JPS6322409B2 - - Google Patents

Info

Publication number
JPS6322409B2
JPS6322409B2 JP57078714A JP7871482A JPS6322409B2 JP S6322409 B2 JPS6322409 B2 JP S6322409B2 JP 57078714 A JP57078714 A JP 57078714A JP 7871482 A JP7871482 A JP 7871482A JP S6322409 B2 JPS6322409 B2 JP S6322409B2
Authority
JP
Japan
Prior art keywords
cooling
disk
ion implantation
path
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57078714A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194240A (ja
Inventor
Koji Matsuda
Tsukasa Nogami
Susumu Yamada
Masahiko Aoki
Katsuo Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUSHIN HAIBORUTEEJI KK
Original Assignee
NITSUSHIN HAIBORUTEEJI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUSHIN HAIBORUTEEJI KK filed Critical NITSUSHIN HAIBORUTEEJI KK
Priority to JP57078714A priority Critical patent/JPS58194240A/ja
Publication of JPS58194240A publication Critical patent/JPS58194240A/ja
Publication of JPS6322409B2 publication Critical patent/JPS6322409B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP57078714A 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置 Granted JPS58194240A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57078714A JPS58194240A (ja) 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57078714A JPS58194240A (ja) 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置

Publications (2)

Publication Number Publication Date
JPS58194240A JPS58194240A (ja) 1983-11-12
JPS6322409B2 true JPS6322409B2 (https=) 1988-05-11

Family

ID=13669534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57078714A Granted JPS58194240A (ja) 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置

Country Status (1)

Country Link
JP (1) JPS58194240A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734439B2 (en) * 2001-10-25 2004-05-11 Allan Weed Wafer pedestal tilt mechanism and cooling system
US7528392B2 (en) * 2006-11-27 2009-05-05 Varian Semiconductor Equipment Associates, Inc. Techniques for low-temperature ion implantation

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50109596A (https=) * 1974-02-06 1975-08-28
JPS5953659B2 (ja) * 1980-04-11 1984-12-26 株式会社日立製作所 真空室中回転体の往復動機構

Also Published As

Publication number Publication date
JPS58194240A (ja) 1983-11-12

Similar Documents

Publication Publication Date Title
US4228358A (en) Wafer loading apparatus for beam treatment
US4548699A (en) Transfer plate rotation system
US7288179B2 (en) Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
WO1998008997A2 (en) A cylindrical carriage sputtering system
DE3588132T2 (de) Vorrichtung zum Scannen von Wafern
US5929456A (en) Ion implantation system and method adapted for serial wafer processing
KR100608957B1 (ko) 성막 장치 및 이를 이용한 성막 방법
WO2002027754A3 (en) An apparatus for the backside gas cooling of a wafer in a batch ion implantation system
US4599516A (en) Specimens rotating device
JPS6322409B2 (https=)
US6313469B1 (en) Substrate handling apparatus and ion implantation apparatus
JPS6259409B2 (https=)
JPS6127857B2 (https=)
KR20220148650A (ko) 내외경 동시 연삭기
JPH05345253A (ja) 旋盤用工作物スピンドル装置
JP6936270B2 (ja) ウェーハ・ボート冷却デバイス
KR0137662B1 (ko) 이온 비임 처리 시스템의 작업편 병진 이동장치
JPS6322410B2 (https=)
JPH081475A (ja) ターンテーブル装置
US4044266A (en) Apparatus for ion-implantation in elements, especially discs of semi-conducting material
JPH0227496Y2 (https=)
RU2188120C1 (ru) Устройство для шлифования
SU1459895A1 (ru) Шпиндельный узел
JPH0530155U (ja) 多点蒸発源装置
JPS59130427A (ja) 改良された冷却を用いる表面処理用工作物ホルダ及び表面処理中に工作物を監視するための流体冷却回転ステ−ジ