JPS629287U - - Google Patents

Info

Publication number
JPS629287U
JPS629287U JP1985025109U JP2510985U JPS629287U JP S629287 U JPS629287 U JP S629287U JP 1985025109 U JP1985025109 U JP 1985025109U JP 2510985 U JP2510985 U JP 2510985U JP S629287 U JPS629287 U JP S629287U
Authority
JP
Japan
Prior art keywords
light
insulating substrate
conductive wires
view
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985025109U
Other languages
English (en)
Other versions
JPH036938Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985025109U priority Critical patent/JPH036938Y2/ja
Publication of JPS629287U publication Critical patent/JPS629287U/ja
Application granted granted Critical
Publication of JPH036938Y2 publication Critical patent/JPH036938Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す斜視図、第２
図は縒を与える前の平帯状絶縁基板等の一態様を
示す斜視図、第３図イは縒を強く与えたときの同
絶縁基板等の斜視図、第３図ロは縒を更に強く与
えたときの同絶縁基板等の斜視図、第４図は縒を
与える前の平帯状絶縁基板の他の態様を示す平面
図、第５図は導電線条を内部に設けた平帯状絶縁
基板の断面図、第６図は縒を与える前の平帯状絶
縁基板等の更に他の態様を示す斜視図、第７図及
び第８図はそれぞれ本考案の他の実施例を示す断
面図、第９図は発光体素子としての固体ランプを
示す断面図、第１０図は先行例の斜視図である。 １……平帯状絶縁基板、２，２′，２″……導
電線条、３，３′……発光体素子、４，４′，４
″……可撓被包体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面又は内部に複数の導電線条を設けた可撓性
    を有する平帯状絶縁基板の表面に多数の発光体素
    子を列状に配して該導電線条間に接続すると共に
    、該絶縁基板に一定方向の縒を与え、少なくとも
    発光面側が透光性とされた可撓被包体で全体を被
    包して成る、折曲可能な発光表示体。
JP1985025109U 1985-02-22 1985-02-22 Expired JPH036938Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985025109U JPH036938Y2 (ja) 1985-02-22 1985-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985025109U JPH036938Y2 (ja) 1985-02-22 1985-02-22

Publications (2)

Publication Number Publication Date
JPS629287U true JPS629287U (ja) 1987-01-20
JPH036938Y2 JPH036938Y2 (ja) 1991-02-21

Family

ID=30824955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985025109U Expired JPH036938Y2 (ja) 1985-02-22 1985-02-22

Country Status (1)

Country Link
JP (1) JPH036938Y2 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004038289A1 (ja) * 2002-10-25 2004-05-06 Moriyama Sangyo Kabushiki Kaisha 発光モジュール
WO2009054048A1 (ja) * 2007-10-23 2009-04-30 Kazuhiro Miyashita 発光ダイオードを光源とする軟性発光帯
JP2010529645A (ja) * 2007-06-01 2010-08-26 ワッカー ケミー アクチエンゲゼルシャフト 発光体を有するシリコン成形部材
WO2010119872A1 (ja) * 2009-04-13 2010-10-21 パナソニック電工株式会社 Ｌｅｄユニット
JP2011090849A (ja) * 2009-10-21 2011-05-06 Atex Co Ltd フレキシブル発光装置およびその製造方法
JP2014139934A (ja) * 2005-10-28 2014-07-31 Proteras Co Ltd フレキシブル発光体

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004038289A1 (ja) * 2002-10-25 2004-05-06 Moriyama Sangyo Kabushiki Kaisha 発光モジュール
JP2014139934A (ja) * 2005-10-28 2014-07-31 Proteras Co Ltd フレキシブル発光体
JP2020025108A (ja) * 2005-10-28 2020-02-13 株式会社テラスホールディングス フレキシブル発光体
JP2010529645A (ja) * 2007-06-01 2010-08-26 ワッカー ケミー アクチエンゲゼルシャフト 発光体を有するシリコン成形部材
WO2009054048A1 (ja) * 2007-10-23 2009-04-30 Kazuhiro Miyashita 発光ダイオードを光源とする軟性発光帯
WO2010119872A1 (ja) * 2009-04-13 2010-10-21 パナソニック電工株式会社 Ｌｅｄユニット
US8592830B2 (en) 2009-04-13 2013-11-26 Panasonic Corporation LED unit
JP2011090849A (ja) * 2009-10-21 2011-05-06 Atex Co Ltd フレキシブル発光装置およびその製造方法

Also Published As

Publication number Publication date
JPH036938Y2 (ja) 1991-02-21

Similar Documents

Publication Publication Date Title
JPS629287U (ja)
JPS61182587U (ja)
JPS61179591U (ja)
JPS61182590U (ja)
JPS61137988U (ja)
JPS61165585U (ja)
JPS6241185U (ja)
JPS61165583U (ja)
JPS6258489U (ja)
JPS61165584U (ja)
JPS5982903U (ja) 連結可能な照明管
JPH01171055U (ja)
JPH0319296U (ja)
JPH025782U (ja)
JPS6144860U (ja) 折曲可能な発光表示体
JPS61165586U (ja)
JPS6410952U (ja)
JPH0191985U (ja)
JPH0262483U (ja)
JPS61190157U (ja)
JPS62180892U (ja)
JPH0344819U (ja)
JPS6410953U (ja)
JPS62118325U (ja)
JPS61179618U (ja)