JPS63169731A - Tool holding mechanism for bonder - Google Patents

Tool holding mechanism for bonder

Info

Publication number
JPS63169731A
JPS63169731A JP212487A JP212487A JPS63169731A JP S63169731 A JPS63169731 A JP S63169731A JP 212487 A JP212487 A JP 212487A JP 212487 A JP212487 A JP 212487A JP S63169731 A JPS63169731 A JP S63169731A
Authority
JP
Japan
Prior art keywords
tool
tool holder
section
fixed
bonding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP212487A
Other languages
Japanese (ja)
Inventor
Yasunobu Suzuki
鈴木 安信
Motohiko Kato
元彦 加藤
Hisao Ishida
久雄 石田
Kimiharu Sato
公治 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP212487A priority Critical patent/JPS63169731A/en
Publication of JPS63169731A publication Critical patent/JPS63169731A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make the title holding mechanism to correspond to the inclination of a bonding surface in a sample without adjustment by constituting the title holding mechanism of a mounting fixed to a tool holding section or a bonder and a tool holder, one end of which is fastened to said mounting and to the other end of which a tool is settled and to an intermediate section of which an elastic section is formed. CONSTITUTION:An expanding slot 5f is shaped at the center of the upper end of a tool holder 5. The shaft section 7a of a tool 7 is inserted into the hole 5d of the tool holder 5, and fixed to the tool holder 5 by a screw 8. An elastic section 5h to which a spiral groove 5g is formed is set up to the intermediate section of the shaft section 5a of the tool holder 5. Accordingly, since the elastic section 5h is shaped between one end fastened to a mounting 3 and the other end, to which the tool 7 is settled in the tool holder 5, the elastic section 5h can be deformed elastically so as to enable the lower surface of the tool 7 to follow a bonding surface when the bonding surface is inclined when the mounting 3 is lowered and the tool 7 pushes the bonding surface of a sample.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、テープボンダー(インナーリードボンダー及
びアウターリードボンダー)、ペレットボンダー等に用
いるツール保持機構に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tool holding mechanism used in tape bonders (inner lead bonders and outer lead bonders), pellet bonders, and the like.

[従来の技術] 従来、ツールが固定されたツールホルダーは、ボンダー
のツール保持部に水平なX方向及びこのX方向に直交し
た水平なY方向にそれぞれ調整ねじで調整可能であり、
かつ固定ねじで固定されている。
[Prior Art] Conventionally, a tool holder to which a tool is fixed can be adjusted in an X direction horizontal to the tool holding portion of a bonder and in a horizontal Y direction perpendicular to this X direction using adjustment screws.
and is fixed with a fixing screw.

そこで、X方向及びY方向の調整ねじでツールの下面と
ポンドステージとの平行出しを行い、その後固定ねじで
ツールホルダーをツール保持部に固定している。
Therefore, the lower surface of the tool and the pound stage are aligned parallel to each other using adjustment screws in the X and Y directions, and then the tool holder is fixed to the tool holding portion using a fixing screw.

[発明が解決しよラ−とする問題点] 上記従来技術は、調整ねじの微妙な動きによってツール
の平行出しを行うので、ツールの平行出しが難しく、多
大の調整時間を要する。またツールに自由度が無く、傾
きのある試料は良好なボンディングが行えなかった。
[Problems to be Solved by the Invention] In the above-mentioned prior art, the parallelization of the tool is performed by delicate movement of the adjustment screw, so it is difficult to parallelize the tool and requires a large amount of adjustment time. In addition, the tool had no degree of freedom, and it was not possible to perform good bonding with tilted samples.

本発明の目的は、ツールの平行出しが容易で、かつ試料
のボンディング面の傾きに調整なしで対応できるボンダ
ー用ツール保持機構を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a bonder tool holding mechanism that allows easy parallelization of the tool and can accommodate the inclination of the bonding surface of a sample without adjustment.

