JPS63187354U - - Google Patents
Info
- Publication number
- JPS63187354U JPS63187354U JP7815087U JP7815087U JPS63187354U JP S63187354 U JPS63187354 U JP S63187354U JP 7815087 U JP7815087 U JP 7815087U JP 7815087 U JP7815087 U JP 7815087U JP S63187354 U JPS63187354 U JP S63187354U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- chip package
- package
- pins
- terminal pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7815087U JPS63187354U (xx) | 1987-05-26 | 1987-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7815087U JPS63187354U (xx) | 1987-05-26 | 1987-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63187354U true JPS63187354U (xx) | 1988-11-30 |
Family
ID=30926827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7815087U Pending JPS63187354U (xx) | 1987-05-26 | 1987-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63187354U (xx) |
-
1987
- 1987-05-26 JP JP7815087U patent/JPS63187354U/ja active Pending
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