JPS631756B2 - - Google Patents
Info
- Publication number
- JPS631756B2 JPS631756B2 JP55093613A JP9361380A JPS631756B2 JP S631756 B2 JPS631756 B2 JP S631756B2 JP 55093613 A JP55093613 A JP 55093613A JP 9361380 A JP9361380 A JP 9361380A JP S631756 B2 JPS631756 B2 JP S631756B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- inner lid
- container
- semiconductor
- metallized wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W42/25—
-
- H10W70/682—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9361380A JPS5718340A (en) | 1980-07-09 | 1980-07-09 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9361380A JPS5718340A (en) | 1980-07-09 | 1980-07-09 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5718340A JPS5718340A (en) | 1982-01-30 |
| JPS631756B2 true JPS631756B2 (enExample) | 1988-01-13 |
Family
ID=14087173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9361380A Granted JPS5718340A (en) | 1980-07-09 | 1980-07-09 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5718340A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2854757B2 (ja) * | 1992-06-17 | 1999-02-03 | 三菱電機株式会社 | 半導体パワーモジュール |
| US6611054B1 (en) * | 1993-12-22 | 2003-08-26 | Honeywell Inc. | IC package lid for dose enhancement protection |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5637655A (en) * | 1979-09-03 | 1981-04-11 | Mitsubishi Electric Corp | Semiconductor memory device |
| JPS56162650U (enExample) * | 1980-04-30 | 1981-12-03 |
-
1980
- 1980-07-09 JP JP9361380A patent/JPS5718340A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5718340A (en) | 1982-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5635754A (en) | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages | |
| US7148084B2 (en) | Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages | |
| US6262362B1 (en) | Radiation shielding of three dimensional multi-chip modules | |
| US4541003A (en) | Semiconductor device including an alpha-particle shield | |
| US20020050371A1 (en) | Radiation shielding of three dimensional multi-chip modules | |
| US4044374A (en) | Semiconductor device header suitable for vacuum tube applications | |
| US4580157A (en) | Semiconductor device having a soft-error preventing structure | |
| JPS628032B2 (enExample) | ||
| JPH0117257B2 (enExample) | ||
| JPS62125651A (ja) | 耐放射線パツケ−ジ | |
| JPS631756B2 (enExample) | ||
| US6650003B1 (en) | Radiation shielded carriers for sensitive electronics | |
| KR950009625B1 (ko) | 유리봉지형 세라믹 패키지 | |
| JPS631755B2 (enExample) | ||
| US5264726A (en) | Chip-carrier | |
| JPS6157704B2 (enExample) | ||
| US7115812B2 (en) | Radiation shielded semiconductor package | |
| JPS5942983B2 (ja) | 半導体装置 | |
| JP3229176B2 (ja) | 耐放射線用パッケージ | |
| JPS58110069A (ja) | 集積回路に電気的接続を与える装置及び方法 | |
| US6452263B1 (en) | Radiation shield and radiation shielded integrated circuit device | |
| JPS6138861B2 (enExample) | ||
| CA2021682C (en) | Chip-carrier with alpha ray shield | |
| JPS6028139Y2 (ja) | 半導体装置 | |
| JPS5817642A (ja) | 半導体デバイス用保護装置 |