[問題点を解決するための手段] 上記従来技術の問題点は、ボンダーのツール保持部に固
定される取付体と、一端が前記取付体に固定され、他端
にツールが固定され、かつ中間部に弾性部が形成された
ツールホルダーとから構成することにより解決される。
[Means for Solving the Problems] The problems of the above-mentioned conventional technology are that the mounting body is fixed to the tool holding portion of the bonder, one end is fixed to the mounting body, the tool is fixed to the other end, and the intermediate This problem can be solved by constructing a tool holder in which an elastic part is formed on the part.

[作用] ツールホルダーには、取付体への固定部とツールの固定
部との間に弾性部が形成されているので、取付体への固
定部を支点として任意の方向に傾くことができ、ツール
の下面は常にボンディング面の任意の傾きに倣うことが
できる。
[Function] Since the tool holder has an elastic part formed between the part fixed to the mounting body and the part fixed to the tool, it can be tilted in any direction using the part fixed to the mounting body as a fulcrum. The underside of the tool can always follow any inclination of the bonding surface.

[実施例] 以下、本発明の一実施例を第1図乃至第3図により説明
する0図示しない駆動手段で平面上のXY方向に移動さ
せられる移動体1には、図示しない駆動手段で上下動さ
せられるツール保持部2が上下動可能に設けられている
。ツール保持部2にはL形をした取付体3がねじ4で固
定されている。
[Embodiment] Hereinafter, an embodiment of the present invention will be explained with reference to FIGS. A tool holding section 2 that can be moved is provided so as to be movable up and down. An L-shaped mounting body 3 is fixed to the tool holding portion 2 with screws 4.

取付体3の平面部には、ツールホルダー5の軸部5aが
取付体3の下面から上面上方に突出するように挿入され
、ツールホルダー5のフランジ部5bがねじ6で取付体
3に固定されている。ツールホルダー5の中心には、下
方から上方にツール7の軸部7aより若干大きな穴5C
が、その上方に軸部7aが嵌挿される穴5dが、更にそ
の上方に軸部7aより小さな穴5eが形成されている。
The shaft portion 5a of the tool holder 5 is inserted into the flat surface of the mounting body 3 so as to protrude upward from the bottom surface of the mounting body 3, and the flange portion 5b of the tool holder 5 is fixed to the mounting body 3 with screws 6. ing. In the center of the tool holder 5 is a hole 5C that is slightly larger than the shaft portion 7a of the tool 7, extending from the bottom to the top.
However, a hole 5d into which the shaft portion 7a is inserted is formed above the hole 5d, and a hole 5e smaller than the shaft portion 7a is formed above the hole 5d.

またツールホルダー5の上端中央には割り溝5fが形成
されている。そして、ツール7の軸部7aはツールホル
ダー5の穴5dに挿入され、ねじ8でツールホルダー5
に固定されている。またツールホルダー5の軸部5aの
中間部分には螺旋状の溝5gが形成された弾性部5hを
有している。
Further, a split groove 5f is formed at the center of the upper end of the tool holder 5. Then, the shaft part 7a of the tool 7 is inserted into the hole 5d of the tool holder 5, and the screw 8 is inserted into the tool holder 5.
is fixed. In addition, the shaft portion 5a of the tool holder 5 has an elastic portion 5h formed with a spiral groove 5g in the middle portion thereof.

このように、ツールホルダー5には、取付体3に固定さ
れた一端と、ツール7が固定された他端との間に弾性部
5hが形成されているので、取付体3が下降してツール
7が試料のボンディング面を押圧した時、ボンディング
面に傾きがある場合には、ツール7の下面がボンディン
グ面に倣うように弾性部5hが弾性変形することができ
る。
In this way, the tool holder 5 has an elastic portion 5h formed between one end fixed to the attachment body 3 and the other end to which the tool 7 is fixed, so that the attachment body 3 is lowered and the tool When the tool 7 presses the bonding surface of the sample, if the bonding surface is inclined, the elastic portion 5h can be elastically deformed so that the lower surface of the tool 7 follows the bonding surface.

第4図は本発明の第2実施例を示す0本実施例は前記第
1実施例のツールホルダー5を上下逆にして取付体3に
固定してなる。このようにして用いても前記実施例と同
様の効果が得られる。
FIG. 4 shows a second embodiment of the present invention. In this embodiment, the tool holder 5 of the first embodiment is fixed to the mounting body 3 upside down. Even when used in this manner, the same effects as in the above embodiment can be obtained.

