JPS6320120Y2 - - Google Patents

Info

Publication number
JPS6320120Y2
JPS6320120Y2 JP1983195123U JP19512383U JPS6320120Y2 JP S6320120 Y2 JPS6320120 Y2 JP S6320120Y2 JP 1983195123 U JP1983195123 U JP 1983195123U JP 19512383 U JP19512383 U JP 19512383U JP S6320120 Y2 JPS6320120 Y2 JP S6320120Y2
Authority
JP
Japan
Prior art keywords
electronic component
pedestal
mold
molded body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983195123U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60103841U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983195123U priority Critical patent/JPS60103841U/ja
Publication of JPS60103841U publication Critical patent/JPS60103841U/ja
Application granted granted Critical
Publication of JPS6320120Y2 publication Critical patent/JPS6320120Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP1983195123U 1983-12-19 1983-12-19 電子部品装置 Granted JPS60103841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983195123U JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983195123U JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Publications (2)

Publication Number Publication Date
JPS60103841U JPS60103841U (ja) 1985-07-15
JPS6320120Y2 true JPS6320120Y2 (cg-RX-API-DMAC10.html) 1988-06-03

Family

ID=30419181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983195123U Granted JPS60103841U (ja) 1983-12-19 1983-12-19 電子部品装置

Country Status (1)

Country Link
JP (1) JPS60103841U (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
JP2006120833A (ja) * 2004-10-21 2006-05-11 Harvatek Corp 電気光学半導体のパッケージ構造
JP6392654B2 (ja) * 2014-02-04 2018-09-19 エイブリック株式会社 光センサ装置
JP2017050411A (ja) * 2015-09-02 2017-03-09 株式会社東芝 光半導体装置、およびその製造方法
WO2019059047A1 (ja) * 2017-09-20 2019-03-28 岩崎電気株式会社 発光装置、照明装置、及び発光装置の製造方法

Also Published As

Publication number Publication date
JPS60103841U (ja) 1985-07-15

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