A (ja) * 2010-02-26 2011-09-15 Kyocera Corp 発光素子アレイおよび印刷装置
DE102012216983B4 (de) 2011-09-22 2024-03-14 Citizen Electronics Co., Ltd. Licht aussendendes Element und Beleuchtungsvorrichtung, die dieses verwendet

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