JPS6322046B2 - - Google Patents
Info
- Publication number
- JPS6322046B2 JPS6322046B2 JP3202680A JP3202680A JPS6322046B2 JP S6322046 B2 JPS6322046 B2 JP S6322046B2 JP 3202680 A JP3202680 A JP 3202680A JP 3202680 A JP3202680 A JP 3202680A JP S6322046 B2 JPS6322046 B2 JP S6322046B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- base metal
- forming
- firing
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010953 base metal Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 14
- 230000009467 reduction Effects 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910052573 porcelain Inorganic materials 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3202680A JPS56129313A (en) | 1980-03-12 | 1980-03-12 | Method of forming electrode of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3202680A JPS56129313A (en) | 1980-03-12 | 1980-03-12 | Method of forming electrode of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56129313A JPS56129313A (en) | 1981-10-09 |
| JPS6322046B2 true JPS6322046B2 (lm) | 1988-05-10 |
Family
ID=12347345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3202680A Granted JPS56129313A (en) | 1980-03-12 | 1980-03-12 | Method of forming electrode of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56129313A (lm) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5860923U (ja) * | 1981-10-17 | 1983-04-25 | ティーディーケイ株式会社 | 円筒形コンデンサ |
| JPS5874030A (ja) * | 1981-10-28 | 1983-05-04 | ティーディーケイ株式会社 | 電子部品、導電皮膜組成物及び製造方法 |
| JPS5915205A (ja) * | 1982-07-17 | 1984-01-26 | Canon Inc | レ−ザユニツト |
| JPS6348889A (ja) * | 1986-08-19 | 1988-03-01 | 株式会社 コサク | プリント配線板の電導性ペイントパタ−ンの安定化方法 |
-
1980
- 1980-03-12 JP JP3202680A patent/JPS56129313A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56129313A (en) | 1981-10-09 |
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