JPS63211713A - Manufacture of ceramic element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for manufacturing a ceramic element, and particularly to a method for manufacturing a ceramic element in which the process of forming an electrode structure connected to a lead wire is improved. Involved.

(Prior Art) Examples of thin-plate ceramic elements include single-plate chip capacitors and piezoelectric elements, and examples of multilayer ceramic elements include multilayer chip capacitors. As shown in Fig. 10, a single-plate chip capacitor is manufactured by forming an electrode 2 on the surface of a fired ceramic thin plate 1 by baking a silver base or by plating with N1, Cu, etc., and also forming an electrode (2) on the back surface.
(not shown), and then lead wires 3a and 3b are soldered to the electrodes 2 on the front and back surfaces, respectively. Multilayer chip capacitors are made by printing a conductive paste that serves as internal electrodes on a raw ceramic sheet that is formed into a sheet, stacking many of these raw sheets, and then placing two raw ceramic sheets on top and bottom of which no conductive paste is printed. placed, hot-pressed to form a single piece, and then 1
After cutting into each element, a ceramic laminate 5 having a pair of internal opposing electrodes 4a, 4b intersecting each other near the center is produced by firing, and subsequently, on the exposed side surface of each internal electrode 4a, 4b of the laminate 5. It is manufactured by baking a silver paste to form the external electrode 6a16b (as shown in FIG. 11).

However, in the manufacturing method of single-chip capacitors, the lead wires 3a and 3b must be attached to the electrodes 2 on the front and back surfaces, which makes attaching the lead wires complicated. The lead wire 3b on the side becomes an obstacle to mounting. Furthermore, in the method of manufacturing a multilayer chip capacitor, the external electrodes 6a, 6b are formed on the entire opposing sides of the ceramic laminate 5, which not only makes the process of forming the external electrodes 6a, 6b complicated, but also increases the size of the capacitor itself. Moreover, since the external electrodes 6a and 6b are formed even on the lower end surface of the laminate 5, this becomes an obstacle to mounting on a circuit board.

(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned problems of the conventional art. The present invention aims to provide a method for manufacturing a ceramic element that can improve mounting reliability.

[Structure of the Invention] (Means for Solving the Problems) The present invention comprises the steps of forming two electrodes electrically separated from each other on the surface of a ceramic thin plate, and forming one electrode on the back surface of the thin plate. , comprising the step of irradiating one of the electrodes formed on the surface of the thin plate with a laser beam to form a through hole and making the one electrode conductive to the electrode on the back surface. This is a method of manufacturing a ceramic element.

(Function) According to the present invention, two electrodes electrically separated from each other are formed on the surface of a ceramic thin plate, and one electrode is formed on the back surface of the thin plate, and furthermore, two electrodes are formed on the surface of the thin ceramic plate, and one electrode is formed on the back surface of the thin plate. By irradiating one of the electrodes with a single laser beam to form a through hole and making the one electrode conductive to the electrode on the back surface, the front side of the ceramic thin plate is electrically separated from each other, and one is on the back side. It is possible to form two electrodes that are electrically connected to each other via a through hole. As a result, the lead wires can be connected to the electrodes on the front and back surfaces of the ceramic thin plate on the front side, so that the work of attaching the lead wires can be significantly simplified. Moreover, since no lead wires are connected to the back side of the ceramic thin plate, it is possible to improve mounting performance on a circuit board.

(Embodiments of the Invention) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Example 1 First, a front surface electrode 12 and a partial electrode 13 electrically separated from each other were formed by baking silver paste on the surface of a ceramic thin plate 11, and then a back surface electrode [14] was formed by baking silver paste. Figures (A) and (B) shown). Subsequently, as shown in FIG. 2, the surface of the partial electrode 13 was irradiated with a laser beam 15 from a laser beam oscillator. At this time,
A through hole was formed in the laser beam irradiation part of the ceramic thin plate 11, and a part of the metal and electrode material constituting the ceramic evaporated, and metal adhered to the inner wall of the through hole, forming a through hole 15. . By forming the through holes 16 in this manner, a single-plate chip capacitor 17 in which the partial electrode 13 and the back electrode 14 were electrically connected was manufactured (as shown in FIG. 3). After this, the surface electrode 12 and the partial electrode 13
By soldering the lead wires 18a and 18b, respectively, as shown in FIG. 4, the lead wires 18a and 18b can be connected only on one side of the capacitor 17.

