JPH0186245U - - Google Patents
Info
- Publication number
- JPH0186245U JPH0186245U JP1987181845U JP18184587U JPH0186245U JP H0186245 U JPH0186245 U JP H0186245U JP 1987181845 U JP1987181845 U JP 1987181845U JP 18184587 U JP18184587 U JP 18184587U JP H0186245 U JPH0186245 U JP H0186245U
- Authority
- JP
- Japan
- Prior art keywords
- metal wire
- thin metal
- wire
- wedge
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/075—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181845U JPH0186245U (enExample) | 1987-11-28 | 1987-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181845U JPH0186245U (enExample) | 1987-11-28 | 1987-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186245U true JPH0186245U (enExample) | 1989-06-07 |
Family
ID=31473313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181845U Pending JPH0186245U (enExample) | 1987-11-28 | 1987-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186245U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013135008A (ja) * | 2011-12-26 | 2013-07-08 | Fuji Electric Co Ltd | ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法 |
-
1987
- 1987-11-28 JP JP1987181845U patent/JPH0186245U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013135008A (ja) * | 2011-12-26 | 2013-07-08 | Fuji Electric Co Ltd | ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法 |
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