JPS6317906B2 - - Google Patents
Info
- Publication number
- JPS6317906B2 JPS6317906B2 JP16239079A JP16239079A JPS6317906B2 JP S6317906 B2 JPS6317906 B2 JP S6317906B2 JP 16239079 A JP16239079 A JP 16239079A JP 16239079 A JP16239079 A JP 16239079A JP S6317906 B2 JPS6317906 B2 JP S6317906B2
- Authority
- JP
- Japan
- Prior art keywords
- reducing agent
- plating bath
- metal ion
- plating
- ion source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 36
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims description 22
- 229910021645 metal ion Inorganic materials 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 17
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 239000003638 chemical reducing agent Substances 0.000 claims description 12
- 238000007772 electroless plating Methods 0.000 claims description 12
- 238000001556 precipitation Methods 0.000 claims description 9
- 239000008139 complexing agent Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 5
- 239000003002 pH adjusting agent Substances 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 2
- 150000004692 metal hydroxides Chemical class 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 238000007086 side reaction Methods 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 239000000243 solution Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 7
- 229910001431 copper ion Inorganic materials 0.000 description 7
- -1 copper complex ions Chemical class 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000009918 complex formation Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004280 Sodium formate Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007793 ph indicator Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
- 235000019254 sodium formate Nutrition 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16239079A JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16239079A JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5684458A JPS5684458A (en) | 1981-07-09 |
| JPS6317906B2 true JPS6317906B2 (de) | 1988-04-15 |
Family
ID=15753665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16239079A Granted JPS5684458A (en) | 1979-12-14 | 1979-12-14 | Nonelectrolytic plating bath composition and continuous plating therewith |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5684458A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408916B (zh) * | 2019-08-26 | 2021-08-17 | 惠州市安泰普表面处理科技有限公司 | 化学镀镍方法 |
-
1979
- 1979-12-14 JP JP16239079A patent/JPS5684458A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5684458A (en) | 1981-07-09 |
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