JPS61114875U - - Google Patents

Info

Publication number
JPS61114875U
JPS61114875U JP20123784U JP20123784U JPS61114875U JP S61114875 U JPS61114875 U JP S61114875U JP 20123784 U JP20123784 U JP 20123784U JP 20123784 U JP20123784 U JP 20123784U JP S61114875 U JPS61114875 U JP S61114875U
Authority
JP
Japan
Prior art keywords
semiconductor
lead terminals
mounting
wide
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20123784U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20123784U priority Critical patent/JPS61114875U/ja
Publication of JPS61114875U publication Critical patent/JPS61114875U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本考案の一実施例を示す
もので、第1図要部の分解斜視図、第2図は要部
の一部断面図、第3図は斜視図である。 1……半導体素子、2……リード端子、3……
配線板、4a,4b,4c……取付け孔。
1 to 3 show an embodiment of the present invention, in which FIG. 1 is an exploded perspective view of the main part, FIG. 2 is a partial sectional view of the main part, and FIG. 3 is a perspective view. 1... Semiconductor element, 2... Lead terminal, 3...
Wiring board, 4a, 4b, 4c... mounting holes.

Claims (1)

【実用新案登録請求の範囲】 基端部側が幅広に形成され先端部側が幅狭に形
成された複数個のリード端子を有する半導体と、 少なくとも1個が前記リード端子の幅広部を挿
通可能である複数個の取付け孔を有しこれらの取
付け孔に上記各リード端子を挿入して上記半導体
素子を取付けてなる配線板と、を具備し、 前記半導体素子はリード端子のうちの少なくと
も1個を幅広部まで前記取付け孔に挿入されて取
付けられていることを特徴とする半導体取付け装
置。
[Claims for Utility Model Registration] A semiconductor having a plurality of lead terminals each having a wide proximal end and a narrow distal end, at least one of which can be inserted through the wide part of the lead terminal. a wiring board having a plurality of mounting holes, each of the lead terminals inserted into the mounting holes and the semiconductor element mounted thereon; and the semiconductor element has at least one of the lead terminals wide. 1. A semiconductor mounting device, wherein the semiconductor mounting device is inserted into the mounting hole until the end of the mounting hole.
JP20123784U 1984-12-28 1984-12-28 Pending JPS61114875U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20123784U JPS61114875U (en) 1984-12-28 1984-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20123784U JPS61114875U (en) 1984-12-28 1984-12-28

Publications (1)

Publication Number Publication Date
JPS61114875U true JPS61114875U (en) 1986-07-19

Family

ID=30762835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20123784U Pending JPS61114875U (en) 1984-12-28 1984-12-28

Country Status (1)

Country Link
JP (1) JPS61114875U (en)

Similar Documents

Publication Publication Date Title
JPS61114875U (en)
JPS63116980U (en)
JPS6298168U (en)
JPS63155282U (en)
JPS62182577U (en)
JPH0239483U (en)
JPH0328660U (en)
JPS6344474U (en)
JPS62160577U (en)
JPH0359654U (en)
JPS62167383U (en)
JPH0392363U (en)
JPH0355666U (en)
JPS6316477U (en)
JPS61178280U (en)
JPS63111781U (en)
JPS636678U (en)
JPS63197347U (en)
JPS6424820U (en)
JPS6245868U (en)
JPS61111171U (en)
JPS61121671U (en)
JPS6253577U (en)
JPS62134274U (en)
JPS61100152U (en)