JPS62192670U - - Google Patents
Info
- Publication number
- JPS62192670U JPS62192670U JP8053186U JP8053186U JPS62192670U JP S62192670 U JPS62192670 U JP S62192670U JP 8053186 U JP8053186 U JP 8053186U JP 8053186 U JP8053186 U JP 8053186U JP S62192670 U JPS62192670 U JP S62192670U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- element electrode
- soldered
- board
- wired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
Description
第１図は本考案実施例の配線基板パターン図。
１はチツプ部品、２はチツプ部品電極端子、３
は基板はんだ付パターン、４は配線ライン。
第２図は従来例の基板パターン図。第３図は本
考案の実施例配線パターン図。５はチツプ部品の
下に設けられる配線ラインである。第４図は従来
例のはんだ付パターンの改善図。
FIG. 1 is a wiring board pattern diagram of an embodiment of the present invention. 1 is a chip component, 2 is a chip component electrode terminal, 3
is the board soldering pattern, and 4 is the wiring line. FIG. 2 is a diagram of a conventional board pattern. FIG. 3 is a wiring pattern diagram of an embodiment of the present invention. 5 is a wiring line provided under the chip component. Fig. 4 is an improved view of the conventional soldering pattern.
Claims (1)
、上記素子電極２と、パターン３をはんだ付して
配線されるようにされた基板において、素子電極
形状２に比べて上記はんだ付されるパターン３の
面積が小さくされたことを特徴とする配線基板。 In a board in which the element electrode 2 is mounted over the substrate pattern 3 and the element electrode 2 and the pattern 3 are soldered and wired, the pattern to be soldered is compared to the element electrode shape 2. A wiring board characterized in that the area of item 3 is reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8053186U JPS62192670U (en) | 1986-05-28 | 1986-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8053186U JPS62192670U (en) | 1986-05-28 | 1986-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192670U true JPS62192670U (en) | 1987-12-08 |
Family
ID=30931419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8053186U Pending JPS62192670U (en) | 1986-05-28 | 1986-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192670U (en) |
-
1986
- 1986-05-28 JP JP8053186U patent/JPS62192670U/ja active Pending