JPS63213398A - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法Info
- Publication number
- JPS63213398A JPS63213398A JP62046172A JP4617287A JPS63213398A JP S63213398 A JPS63213398 A JP S63213398A JP 62046172 A JP62046172 A JP 62046172A JP 4617287 A JP4617287 A JP 4617287A JP S63213398 A JPS63213398 A JP S63213398A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- printed wiring
- substrate
- layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62046172A JPS63213398A (ja) | 1987-02-27 | 1987-02-27 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62046172A JPS63213398A (ja) | 1987-02-27 | 1987-02-27 | 多層プリント配線板の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1827893A Division JPH05251868A (ja) | 1993-02-05 | 1993-02-05 | ブラインド・バイア・ホールを有する多層プリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63213398A true JPS63213398A (ja) | 1988-09-06 |
JPH0563036B2 JPH0563036B2 (zh) | 1993-09-09 |
Family
ID=12739606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62046172A Granted JPS63213398A (ja) | 1987-02-27 | 1987-02-27 | 多層プリント配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63213398A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008181998A (ja) * | 2007-01-24 | 2008-08-07 | Matsushita Electric Ind Co Ltd | ビルドアップ基板とその製造方法および検査方法 |
JP2012243994A (ja) * | 2011-05-20 | 2012-12-10 | Toshiba Corp | プリント配線板およびその検査方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124769A (en) * | 1977-04-06 | 1978-10-31 | Fujitsu Ltd | Method of producing multilayer printed board |
JPS5435671A (en) * | 1977-08-25 | 1979-03-15 | Toyo Electric Mfg Co Ltd | Commutation fault detector |
JPS59175796A (ja) * | 1983-03-25 | 1984-10-04 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
-
1987
- 1987-02-27 JP JP62046172A patent/JPS63213398A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124769A (en) * | 1977-04-06 | 1978-10-31 | Fujitsu Ltd | Method of producing multilayer printed board |
JPS5435671A (en) * | 1977-08-25 | 1979-03-15 | Toyo Electric Mfg Co Ltd | Commutation fault detector |
JPS59175796A (ja) * | 1983-03-25 | 1984-10-04 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008181998A (ja) * | 2007-01-24 | 2008-08-07 | Matsushita Electric Ind Co Ltd | ビルドアップ基板とその製造方法および検査方法 |
JP2012243994A (ja) * | 2011-05-20 | 2012-12-10 | Toshiba Corp | プリント配線板およびその検査方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0563036B2 (zh) | 1993-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |