JPS6320840A - 外部リ−ド接合装置における巻き取りリ−ル構造 - Google Patents

外部リ−ド接合装置における巻き取りリ−ル構造

Info

Publication number
JPS6320840A
JPS6320840A JP61166033A JP16603386A JPS6320840A JP S6320840 A JPS6320840 A JP S6320840A JP 61166033 A JP61166033 A JP 61166033A JP 16603386 A JP16603386 A JP 16603386A JP S6320840 A JPS6320840 A JP S6320840A
Authority
JP
Japan
Prior art keywords
reel
take
film carrier
shaft
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61166033A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587138B2 (enExample
Inventor
Yasunobu Suzuki
鈴木　安信
Motohiko Kato
元彦 加藤
Akio Bando
板東　昭雄
Hisao Ishida
久雄 石田
Akihiro Nishimura
明浩 西村
Hiroshi Yamaguchi
弘 山口
Naoki Awamura
直樹 粟村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
UNION KOGAKU KK
Original Assignee
Shinkawa Ltd
UNION KOGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, UNION KOGAKU KK filed Critical Shinkawa Ltd
Priority to JP61166033A priority Critical patent/JPS6320840A/ja
Publication of JPS6320840A publication Critical patent/JPS6320840A/ja
Publication of JPH0587138B2 publication Critical patent/JPH0587138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP61166033A 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造 Granted JPS6320840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61166033A JPS6320840A (ja) 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61166033A JPS6320840A (ja) 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造

Publications (2)

Publication Number Publication Date
JPS6320840A true JPS6320840A (ja) 1988-01-28
JPH0587138B2 JPH0587138B2 (enExample) 1993-12-15

Family

ID=15823696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61166033A Granted JPS6320840A (ja) 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造

Country Status (1)

Country Link
JP (1) JPS6320840A (enExample)

Also Published As

Publication number Publication date
JPH0587138B2 (enExample) 1993-12-15

Similar Documents

Publication Publication Date Title
JPH0467782B2 (enExample)
US4526646A (en) Inner lead bonder
JP5308433B2 (ja) 部品実装装置及びその方法
JPS63296398A (ja) 部品装着装置
WO2019095597A1 (zh) 轮胎用rfid电子标签的层合设备
JP4190611B2 (ja) 部品装着方法、及び部品装着装置
JPH1062804A (ja) 液晶実装方法及び装置
JPS6320840A (ja) 外部リ−ド接合装置における巻き取りリ−ル構造
CN111168766B (zh) 薄膜自动冲切机
JP2004241607A (ja) 電子部品の反転供給装置
JPH0675199A (ja) 液晶パネル製造装置、位置決め装置および加工装置
TWI856783B (zh) 一種貼膜貼信息碼設備和貼膜貼信息碼方法
CN114520174B (zh) 一种全自动高速贴片装置及其贴片方法
JPH10163265A (ja) チップの実装装置
CN118016560A (zh) 保护带的剥离方法和保护带剥离装置
JPS6320847A (ja) 外部リ−ド接合方法
JP2001308149A (ja) Ｆｐｃ用半導体実装装置及び方法
JPS5935177B2 (ja) ダイボンデイング装置
JP4452817B2 (ja) 回路基板用シート状ワークの枠貼装置
JPS6342134A (ja) チツプボンデイング装置
CN223718715U (zh) 摄像头sma底座弹片自动吸送点焊机
TWM630108U (zh) 化妝品自動填充設備
JPH0157498B2 (enExample)
JPH0442316B2 (enExample)
JPH0151055B2 (enExample)