JPS63191628U - - Google Patents
Info
- Publication number
- JPS63191628U JPS63191628U JP1988059305U JP5930588U JPS63191628U JP S63191628 U JPS63191628 U JP S63191628U JP 1988059305 U JP1988059305 U JP 1988059305U JP 5930588 U JP5930588 U JP 5930588U JP S63191628 U JPS63191628 U JP S63191628U
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- chamber
- plasma etching
- photoresist
- indicative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001020 plasma etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
- G01N21/76—Chemiluminescence; Bioluminescence
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Drying Of Semiconductors (AREA)
Description
第1図は本考案の制御システムの一実施例の図
、第2図はプラズマの光度対時間特性を例示する
図である。第3図A,B,C,D,Eは本考案を
説明するためのプラズマエツチングプロセスを示
す。 11……チヤンバ、12〜15……電極、16
……ウエーハ、18……フオトセル、19……電
流/電圧変換回路、21……記録計、22……電
圧計、23……制御回路、24……R.F.発生
回路。
、第2図はプラズマの光度対時間特性を例示する
図である。第3図A,B,C,D,Eは本考案を
説明するためのプラズマエツチングプロセスを示
す。 11……チヤンバ、12〜15……電極、16
……ウエーハ、18……フオトセル、19……電
流/電圧変換回路、21……記録計、22……電
圧計、23……制御回路、24……R.F.発生
回路。
Claims (1)
- 【実用新案登録請求の範囲】 エツチヤントガス及びエツチすべき物質を収容
する排気可能なチヤンバ及び該チヤンバ内部に結
合してプラズマを維持する無線周波数エネルギー
源を有するプラズマエツチングを介してフオトレ
ジストを生成する装置において、 前記チヤンバ内部に光学的に結合して前記プラ
ズマの光度を示す種々のレベルの出力信号を発生
するフオトデテクタ手段、及び、 生成されるフオトレジストを示す前記出力信号
のレベル中の一時的な平坦特性を検出する検出手
段、 を具えたことを特徴とするプラズマエツチング
装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/000,472 US4246060A (en) | 1979-01-02 | 1979-01-02 | Plasma development process controller |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63191628U true JPS63191628U (ja) | 1988-12-09 |
Family
ID=21691658
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16805979A Pending JPS5591829A (en) | 1979-01-02 | 1979-12-24 | Plasma producing process controller |
JP1988059305U Pending JPS63191628U (ja) | 1979-01-02 | 1988-04-30 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16805979A Pending JPS5591829A (en) | 1979-01-02 | 1979-12-24 | Plasma producing process controller |
Country Status (4)
Country | Link |
---|---|
US (1) | US4246060A (ja) |
EP (1) | EP0013483B1 (ja) |
JP (2) | JPS5591829A (ja) |
DE (1) | DE2967121D1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55157233A (en) * | 1979-05-28 | 1980-12-06 | Hitachi Ltd | Method and apparatus for monitoring etching |
US4377436A (en) * | 1980-05-13 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Plasma-assisted etch process with endpoint detection |
FR2487574A1 (fr) * | 1980-07-24 | 1982-01-29 | Efcis | Procede et dispositif d'attaque sous plasma d'une couche mince |
US4394237A (en) * | 1981-07-17 | 1983-07-19 | Bell Telephone Laboratories, Incorporated | Spectroscopic monitoring of gas-solid processes |
US4529860A (en) * | 1982-08-02 | 1985-07-16 | Motorola, Inc. | Plasma etching of organic materials |
US4482424A (en) * | 1983-05-06 | 1984-11-13 | At&T Bell Laboratories | Method for monitoring etching of resists by monitoring the flouresence of the unetched material |
US4496448A (en) * | 1983-10-13 | 1985-01-29 | At&T Bell Laboratories | Method for fabricating devices with DC bias-controlled reactive ion etching |
US4943336A (en) * | 1988-08-18 | 1990-07-24 | Ernest Csont | Apparatus and method for fabricating composite panels for use in concrete buildings |
JP3093215B2 (ja) * | 1989-06-20 | 2000-10-03 | 東京エレクトロン株式会社 | 現像方法および現像装置 |
EP0662241A1 (en) * | 1993-04-28 | 1995-07-12 | Applied Materials, Inc. | Method and apparatus for etchback endpoint detection |
KR100257811B1 (ko) * | 1997-10-24 | 2000-06-01 | 구본준 | 액정표시장치의 기판의 제조방법 |
TW524888B (en) * | 2000-02-01 | 2003-03-21 | Winbond Electronics Corp | Optical temperature measurement as an in-situ monitor of etch rate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5135639A (ja) * | 1974-09-20 | 1976-03-26 | Hitachi Ltd | Himakunopurazumaetsuchingushorishutenkenshutsuho |
JPS5188181A (ja) * | 1975-01-20 | 1976-08-02 | ||
JPS5326674A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Plasma etching |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3664942A (en) * | 1970-12-31 | 1972-05-23 | Ibm | End point detection method and apparatus for sputter etching |
DE2603675A1 (de) * | 1976-01-31 | 1977-08-04 | Leybold Heraeus Gmbh & Co Kg | Verfahren zur kontrolle des abtragens einer duennen schicht oder durch masken bestimmter schichtbereiche mit hilfe des ionen-aetzens |
DE2651187A1 (de) * | 1976-11-10 | 1978-05-18 | Kuhlmann Schaefer Wilhelm | Verfahren und vorrichtung zum abtragen von schichten |
-
1979
- 1979-01-02 US US06/000,472 patent/US4246060A/en not_active Expired - Lifetime
- 1979-12-04 EP EP79302778A patent/EP0013483B1/en not_active Expired
- 1979-12-04 DE DE7979302778T patent/DE2967121D1/de not_active Expired
- 1979-12-24 JP JP16805979A patent/JPS5591829A/ja active Pending
-
1988
- 1988-04-30 JP JP1988059305U patent/JPS63191628U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5135639A (ja) * | 1974-09-20 | 1976-03-26 | Hitachi Ltd | Himakunopurazumaetsuchingushorishutenkenshutsuho |
JPS5188181A (ja) * | 1975-01-20 | 1976-08-02 | ||
JPS5326674A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Plasma etching |
Also Published As
Publication number | Publication date |
---|---|
JPS5591829A (en) | 1980-07-11 |
US4246060A (en) | 1981-01-20 |
EP0013483B1 (en) | 1984-07-18 |
EP0013483A1 (en) | 1980-07-23 |
DE2967121D1 (en) | 1984-08-23 |
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