JPS63182543U - - Google Patents
Info
- Publication number
- JPS63182543U JPS63182543U JP7509687U JP7509687U JPS63182543U JP S63182543 U JPS63182543 U JP S63182543U JP 7509687 U JP7509687 U JP 7509687U JP 7509687 U JP7509687 U JP 7509687U JP S63182543 U JPS63182543 U JP S63182543U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- semiconductor devices
- lead
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7509687U JPS63182543U (enExample) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7509687U JPS63182543U (enExample) | 1987-05-18 | 1987-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182543U true JPS63182543U (enExample) | 1988-11-24 |
Family
ID=30920921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7509687U Pending JPS63182543U (enExample) | 1987-05-18 | 1987-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182543U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04102364A (ja) * | 1990-08-22 | 1992-04-03 | Sharp Corp | 半導体装置の製造装置 |
| JP2009038109A (ja) * | 2007-07-31 | 2009-02-19 | Mitsui High Tec Inc | リードフレーム連続体及びリードフレームの製造方法 |
-
1987
- 1987-05-18 JP JP7509687U patent/JPS63182543U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04102364A (ja) * | 1990-08-22 | 1992-04-03 | Sharp Corp | 半導体装置の製造装置 |
| JP2009038109A (ja) * | 2007-07-31 | 2009-02-19 | Mitsui High Tec Inc | リードフレーム連続体及びリードフレームの製造方法 |