第5図乃至第8図は本発明の第3実施例を示す0本実施
例はツールホルダー5に複数個の縦溝51を形成して弾
性部5hとしている。
5 to 8 show a third embodiment of the present invention. In this embodiment, a plurality of vertical grooves 51 are formed in the tool holder 5 to serve as an elastic portion 5h.

第9図は本発明の第4実施例で、本実施例は前記第3実
施例のツールホルダー5を上下逆にして用いた場合を示
す。
FIG. 9 shows a fourth embodiment of the present invention, in which the tool holder 5 of the third embodiment is used upside down.

なお、上記各実施例におけるツール7は、テープボンダ
ー用の場合を図示したが、ペレットボンダー用でもよい
、この場合には、ツール7にはペレットを吸着する吸着
穴が設けられ、かつツール7の上端には真空装置に接続
されたバイブを接続することはいうまでもない。
Although the tool 7 in each of the above embodiments is illustrated as being used for a tape bonder, it may also be used for a pellet bonder. In this case, the tool 7 is provided with a suction hole for sucking pellets, and Needless to say, a vibrator connected to a vacuum device is connected to the upper end.

[発明の効果] 以上の説明から明らかなように、本発明によれば、試料
のボンディング面にツールのボンディング面が倣うので
、ツールをツールホルダーに取付けるのみで調整は不要
である。また傾きのある試料も完全なボンディングが行
える。
[Effects of the Invention] As is clear from the above description, according to the present invention, the bonding surface of the tool follows the bonding surface of the sample, so no adjustment is necessary just by attaching the tool to the tool holder. In addition, complete bonding can be performed even on tilted samples.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第3図は本発明の一実施例を示し、第1図は
正面図、第2図は側面図、第3図は平面図、第4図は本
発明の第2実施例を示す正面図。 第5図乃至第8図は本発明の第3実施例を示し、第5図
は正面図、第6図は第5図の中央断面図。 第7図は平面図、第8図は底面図、第9図は本発明の第
4実施例を示す正面図である。 2:ツール保持部5  3:取付体、 5:ツールホルダー、 5h:弾性部。 7:ツール。 図面の浄書(内容に変更なし) 第1図 2: ・ソールレイ糸牟今郭 3 : 肩にイ寸 イ本 5:゛ンールホルダー 5h:3牟・ト1L杏β 7:′)−ル 第2図 り 第3図 第5図 第7図    第8図 5 ワールホル9+− 第9図 へh ’=−,」′ 手続補正書(自発) 昭和62年1月29日 特許庁長官 黒 1)明 雄 殿 2 発明の名称 ボンダー用ツール保持機構3 補正を
する者 事件との関係 特許出願人 住所 東京都武蔵村山市伊奈平2丁目51番地の1名称
  株式会社  新  川 代表取締役   安  雲   毅 4 代理人 住所 東京都渋谷区代々木2丁目20番2号図面 6 補正の内容
1 to 3 show one embodiment of the present invention, FIG. 1 is a front view, FIG. 2 is a side view, FIG. 3 is a plan view, and FIG. 4 is a second embodiment of the present invention. The front view shown. 5 to 8 show a third embodiment of the present invention, in which FIG. 5 is a front view and FIG. 6 is a central sectional view of FIG. 5. FIG. 7 is a plan view, FIG. 8 is a bottom view, and FIG. 9 is a front view showing a fourth embodiment of the present invention. 2: Tool holding part 5 3: Mounting body, 5: Tool holder, 5h: Elastic part. 7: Tools. Engraving of the drawings (no changes to the contents) Fig. 1 2: ・Sole Ray Itomukaku 3: I size on the shoulder I book 5: Enrule holder 5h: 3 mm・To 1 L anzu β 7:') - Le 2nd drawing Figure 3 Figure 5 Figure 7 Figure 8 Figure 5 Waalhol 9+- To Figure 9 h '=-,'' Procedural amendment (voluntary) January 29, 1985 Commissioner of the Japan Patent Office Black 1) Akio Tono 2 Title of the invention Bonder tool holding mechanism 3 Relationship with the case of the person making the amendment Patent applicant address 1 name, 2-51 Inadaira, Musashimurayama-shi, Tokyo Shinkawa Co., Ltd. Representative director Tsuyoshi Yasuno 4 Agent address Tokyo 2-20-2 Yoyogi, Shibuya-ku Drawing 6 Contents of amendment

