JPS631756B2 - - Google Patents

Info

Publication number
JPS631756B2
JPS631756B2 JP55093613A JP9361380A JPS631756B2 JP S631756 B2 JPS631756 B2 JP S631756B2 JP 55093613 A JP55093613 A JP 55093613A JP 9361380 A JP9361380 A JP 9361380A JP S631756 B2 JPS631756 B2 JP S631756B2
Authority
JP
Japan
Prior art keywords
semiconductor element
inner lid
container
semiconductor
metallized wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55093613A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5718340A (en
Inventor
Tetsushi Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9361380A priority Critical patent/JPS5718340A/ja
Publication of JPS5718340A publication Critical patent/JPS5718340A/ja
Publication of JPS631756B2 publication Critical patent/JPS631756B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/25
    • H10W70/682
    • H10W72/07551
    • H10W72/50
    • H10W72/5363
    • H10W72/884
    • H10W90/754

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9361380A 1980-07-09 1980-07-09 Semiconductor device Granted JPS5718340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9361380A JPS5718340A (en) 1980-07-09 1980-07-09 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9361380A JPS5718340A (en) 1980-07-09 1980-07-09 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5718340A JPS5718340A (en) 1982-01-30
JPS631756B2 true JPS631756B2 (enExample) 1988-01-13

Family

ID=14087173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9361380A Granted JPS5718340A (en) 1980-07-09 1980-07-09 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5718340A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
US6611054B1 (en) * 1993-12-22 2003-08-26 Honeywell Inc. IC package lid for dose enhancement protection

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637655A (en) * 1979-09-03 1981-04-11 Mitsubishi Electric Corp Semiconductor memory device
JPS56162650U (enExample) * 1980-04-30 1981-12-03

Also Published As

Publication number Publication date
JPS5718340A (en) 1982-01-30

Similar Documents

Publication Publication Date Title
US5635754A (en) Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US7148084B2 (en) Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6262362B1 (en) Radiation shielding of three dimensional multi-chip modules
US4541003A (en) Semiconductor device including an alpha-particle shield
US20020050371A1 (en) Radiation shielding of three dimensional multi-chip modules
US4044374A (en) Semiconductor device header suitable for vacuum tube applications
US4580157A (en) Semiconductor device having a soft-error preventing structure
JPS628032B2 (enExample)
JPH0117257B2 (enExample)
JPS62125651A (ja) 耐放射線パツケ−ジ
JPS631756B2 (enExample)
US6650003B1 (en) Radiation shielded carriers for sensitive electronics
KR950009625B1 (ko) 유리봉지형 세라믹 패키지
JPS631755B2 (enExample)
US5264726A (en) Chip-carrier
JPS6157704B2 (enExample)
US7115812B2 (en) Radiation shielded semiconductor package
JPS5942983B2 (ja) 半導体装置
JP3229176B2 (ja) 耐放射線用パッケージ
JPS58110069A (ja) 集積回路に電気的接続を与える装置及び方法
US6452263B1 (en) Radiation shield and radiation shielded integrated circuit device
JPS6138861B2 (enExample)
CA2021682C (en) Chip-carrier with alpha ray shield
JPS6028139Y2 (ja) 半導体装置
JPS5817642A (ja) 半導体デバイス用保護装置