JPS60106150A - 耐放射線パツケ−ジ - Google Patents

耐放射線パツケ−ジ

Info

Publication number
JPS60106150A
JPS60106150A JP58213250A JP21325083A JPS60106150A JP S60106150 A JPS60106150 A JP S60106150A JP 58213250 A JP58213250 A JP 58213250A JP 21325083 A JP21325083 A JP 21325083A JP S60106150 A JPS60106150 A JP S60106150A
Authority
JP
Japan
Prior art keywords
package
integrated circuit
radiation
metal
metal shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58213250A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0117257B2 (enExample
Inventor
Noboru Shiono
塩野　登
Shoichi Shimaya
嶋屋　正一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58213250A priority Critical patent/JPS60106150A/ja
Publication of JPS60106150A publication Critical patent/JPS60106150A/ja
Publication of JPH0117257B2 publication Critical patent/JPH0117257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/20—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W76/17—
    • H10W90/754—

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP58213250A 1983-11-15 1983-11-15 耐放射線パツケ−ジ Granted JPS60106150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58213250A JPS60106150A (ja) 1983-11-15 1983-11-15 耐放射線パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58213250A JPS60106150A (ja) 1983-11-15 1983-11-15 耐放射線パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60106150A true JPS60106150A (ja) 1985-06-11
JPH0117257B2 JPH0117257B2 (enExample) 1989-03-29

Family

ID=16635988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58213250A Granted JPS60106150A (ja) 1983-11-15 1983-11-15 耐放射線パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60106150A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0803174A4 (en) * 1995-01-13 1999-05-06 Space Electronics Inc RADIATION SHIELDING OF THE INTEGRATED CIRCUITS AND MULTICHIP MODULES IN METAL AND CERAMIC PACKINGS
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
JP2006202791A (ja) * 2005-01-18 2006-08-03 Hitachi Medical Corp Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
JP2010509901A (ja) * 2006-11-23 2010-03-25 シーメンス アクチエンゲゼルシヤフト パワーコンポーネント、殊にパワー半導体コンポーネント用の防爆性モジュール構造およびその製造
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector
JPS56165341A (en) * 1980-05-23 1981-12-18 Nec Corp Semiconductor device
JPS57196547A (en) * 1981-05-28 1982-12-02 Nec Corp Semiconductor device
JPS5970347U (ja) * 1982-11-02 1984-05-12 ティーディーケイ株式会社 集積回路装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643614A (en) * 1979-09-17 1981-04-22 Nippon Telegr & Teleph Corp <Ntt> Production of plug for optical fiber connector
JPS56165341A (en) * 1980-05-23 1981-12-18 Nec Corp Semiconductor device
JPS57196547A (en) * 1981-05-28 1982-12-02 Nec Corp Semiconductor device
JPS5970347U (ja) * 1982-11-02 1984-05-12 ティーディーケイ株式会社 集積回路装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858795B2 (en) 1993-06-18 2005-02-22 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
EP0803174A4 (en) * 1995-01-13 1999-05-06 Space Electronics Inc RADIATION SHIELDING OF THE INTEGRATED CIRCUITS AND MULTICHIP MODULES IN METAL AND CERAMIC PACKINGS
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6963125B2 (en) 2000-03-08 2005-11-08 Sony Corporation Electronic device packaging
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices
JP2006202791A (ja) * 2005-01-18 2006-08-03 Hitachi Medical Corp Ｉｃパッケージ及びそれを用いたｘ線ｃｔ装置
JP2010509901A (ja) * 2006-11-23 2010-03-25 シーメンス アクチエンゲゼルシヤフト パワーコンポーネント、殊にパワー半導体コンポーネント用の防爆性モジュール構造およびその製造
JP4856763B2 (ja) * 2006-11-23 2012-01-18 シーメンス アクチエンゲゼルシヤフト 電気的なパワーコンポーネントを有する防爆性のパワーモジュールおよびその製造方法
US8110927B2 (en) 2006-11-23 2012-02-07 Siemens Aktiengesellschaft Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof

Also Published As

Publication number Publication date
JPH0117257B2 (enExample) 1989-03-29

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