JPS63195730U - - Google Patents
Info
- Publication number
- JPS63195730U JPS63195730U JP1987087430U JP8743087U JPS63195730U JP S63195730 U JPS63195730 U JP S63195730U JP 1987087430 U JP1987087430 U JP 1987087430U JP 8743087 U JP8743087 U JP 8743087U JP S63195730 U JPS63195730 U JP S63195730U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- horn
- wire
- wedge
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
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- H10W72/07141—
-
- H10W72/07168—
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- H10W72/075—
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- H10W72/07502—
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- H10W72/07521—
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- H10W72/5363—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087430U JPH0617291Y2 (ja) | 1987-06-05 | 1987-06-05 | ワイヤ−ボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087430U JPH0617291Y2 (ja) | 1987-06-05 | 1987-06-05 | ワイヤ−ボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195730U true JPS63195730U (enExample) | 1988-12-16 |
| JPH0617291Y2 JPH0617291Y2 (ja) | 1994-05-02 |
Family
ID=30944635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987087430U Expired - Lifetime JPH0617291Y2 (ja) | 1987-06-05 | 1987-06-05 | ワイヤ−ボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617291Y2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
| US7285195B2 (en) | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050931A (ja) * | 1983-08-31 | 1985-03-22 | Hitachi Ltd | 垂直フィ−ド型ワイヤボンダ |
| JPS63127542A (ja) * | 1986-11-18 | 1988-05-31 | Toshiba Corp | ワイヤボンデイング装置 |
-
1987
- 1987-06-05 JP JP1987087430U patent/JPH0617291Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050931A (ja) * | 1983-08-31 | 1985-03-22 | Hitachi Ltd | 垂直フィ−ド型ワイヤボンダ |
| JPS63127542A (ja) * | 1986-11-18 | 1988-05-31 | Toshiba Corp | ワイヤボンデイング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0617291Y2 (ja) | 1994-05-02 |