JPS6196542U - - Google Patents
Info
- Publication number
- JPS6196542U JPS6196542U JP1984182173U JP18217384U JPS6196542U JP S6196542 U JPS6196542 U JP S6196542U JP 1984182173 U JP1984182173 U JP 1984182173U JP 18217384 U JP18217384 U JP 18217384U JP S6196542 U JPS6196542 U JP S6196542U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- large number
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984182173U JPS6196542U (enExample) | 1984-11-29 | 1984-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984182173U JPS6196542U (enExample) | 1984-11-29 | 1984-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196542U true JPS6196542U (enExample) | 1986-06-21 |
Family
ID=30739709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984182173U Pending JPS6196542U (enExample) | 1984-11-29 | 1984-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196542U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008771A (ja) * | 2011-06-23 | 2013-01-10 | Nissan Motor Co Ltd | 半導体モジュール |
| JP2014197634A (ja) * | 2013-03-29 | 2014-10-16 | 新電元工業株式会社 | リードフレーム、半導体装置及びその製造方法 |
| JP2017152518A (ja) * | 2016-02-24 | 2017-08-31 | 新電元工業株式会社 | 半導体装置、載置台及び半導体装置の製造方法 |
| JP2024136863A (ja) * | 2023-03-24 | 2024-10-04 | 株式会社東芝 | 半導体装置 |
-
1984
- 1984-11-29 JP JP1984182173U patent/JPS6196542U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008771A (ja) * | 2011-06-23 | 2013-01-10 | Nissan Motor Co Ltd | 半導体モジュール |
| JP2014197634A (ja) * | 2013-03-29 | 2014-10-16 | 新電元工業株式会社 | リードフレーム、半導体装置及びその製造方法 |
| JP2017152518A (ja) * | 2016-02-24 | 2017-08-31 | 新電元工業株式会社 | 半導体装置、載置台及び半導体装置の製造方法 |
| JP2024136863A (ja) * | 2023-03-24 | 2024-10-04 | 株式会社東芝 | 半導体装置 |