JPS63195730U - - Google Patents

Info

Publication number
JPS63195730U
JPS63195730U JP1987087430U JP8743087U JPS63195730U JP S63195730 U JPS63195730 U JP S63195730U JP 1987087430 U JP1987087430 U JP 1987087430U JP 8743087 U JP8743087 U JP 8743087U JP S63195730 U JPS63195730 U JP S63195730U
Authority
JP
Japan
Prior art keywords
bonding
horn
wire
wedge
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987087430U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0617291Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987087430U priority Critical patent/JPH0617291Y2/ja
Publication of JPS63195730U publication Critical patent/JPS63195730U/ja
Application granted granted Critical
Publication of JPH0617291Y2 publication Critical patent/JPH0617291Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP1987087430U 1987-06-05 1987-06-05 ワイヤ−ボンディング装置 Expired - Lifetime JPH0617291Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987087430U JPH0617291Y2 (ja) 1987-06-05 1987-06-05 ワイヤ−ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987087430U JPH0617291Y2 (ja) 1987-06-05 1987-06-05 ワイヤ−ボンディング装置

Publications (2)

Publication Number Publication Date
JPS63195730U true JPS63195730U (enExample) 1988-12-16
JPH0617291Y2 JPH0617291Y2 (ja) 1994-05-02

Family

ID=30944635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987087430U Expired - Lifetime JPH0617291Y2 (ja) 1987-06-05 1987-06-05 ワイヤ−ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0617291Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US7285195B2 (en) 2004-06-24 2007-10-23 Applied Materials, Inc. Electric field reducing thrust plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050931A (ja) * 1983-08-31 1985-03-22 Hitachi Ltd 垂直フィ−ド型ワイヤボンダ
JPS63127542A (ja) * 1986-11-18 1988-05-31 Toshiba Corp ワイヤボンデイング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050931A (ja) * 1983-08-31 1985-03-22 Hitachi Ltd 垂直フィ−ド型ワイヤボンダ
JPS63127542A (ja) * 1986-11-18 1988-05-31 Toshiba Corp ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPH0617291Y2 (ja) 1994-05-02

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