JPS63197304A - Method of forming thick film resistor - Google Patents
Method of forming thick film resistorInfo
- Publication number
- JPS63197304A JPS63197304A JP62031081A JP3108187A JPS63197304A JP S63197304 A JPS63197304 A JP S63197304A JP 62031081 A JP62031081 A JP 62031081A JP 3108187 A JP3108187 A JP 3108187A JP S63197304 A JPS63197304 A JP S63197304A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- resistor
- paste
- film resistor
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000004020 conductor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000009966 trimming Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010019 resist printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
基板上に形成された厚膜導体間を接続する厚膜抵抗体の
形成方法において、抵抗ペーストの充填塗布工程前に、
予め、上記厚膜導体と重なる部分を含む上記厚膜導体間
に、有機レジストを用いて上記抵抗ペースト充填用凹部
を形成するすることにより、均一で平滑な膜厚を形成可
能にしたものである。[Detailed Description of the Invention] [Summary] In a method for forming a thick film resistor that connects thick film conductors formed on a substrate, before the filling and coating step of resistance paste,
By forming in advance the recesses for filling the resistor paste using an organic resist between the thick film conductors including the portions overlapping with the thick film conductors, it is possible to form a uniform and smooth film thickness. .
本発明は基板上に形成された厚膜導体間を接続する厚膜
抵抗体の形成方法の改良に関する。The present invention relates to an improvement in a method for forming a thick film resistor that connects thick film conductors formed on a substrate.
スクリーン印刷法によって印刷された厚膜抵抗体は、ス
クリーンを持ち上げるとき、パターンの周辺部が盛り上
がり、膜厚が不均一になりにくい。In thick film resistors printed by screen printing, when the screen is lifted, the periphery of the pattern swells and the film thickness is less likely to become uneven.
この厚膜抵抗体の抵抗値を例えば、レーザトリミングに
よって調整する場合、膜厚が不均一なため、マイクロク
ラックが生じ易い。When adjusting the resistance value of this thick film resistor by, for example, laser trimming, microcracks are likely to occur because the film thickness is non-uniform.
このため、膜厚が均一で平滑な厚膜抵抗体を形成する方
法が要望されている。For this reason, there is a need for a method of forming a thick film resistor with a uniform and smooth film thickness.
第２図は従来の方法を工程順に側断面図で示すもので、
第２図（ａ）の導体印刷工程は、基板１１に厚膜導体１
２を印刷、乾燥した状態を、
第２図（ｂ）の抵抗ペースト印刷、乾燥工程は、スクリ
ーン印刷法により抵抗ペースト１５を印刷、乾燥した状
態を、
第２図ｆｃ）の焼成工程は、導体ペースト１２、および
抵抗ペースト１５を焼成して厚膜抵抗体１６を完成した
状態を示している。FIG. 2 is a side sectional view showing the conventional method in the order of steps. In the conductor printing process shown in FIG.
The printing and drying process of the resistor paste 15 shown in FIG. 2(b) shows the printed and dried state of the resistor paste 15 using the screen printing method. The firing process of FIG. The paste 12 and the resistor paste 15 are fired to form a thick film resistor 16.
上記、従来の方法によれば、第２図（Ｃ）のＡ−Ａ断面
を示す第３図のように、スクリーン印刷よる抵抗ペース
トはスクリーンを持ち上げるときにパターンの四隅に盛
り上がりが生じる。According to the above-mentioned conventional method, as shown in FIG. 3, which shows a cross section taken along line A-A in FIG.
膜厚不均一な抵抗体はレーザトリミングのレーザパワー
の調整が難かしい。It is difficult to adjust the laser power for laser trimming of resistors with non-uniform film thickness.
レーザトリミングは、抵抗体の端部から約０．４酊離れ
たＢ位置よりＡ−Ａ線に沿って切り込まれ抵抗体のほぼ
中央部で終了する。The laser trimming is performed by cutting along the line A-A from position B, which is approximately 0.4 mm away from the end of the resistor, and ends at approximately the center of the resistor.
この場合、膜厚の厚い部分を切断できるパワーに合わせ
てトリミングを行うと、中央部の薄い部分ではパワーが
掛かり過ぎマイクロクランクを発生させ易（、薄い部分
を切断できるパワーに合わせると厚い部分の切断が不十
分となりトリミング部で接触障害を起こし易くなるとい
った問題があった。In this case, if you trim to match the power that can cut the thick part, too much power will be applied to the thin part in the center, which can easily cause micro-cranks. There was a problem in that the cutting was insufficient and contact failure was likely to occur at the trimming portion.
本発明は上記問題点を解決する厚膜抵抗体の形成方法を
提供するものである。The present invention provides a method for forming a thick film resistor that solves the above problems.
従来方法における上記問題点は、基板上に形成された厚
膜導体間を接続する厚膜抵抗体の形成方法において、抵
抗ペーストの塗布工程前に、予め、厚膜導体と重なる部
分を含む厚膜導体間に有機レジストを用いて抵抗ペース
ト充填用凹部を形成することによって解決される。The above-mentioned problem with the conventional method is that in the method of forming a thick film resistor that connects thick film conductors formed on a substrate, before the resistor paste application process, a thick film including a portion overlapping with the thick film conductor is prepared in advance. This problem is solved by using an organic resist between the conductors to form a recess for filling the resistive paste.
