JPS6317336B2 - - Google Patents
Info
- Publication number
- JPS6317336B2 JPS6317336B2 JP57189666A JP18966682A JPS6317336B2 JP S6317336 B2 JPS6317336 B2 JP S6317336B2 JP 57189666 A JP57189666 A JP 57189666A JP 18966682 A JP18966682 A JP 18966682A JP S6317336 B2 JPS6317336 B2 JP S6317336B2
- Authority
- JP
- Japan
- Prior art keywords
- alignment
- semiconductor
- chip
- reference hole
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000005553 drilling Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001444 catalytic combustion detection Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57189666A JPS5978552A (ja) | 1982-10-28 | 1982-10-28 | 半導体受光素子の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57189666A JPS5978552A (ja) | 1982-10-28 | 1982-10-28 | 半導体受光素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5978552A JPS5978552A (ja) | 1984-05-07 |
JPS6317336B2 true JPS6317336B2 (US06252093-20010626-C00008.png) | 1988-04-13 |
Family
ID=16245138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57189666A Granted JPS5978552A (ja) | 1982-10-28 | 1982-10-28 | 半導体受光素子の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5978552A (US06252093-20010626-C00008.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01169029U (US06252093-20010626-C00008.png) * | 1988-05-19 | 1989-11-29 | ||
JPH0611670U (ja) * | 1991-05-14 | 1994-02-15 | 株式会社マテックマツザキ | 鋏の枢着ネジ軸 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56144562A (en) * | 1980-04-11 | 1981-11-10 | Hitachi Ltd | Apparatus for manufacturing base for ceramic package |
-
1982
- 1982-10-28 JP JP57189666A patent/JPS5978552A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56144562A (en) * | 1980-04-11 | 1981-11-10 | Hitachi Ltd | Apparatus for manufacturing base for ceramic package |
Also Published As
Publication number | Publication date |
---|---|
JPS5978552A (ja) | 1984-05-07 |
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