JPS63193981A - ウエハ貼着用粘着シ−ト - Google Patents

ウエハ貼着用粘着シ−ト

Info

Publication number
JPS63193981A
JPS63193981A JP62026017A JP2601787A JPS63193981A JP S63193981 A JPS63193981 A JP S63193981A JP 62026017 A JP62026017 A JP 62026017A JP 2601787 A JP2601787 A JP 2601787A JP S63193981 A JPS63193981 A JP S63193981A
Authority
JP
Japan
Prior art keywords
pressure
sensitive adhesive
compound
radiation
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62026017A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0251948B2 (https=
Inventor
Kazuyoshi Ebe
和義 江部
Hiroaki Narita
博昭 成田
Katsuhisa Taguchi
田口　克久
Yoshitaka Akeda
明田　好孝
Takanori Saito
斉藤　隆則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
F S K KK
FSK Corp
Original Assignee
F S K KK
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by F S K KK, FSK Corp filed Critical F S K KK
Priority to JP62026017A priority Critical patent/JPS63193981A/ja
Publication of JPS63193981A publication Critical patent/JPS63193981A/ja
Publication of JPH0251948B2 publication Critical patent/JPH0251948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP62026017A 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト Granted JPS63193981A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62026017A JPS63193981A (ja) 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62026017A JPS63193981A (ja) 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS63193981A true JPS63193981A (ja) 1988-08-11
JPH0251948B2 JPH0251948B2 (https=) 1990-11-09

Family

ID=12181927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62026017A Granted JPS63193981A (ja) 1987-02-06 1987-02-06 ウエハ貼着用粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS63193981A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01249879A (ja) * 1988-03-31 1989-10-05 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
JPH0366772A (ja) * 1989-08-05 1991-03-22 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
JPH0786212A (ja) * 1993-07-27 1995-03-31 Lintec Corp ウェハ貼着用粘着シート
JP2011077235A (ja) * 2009-09-30 2011-04-14 Nitto Denko Corp 素子保持用粘着シートおよび素子の製造方法
CN115512911A (zh) * 2022-08-23 2022-12-23 岳阳耀宁新能源科技有限公司 一种方形电池绝缘涂层的喷涂工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750261U (https=) * 1980-09-05 1982-03-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5750261U (https=) * 1980-09-05 1982-03-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01249879A (ja) * 1988-03-31 1989-10-05 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
JPH0366772A (ja) * 1989-08-05 1991-03-22 Furukawa Electric Co Ltd:The 放射線硬化性粘着テープ
JPH0786212A (ja) * 1993-07-27 1995-03-31 Lintec Corp ウェハ貼着用粘着シート
JP2011077235A (ja) * 2009-09-30 2011-04-14 Nitto Denko Corp 素子保持用粘着シートおよび素子の製造方法
CN115512911A (zh) * 2022-08-23 2022-12-23 岳阳耀宁新能源科技有限公司 一种方形电池绝缘涂层的喷涂工艺

Also Published As

Publication number Publication date
JPH0251948B2 (https=) 1990-11-09

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