JPS63200352U - - Google Patents
Info
- Publication number
- JPS63200352U JPS63200352U JP1987091644U JP9164487U JPS63200352U JP S63200352 U JPS63200352 U JP S63200352U JP 1987091644 U JP1987091644 U JP 1987091644U JP 9164487 U JP9164487 U JP 9164487U JP S63200352 U JPS63200352 U JP S63200352U
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- base
- metal cap
- lead wire
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987091644U JPS63200352U (id) | 1987-06-15 | 1987-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987091644U JPS63200352U (id) | 1987-06-15 | 1987-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200352U true JPS63200352U (id) | 1988-12-23 |
Family
ID=30952619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987091644U Pending JPS63200352U (id) | 1987-06-15 | 1987-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200352U (id) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006509373A (ja) * | 2002-12-06 | 2006-03-16 | クリー インコーポレイテッド | １つの小さい設置面積を有するｌｅｄパッケージダイ |
-
1987
- 1987-06-15 JP JP1987091644U patent/JPS63200352U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006509373A (ja) * | 2002-12-06 | 2006-03-16 | クリー インコーポレイテッド | １つの小さい設置面積を有するｌｅｄパッケージダイ |
| JP4675627B2 (ja) * | 2002-12-06 | 2011-04-27 | クリー インコーポレイテッド | １つの小さい設置面積を有するｌｅｄパッケージダイ |
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