JPS6319771U - - Google Patents

Info

Publication number
JPS6319771U
JPS6319771U JP11131486U JP11131486U JPS6319771U JP S6319771 U JPS6319771 U JP S6319771U JP 11131486 U JP11131486 U JP 11131486U JP 11131486 U JP11131486 U JP 11131486U JP S6319771 U JPS6319771 U JP S6319771U
Authority
JP
Japan
Prior art keywords
lead wire
chip part
attachment structure
soldered
funnel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11131486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11131486U priority Critical patent/JPS6319771U/ja
Publication of JPS6319771U publication Critical patent/JPS6319771U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案のリード線取付構造の側面図
、第2図は従来のリード線取付構造の側面図。 1……セラミツク基板、2……リード線、3…
…導体パツド、10……チツプ部品、12……穴
FIG. 1 is a side view of the lead wire attachment structure of this invention, and FIG. 2 is a side view of the conventional lead wire attachment structure. 1... Ceramic substrate, 2... Lead wire, 3...
...Conductor pad, 10...Chip parts, 12...Hole.

Claims (1)

【実用新案登録請求の範囲】 1 基板上の導体パツドにリード線接続用のチツ
プ部品を実装し、このチツプ部品に上記リード線
を半田付けしていることを特徴とするリード線取
付構造。 2 上記リード線接続用のチツプ部品が、上記リ
ード線の端部を嵌め入れて固定可能とする漏斗状
の穴を有するものである上記実用新案登録請求の
範囲第1項記載のリード線取付構造。
[Claims for Utility Model Registration] 1. A lead wire attachment structure characterized in that a chip part for connecting the lead wire is mounted on a conductor pad on a board, and the lead wire is soldered to the chip part. 2. The lead wire attachment structure according to claim 1, wherein the chip part for connecting the lead wire has a funnel-shaped hole into which the end of the lead wire can be inserted and fixed. .
JP11131486U 1986-07-18 1986-07-18 Pending JPS6319771U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11131486U JPS6319771U (en) 1986-07-18 1986-07-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11131486U JPS6319771U (en) 1986-07-18 1986-07-18

Publications (1)

Publication Number Publication Date
JPS6319771U true JPS6319771U (en) 1988-02-09

Family

ID=30991122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11131486U Pending JPS6319771U (en) 1986-07-18 1986-07-18

Country Status (1)

Country Link
JP (1) JPS6319771U (en)

Similar Documents

Publication Publication Date Title
JPS6319771U (en)
JPH0383952U (en)
JPS6333665U (en)
JPH0298482U (en)
JPS6265847U (en)
JPH0374472U (en)
JPH0298653U (en)
JPH0356168U (en)
JPS6359344U (en)
JPS6161854U (en)
JPS6190185U (en)
JPS6355491U (en)
JPH0164862U (en)
JPS6416085U (en)
JPH0166763U (en)
JPS62192670U (en)
JPS6357767U (en)
JPS61157365U (en)
JPS62135367U (en)
JPS62178483U (en)
JPS61203564U (en)
JPH03117875U (en)
JPS61195054U (en)
JPS61114875U (en)
JPS6377357U (en)