即ち、凹部の縁に沿って凹部と面一に抵抗ペーストを充
填することにより、抵抗ペーストを平滑に塗布可能とな
り、良好なトリミング性を得られる。That is, by filling the resistor paste flush with the recess along the edges of the recess, the resistor paste can be applied smoothly and good trimming performance can be obtained.
（実施例〕
以下図面に示す一実施例により本発明の要旨を具体的に
説明する。なお図中、同一符号は同一対象物、または同
一部分を示す。(Example) The gist of the present invention will be specifically explained below with reference to an example shown in the drawings.In the drawings, the same reference numerals indicate the same objects or the same parts.
第１図は本発明による方法を工程順に側断面図で示すも
ので、
第１図（ａ）の導体印刷工程は、基Ｆｉ１に厚膜４体２
を印刷、乾燥した状態を、
第１図（ｂｌのレジスト印刷、乾燥工程は、厚膜導体２
と重なる部分を含む厚膜導体２間に有機レジスト３で抵
抗ペースト充填用凹部４を形成した状態を、
第１図（Ｃ）の抵抗ペースト充填塗布、乾燥工程は、充
填用へら（図示路）を用いてこの凹部４の縁に沿って凹
部４と面一、かつ平滑に抵抗ペースト５を充填塗布、乾
燥した状態を、
第１図（ｄ）の抵抗ペースト焼成工程は、有機レジスト
３を焼成により剥離除去して厚膜抵抗体６を完成した状
態を示している。FIG. 1 is a side sectional view showing the method according to the present invention in the order of steps. In the conductor printing step of FIG.
Figure 1 (bl resist printing and drying process shows the thick film conductor 2
The state in which a recess 4 for filling the resistance paste is formed with the organic resist 3 between the thick film conductors 2 including the overlapping portions is carried out using a filling spatula (the path shown in the figure) for the filling and drying process of the resistance paste shown in FIG. 1(C). The resistor paste 5 is filled and applied along the edge of the recess 4 flush with the recess 4 and smoothly using a drying method.The resistor paste baking process shown in FIG. The state in which the thick film resistor 6 is completed by peeling and removal is shown.
上記凹部４は、抵抗ペーストの充填用型、兼マスクの作
用を果たし、凹部４の縁をガイドにして平滑な厚膜抵抗
体６を形成できる。The recess 4 functions as a mold for filling resistor paste and also as a mask, and a smooth thick film resistor 6 can be formed using the edge of the recess 4 as a guide.
以上、説明したように本発明によれば、レーザトリミン
グにおいても厚膜抵抗体の表面が平滑なため、マイクロ
クランクが発生しにくく、トリミング性が向上するとい
った実用上極めて有用な効果を発揮する。As described above, according to the present invention, since the surface of the thick film resistor is smooth even in laser trimming, micro-cranks are less likely to occur and the trimming performance is improved, which is extremely useful in practice.
第１図（ａ）、 （ｂ）、 （Ｃ１，ｆｄ）は本発明に
よる一実施例の工程順を示す側断面図、
第２図（ａｌ、 （ｂｌ、 （Ｃ）は従来技術による工
程順を示す側断面図である。
第３図は第２図（Ｃ１のＡ−Ａ断面図である。
図において、
１は基板、
２は厚膜導体、
３は有機レジスト、
４は凹部、
５は１氏抗ペースト、
導体印刷工程
（ａｌ
レジスト印刷・乾燥工程
山）
抵抗ペースト印刷・乾燥工程
（Ｃ）
抵抗ペースト焼成工程
（ｄ）
本発明による一実施例の工程順を示す側断面図第 １
図Fig. 1 (a), (b), (C1, fd) are side sectional views showing the process order of an embodiment according to the present invention, Fig. 2 (al, (bl), (C) are the process order according to the prior art FIG. 3 is a sectional view taken along the line A-A in FIG. 1 Resistance paste, conductor printing process (al resist printing/drying process) Resistance paste printing/drying process (C) Resistance paste firing process (d) Side sectional view No. 1 showing the process order of an embodiment according to the present invention
figure
Claims (1)
の形成方法において、抵抗ペースト（５）の充填塗布工
程前に、予め、上記厚膜導体と重なる部分を含む上記厚
膜導体間に、有機レジスト（３）を用いて上記抵抗ペー
スト（５）充填用凹部（４）を形成する工程を含むこと
を特徴とする厚膜抵抗体の形成方法。In a method for forming a thick film resistor that connects thick film conductors formed on a substrate, before the filling and coating step of the resistor paste (5), a portion between the thick film conductors including the portion overlapping with the thick film conductor is preliminarily formed. A method for forming a thick film resistor, comprising the step of forming a recess (4) for filling the resistor paste (5) using an organic resist (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62031081A JPS63197304A (en) | 1987-02-12 | 1987-02-12 | Method of forming thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62031081A JPS63197304A (en) | 1987-02-12 | 1987-02-12 | Method of forming thick film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197304A true JPS63197304A (en) | 1988-08-16 |
Family
ID=12321470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62031081A Pending JPS63197304A (en) | 1987-02-12 | 1987-02-12 | Method of forming thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197304A (en) |
-
1987
- 1987-02-12 JP JP62031081A patent/JPS63197304A/en active Pending
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