In Example 1, a surface electrode and a partial electrode that are electrically separated from each other are formed on the surface of a thin ceramic plate, and through holes are formed in the partial electrode, but the present invention is not limited thereto. For example, first, as shown in FIG. 5, after forming a circular ceramic thin plate exposed region 19 at the center of the surface electrode 12,
The area 19 is irradiated with a laser beam, and as in Example 1,
Through hole 1 electrically connected to back electrode (not shown)
6 to fabricate a single-chip capacitor 17.

Next, by soldering the lead wires into the surface electrodes 12 and through holes 16, the lead wires 1
8a and 18b can be connected on one side of the capacitor 17.

Example 2 First, a conductive paste that will become an internal electrode is printed on a raw ceramic sheet that has been formed into a sheet, and these raw sheets are stacked, for example, four sheets, and two raw ceramic sheets with no conductive paste printed on top and bottom of this are stacked. A pair of internally facing electrodes 21a are arranged, hot-pressed to form a single piece, and further cut into individual elements, and then fired to cross each other near the center.
, 21b was produced (as shown in FIG. 7). Subsequently, as shown in FIG. 8, a laser beam 23 from a laser beam oscillator is applied to the surface of the laminate 22 (73) corresponding to each of the internal opposing electrodes 21a and 21b.
．． 23 were sequentially irradiated. At this time, as in Example 1 described above, through-holes are formed in the laser beam irradiated portions of the ceramic laminate 22, and a portion of the metal constituting the ceramic and the internal counter electrode material evaporate, causing each Metal adhered to the inner wall of the through hole to form a through hole 24a124b. By forming the through holes 24a and 124b, a multilayer chip capacitor 25 was manufactured in which the internal electrodes 21a and 21b were electrically connected to each other. After that, lead wires 26a and 26a are inserted into each through hole 24a and 24b, respectively.
26b is inserted and soldered, the lead wires 26a and 126b can be connected on one side of the multilayer chip capacitor 25, as shown in FIG.

[Effects of the Invention] As detailed above, the present invention provides a method for manufacturing a ceramic element that allows easy connection of external lead wires to electrodes and improves reliability of mounting on a circuit board. Can be provided.

[Brief explanation of the drawing]

1 to 4 are diagrams showing the manufacturing process of a single-plate chip capacitor with a lead wire in Example 1 of the present invention,
Figure 1 (A) is a plan view showing the state after electrode formation;
B) is a cross-sectional view of the same figure < A), FIG. 2 is a cross-sectional view showing the laser beam irradiation process, and FIG. 3 is a cross-sectional view showing a single-chip capacitor with through holes formed by laser beam irradiation. FIG. 4 is a plan view showing a state in which lead wires are connected to a single-chip capacitor. Figure 5, District 6 Example 1
FIG. 3 is a cross-sectional view showing the manufacturing process of a single-plate chip capacitor with a lead wire, which is a modification of the above. 7 to 9 are diagrams showing the manufacturing process of a chip capacitor with lead wires in Example 2 of the present invention, FIG. 7 is a partially cutaway perspective view showing a ceramic laminate, and FIG. 8 is a diagram showing a laser beam A perspective view showing the process of irradiating the
FIG. 3 is a cross-sectional view showing a state in which a lead wire is connected to a capacitor. FIG. 10 is a perspective view showing a single-plate chip capacitor with lead wires manufactured by the conventional method, and FIG. 11 is a perspective view showing a multilayer chip capacitor with lead wires manufactured by the conventional method. 11... Ceramic thin plate, 12... Surface electrode, 1
3... Partial electrode, 14... Back electrode, 15.23.
...Laser light, 16.24a, 24b...Through hole, 17...Single chip φ capacitor, 18a,
18b, 26a, 26b...Lead wire,
19... Ceramic thin plate exposed area, 21a, 2
1b... Internal counter electrode, 22... Ceramic laminate, 25... Multilayer chip capacitor. Applicant's agent Patent attorney Takehiko Suzue Figure 5 Figure 9 Figure 10 and Figure 11

Claims (2)

[Claims] (1) A step of forming two electrically separated electrodes on the surface of a ceramic thin plate and one electrode on the back surface of the thin plate, and forming one of the electrodes formed on the surface of the thin plate. A method for manufacturing a ceramic element, comprising the steps of: forming a through hole by irradiating the electrode with a laser beam, and making the one electrode electrically conductive with the electrode on the back surface. (2) A step of producing a ceramic laminate having a pair of internally opposing electrodes made up of two or more electrodes that intersect with each other near the center, and applying a laser beam to the surface of the laminate corresponding to each internally opposing electrode, respectively. 2. The method of manufacturing a ceramic element according to claim 1, further comprising the step of irradiating to form through-holes and establishing electrical continuity with each internal opposing electrode.