JPH0390444U - - Google Patents
Info
- Publication number
- JPH0390444U JPH0390444U JP1989152159U JP15215989U JPH0390444U JP H0390444 U JPH0390444 U JP H0390444U JP 1989152159 U JP1989152159 U JP 1989152159U JP 15215989 U JP15215989 U JP 15215989U JP H0390444 U JPH0390444 U JP H0390444U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wire
- semiconductor pellet
- lead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W72/07141—
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- H10W72/07178—
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- H10W72/075—
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- H10W72/5363—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152159U JPH0390444U (enExample) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989152159U JPH0390444U (enExample) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390444U true JPH0390444U (enExample) | 1991-09-13 |
Family
ID=31698434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989152159U Pending JPH0390444U (enExample) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390444U (enExample) |
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1989
- 1989-12-28 JP JP1989152159U patent/JPH0390444U/ja active Pending