JPS63179151U - - Google Patents
Info
- Publication number
- JPS63179151U JPS63179151U JP6886987U JP6886987U JPS63179151U JP S63179151 U JPS63179151 U JP S63179151U JP 6886987 U JP6886987 U JP 6886987U JP 6886987 U JP6886987 U JP 6886987U JP S63179151 U JPS63179151 U JP S63179151U
- Authority
- JP
- Japan
- Prior art keywords
- cut portion
- conductive film
- anisotropic conductive
- wiring layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000012775 heat-sealing material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Description
第１図はこの考案の一実施例の異方性導電フイ
ルムによる接続実装の構造図、ａはその平面図で
あり、ｂはその断面図、第２図は異方性導電フイ
ルムの構造図、第３図は等価回路図、第４図は本
考案の一実施例の回路構成全体の構造図で、ａは
その平面図、ｂはその断面図である。
１……金属配線層、２……切断部、３……異方
性導電フイルム、４……電気伝導部、５……熱融
着材部、６……フイルム基材、７……回路基板。
Fig. 1 is a structural diagram of connection mounting using an anisotropic conductive film according to an embodiment of this invention, a is a plan view thereof, b is a sectional view thereof, and Fig. 2 is a structural diagram of an anisotropic conductive film. FIG. 3 is an equivalent circuit diagram, and FIG. 4 is a structural diagram of the entire circuit configuration of an embodiment of the present invention, in which a is a plan view thereof and b is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Metal wiring layer, 2... Cutting part, 3... Anisotropic conductive film, 4... Electric conduction part, 5... Heat sealing material part, 6... Film base material, 7... Circuit board .
Claims (1)
設け、該切断部を異方性導電フイルムにより接続
実装したことを特徴とするＩＣカード。 An IC card characterized in that a cut portion is provided in a metal wiring layer provided on a circuit board, and the cut portion is connected and mounted using an anisotropic conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987068869U JPH0620631Y2 (en) | 1987-05-11 | 1987-05-11 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987068869U JPH0620631Y2 (en) | 1987-05-11 | 1987-05-11 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63179151U true JPS63179151U (en) | 1988-11-21 |
| JPH0620631Y2 JPH0620631Y2 (en) | 1994-06-01 |
Family
ID=30909081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987068869U Expired - Lifetime JPH0620631Y2 (en) | 1987-05-11 | 1987-05-11 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0620631Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107595A (en) * | 1986-10-24 | 1988-05-12 | 株式会社東芝 | Card module |
-
1987
- 1987-05-11 JP JP1987068869U patent/JPH0620631Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107595A (en) * | 1986-10-24 | 1988-05-12 | 株式会社東芝 | Card module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0620631Y2 (en) | 1994-06-01 |
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