JPH0249134U - - Google Patents

Info

Publication number
JPH0249134U
JPH0249134U JP1988127477U JP12747788U JPH0249134U JP H0249134 U JPH0249134 U JP H0249134U JP 1988127477 U JP1988127477 U JP 1988127477U JP 12747788 U JP12747788 U JP 12747788U JP H0249134 U JPH0249134 U JP H0249134U
Authority
JP
Japan
Prior art keywords
wire
bonded
thin metal
bonding tool
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988127477U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988127477U priority Critical patent/JPH0249134U/ja
Publication of JPH0249134U publication Critical patent/JPH0249134U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141
    • H10W72/075
    • H10W72/07521
    • H10W72/5363
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1988127477U 1988-09-28 1988-09-28 Pending JPH0249134U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988127477U JPH0249134U (enExample) 1988-09-28 1988-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988127477U JPH0249134U (enExample) 1988-09-28 1988-09-28

Publications (1)

Publication Number Publication Date
JPH0249134U true JPH0249134U (enExample) 1990-04-05

Family

ID=31379948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988127477U Pending JPH0249134U (enExample) 1988-09-28 1988-09-28

Country Status (1)

Country Link
JP (1) JPH0249134U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226428A (ja) * 1992-02-13 1993-09-03 Kaijo Corp ワイヤボンディング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226428A (ja) * 1992-02-13 1993-09-03 Kaijo Corp ワイヤボンディング方法

Similar Documents

Publication Publication Date Title
JPH0249134U (enExample)
JPH01121929U (enExample)
JP2703999B2 (ja) 半導体製造装置
JPH0224548U (enExample)
JPH0316337U (enExample)
JPH0390444U (enExample)
JPH0186245U (enExample)
JPS63195730U (enExample)
JPS6350130U (enExample)
JPH0328731U (enExample)
JPH02146439U (enExample)
JPH03101530U (enExample)
JPH0313754U (enExample)
JPH0415838U (enExample)
JPH024258U (enExample)
JPH0245646U (enExample)
JPS6315045U (enExample)
JPS636736U (enExample)
JPS60158737U (ja) ボンデイングウエツジ
JPH0444595U (enExample)
JPH0316338U (enExample)
JPH0238164U (enExample)
JPH02140847U (enExample)
JPH02138453U (enExample)
JPH01161332U (enExample)