Claims (1)

【特許請求の範囲】[Claims] ボンダーのツール保持部に固定される取付体と、一端が
前記取付体に固定され、他端にツールが固定され、かつ
中間部に弾性部が形成されたツールホルダーとからなり
、前記ツールの下面がボンディング面に倣って傾き得る
ことを特徴とするボンダー用ツール保持機構。
It consists of a mounting body fixed to the tool holding part of the bonder, and a tool holder having one end fixed to the mounting body, a tool fixed to the other end, and an elastic part formed in the middle part, and the tool holder having an elastic part formed on the lower surface of the tool. A tool holding mechanism for a bonder, characterized in that the tool can be tilted to follow the bonding surface.
JP212487A 1987-01-08 1987-01-08 Tool holding mechanism for bonder Pending JPS63169731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP212487A JPS63169731A (en) 1987-01-08 1987-01-08 Tool holding mechanism for bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP212487A JPS63169731A (en) 1987-01-08 1987-01-08 Tool holding mechanism for bonder

Publications (1)

Publication Number Publication Date
JPS63169731A true JPS63169731A (en) 1988-07-13

Family

ID=11520598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP212487A Pending JPS63169731A (en) 1987-01-08 1987-01-08 Tool holding mechanism for bonder

Country Status (1)

Country Link
JP (1) JPS63169731A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487345A (en) * 1990-07-30 1992-03-19 Nippon Steel Corp Bonding apparatus
US5190205A (en) * 1990-10-31 1993-03-02 Kabushiki Kaisha Shinkawa Bonding head assembly
JPH08241912A (en) * 1996-02-13 1996-09-17 Hitachi Ltd Manufacture for electronic circuit component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5360576A (en) * 1976-11-11 1978-05-31 Mitsubishi Electric Corp Flip chip bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5360576A (en) * 1976-11-11 1978-05-31 Mitsubishi Electric Corp Flip chip bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487345A (en) * 1990-07-30 1992-03-19 Nippon Steel Corp Bonding apparatus
US5190205A (en) * 1990-10-31 1993-03-02 Kabushiki Kaisha Shinkawa Bonding head assembly
JPH08241912A (en) * 1996-02-13 1996-09-17 Hitachi Ltd Manufacture for electronic circuit component

Similar Documents

Publication Publication Date Title
JP2920518B2 (en) Semiconductor package with window
JPS63169731A (en) Tool holding mechanism for bonder
KR20010021017A (en) Mounting method for electronic device elements and manufacturing method for surface acoustic wave device
JP2623760B2 (en) Collet for pellet bonding
JPH0474864B2 (en)
JPH02158152A (en) Jig for containing and aligning pellet
JPS6237932U (en)
JP2548071B2 (en) Wire bonding table and wire bonding method
JP3194328B2 (en) Die bonding equipment
JPS58148946U (en) bending mold
JPS5961942A (en) Thin plate carrier jig
JPH03114241A (en) Lead frame holding equipment
JPS59135650U (en) Punch for lead bending
JPH0453243A (en) Lead frame pressing jig
JPH01187839A (en) Laminated ceramic vessel for semiconductor element
JPH06312335A (en) Work inserting device
JPS6393641U (en)
JPS61185905A (en) High frequency coil
JPS587730U (en) Micro parts alignment device
JPH01140735A (en) Bonding mechanism
JPS6343438U (en)
JPS60156657U (en) Sample stage for scanning electron microscope
JPS63164223A (en) Pellet positioning mechanism
JPS6135748U (en) Tweezers for semiconductor wafers
JPH01165150A (en) Semiconductor device