JPS6322728U - - Google Patents
Info
- Publication number
- JPS6322728U JPS6322728U JP11544486U JP11544486U JPS6322728U JP S6322728 U JPS6322728 U JP S6322728U JP 11544486 U JP11544486 U JP 11544486U JP 11544486 U JP11544486 U JP 11544486U JP S6322728 U JPS6322728 U JP S6322728U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor wafer
- symbols
- indicate
- flat surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Weting (AREA)
Description
第１図は本考案の半導体ウエハの一実施例の説
明図、第２図は同じく他の実施例の説明図、第３
図〜第５図は従来の実施例の説明図である。 １，３，８：ウエハ、２，２′，４，４′：切
り取り部、６：矢印記号、７：マスク板、９：細
線記号。
明図、第２図は同じく他の実施例の説明図、第３
図〜第５図は従来の実施例の説明図である。 １，３，８：ウエハ、２，２′，４，４′：切
り取り部、６：矢印記号、７：マスク板、９：細
線記号。
Claims (1)
- 半導体ウエハの平面部に化学的エツチングを用
いウエハ処理作業時のメサ方向およびウエハの表
裏を表示する記号印が設けてあることを特徴とす
る半導体ウエハ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11544486U JPS6322728U (ja) | 1986-07-28 | 1986-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11544486U JPS6322728U (ja) | 1986-07-28 | 1986-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322728U true JPS6322728U (ja) | 1988-02-15 |
Family
ID=30999102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11544486U Pending JPS6322728U (ja) | 1986-07-28 | 1986-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322728U (ja) |
-
1986
- 1986-07-28 JP JP11544486U patent/JPS6322728U/ja active Pending
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