JPH0117257B2 - - Google Patents

Info

Publication number
JPH0117257B2
JPH0117257B2 JP58213250A JP21325083A JPH0117257B2 JP H0117257 B2 JPH0117257 B2 JP H0117257B2 JP 58213250 A JP58213250 A JP 58213250A JP 21325083 A JP21325083 A JP 21325083A JP H0117257 B2 JPH0117257 B2 JP H0117257B2
Authority
JP
Japan
Prior art keywords
package
integrated circuit
radiation
metal shield
shield plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58213250A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60106150A (ja
Inventor
Noboru Shiono
Shoichi Shimaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58213250A priority Critical patent/JPS60106150A/ja
Publication of JPS60106150A publication Critical patent/JPS60106150A/ja
Publication of JPH0117257B2 publication Critical patent/JPH0117257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/20
    • H10W70/682
    • H10W72/07551
    • H10W72/50
    • H10W76/17
    • H10W90/754

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP58213250A 1983-11-15 1983-11-15 耐放射線パツケ−ジ Granted JPS60106150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58213250A JPS60106150A (ja) 1983-11-15 1983-11-15 耐放射線パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58213250A JPS60106150A (ja) 1983-11-15 1983-11-15 耐放射線パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60106150A JPS60106150A (ja) 1985-06-11
JPH0117257B2 true JPH0117257B2 (enExample) 1989-03-29

Family

ID=16635988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58213250A Granted JPS60106150A (ja) 1983-11-15 1983-11-15 耐放射線パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60106150A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5635754A (en) * 1994-04-01 1997-06-03 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
JP4509806B2 (ja) * 2005-01-18 2010-07-21 株式会社日立メディコ Icパッケージ及びそれを用いたx線ct装置
DE102006055340A1 (de) * 2006-11-23 2008-05-29 Siemens Ag Explosionsfester Modulaufbau für Leistungsbauelemente, insbesondere Leistungshalbleiterbauelemente und dessen Herstellung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector
JPS56165341A (en) * 1980-05-23 1981-12-18 Nec Corp Semiconductor device
JPS57196547A (en) * 1981-05-28 1982-12-02 Nec Corp Semiconductor device
JPS5970347U (ja) * 1982-11-02 1984-05-12 ティーディーケイ株式会社 集積回路装置

Also Published As

Publication number Publication date
JPS60106150A (ja) 1985-06-11

Similar Documents

Publication Publication Date Title
US4541003A (en) Semiconductor device including an alpha-particle shield
US5635754A (en) Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5998867A (en) Radiation enhanced chip encapsulant
US7148084B2 (en) Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5679975A (en) Conductive encapsulating shield for an integrated circuit
JPS60180150A (ja) 半導体装置
JPH0117257B2 (enExample)
WO1996022669B1 (en) Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
EP0021643B1 (en) Semiconductor device having a soft-error preventing structure
JPS62125651A (ja) 耐放射線パツケ−ジ
US5150180A (en) Packaged semiconductor device with high energy radiation absorbent glass
JPS614250A (ja) 半導体装置用パツケ−ジ
JPH08330478A (ja) 熱中性子遮蔽体を備えた集積回路
JPS628032B2 (enExample)
EP0029858A1 (en) Semiconductor device
US6121672A (en) Raised pedestal radiation shield for sensitive electronics
JP2689467B2 (ja) 半導体集積回路装置のパッケージ
JPS6157704B2 (enExample)
JP2755360B2 (ja) アルファ粒子遮蔽機能を有する半導体モジュール
JPS5942983B2 (ja) 半導体装置
JP3229176B2 (ja) 耐放射線用パッケージ
US6452263B1 (en) Radiation shield and radiation shielded integrated circuit device
JP2877292B2 (ja) 半導体容器及び半導体装置
JPS631755B2 (enExample)
JPS6028139Y2 (ja) 半導体装置