JPS5961942A - Thin plate carrier jig - Google Patents

Abstract

PURPOSE:To remove external defect of a thin plate to be generated during transportation by giving an inclination to each separating plate so that the one surface of thin plate is not in contact with the separating plate. CONSTITUTION:Each separating plate 4 and a groove 5 are inclined backward by theta from the vertical plane (Y-Y') so that the surface 1A to be worked on which element is formed of wafer 1 is not in contact with the separating plate 4 of jig. In this case, the main surface of separating plate 4 (and groove 5) is formed at a right angle for the upper surface of frame inclined by theta for the horizontal plane X-X'. Thereby, the surface 1A where elements are formed is always locted at the upper side of the inclined surface, the wafer always keeps the constant inclination without contactness with jig. Thereby, any damage by contactness and chipping can be prevented and defect on the appearance can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a carrier jig for a thin plate made of a relatively brittle material, such as a semiconductor wafer, which is the base material of a semiconductor product.

Semiconductor devices such as transistors and ICs are generally formed by repeating optical etching and impurity diffusion treatments on a five-sided silicon single crystal disk.
Therefore, it is desirable that the wafer surface on which elements are processed is always physically kept out of contact with other objects.

When transporting these wafers between processes for processing semiconductor devices, a wafer carrier jig consisting of a frame body in which a plurality of grooves and partition plates are alternately formed is used to support a large number of wafers vertically. . Figure 1 shows a cross-sectional view of an example of a carrier jig currently in use, and Figure 2 shows a partially cutaway front view of the A-X main net cross section in Figure 1. . In these figures, 1
2 is the silicon wafer to be processed, 2 is the frame leg, 3 is the side plate of the frame, 4 is the partition plate, and 5 is the groove into which the wafer is inserted. Multiple sets have been formed.

The wafer 1 is inserted from the top of the frame into the groove 5 along the partition plate 4, and is stored in a state where it is leaning against one surface of the partition plate 4. When such a carrier jig is normally placed, the partition plate 4 is installed at right angles (vertical direction) to the horizontal plane, so when the wafer product is moved, vibrations or slight tilting may cause damage as shown in Figure 3. When the wafer 1 is tilted as shown by the broken line, the surface +A to be processed (referred to as the front surface) comes into contact with the inner surface of the partition plate 4, which causes scratches and chipping on the +A side of the wafer, which causes damage to the element forming surface. This has become a problem due to its poor appearance.

The present invention solves the above problems, and aims to improve the structure of a carrier jig and eliminate appearance defects of thin plates that occur during transportation. This will be described in detail below with reference to Examples.

FIG. 4 shows the basic structure of a carrier jig, which is an embodiment of the present invention, in a partially cutaway vertical sectional view. Components in this figure that are common to those in FIG. 2 shown as a conventional example are indicated by the same reference numbers.

In the present invention, each partition plate 4 and groove portion are arranged rearwardly from the vertical plane (YY') so that the processed surface IA on which the elements of the wafer 1 are formed does not come into contact with the partition plate 4 of the jig. It is tilted by 1θ. In this case, the main surface of each partition plate 4 (and groove portion 5) is formed in a direction perpendicular to the upper surface of the frame which is inclined by θ with respect to the horizontal plane X-Z.

To this end, the main body of the frame (2) and the frame may be of the same shape as the main body of a conventional frame, and the heights of the legs may be changed from front to back. That is, as shown in the figure, the height of the front leg portion 2a is hl, and the height of the rear leg portion 2b is h2, so that hI>h2. Specifically, by making hl higher than h2 by about 5 to 109, it is possible to give the partition plate an appropriate inclination when the jig is normally installed. Fig. 6 shows the carrier jig according to the present invention. This is shown in a general slope diagram.

According to the present invention described in the embodiments above, the wafer can be stored by inserting the wafer into the groove 5 of the carrier jig and leaning the back side IB on which no elements are formed on the wafer against the partition plate 4, as shown in FIG. Because of the structure, the surface IA on which the elements are formed is always on the upper side of the inclined surface, and the wafer always maintains a constant orientation even when the product is moved by slight tilts or vibrations. This prevents damage, chipping, etc. caused by contact and greatly improves appearance defects.

According to the present invention, since each groove surface is formed perpendicularly to the upper surface of the frame which is the opening side of the groove, it is easy to transfer the wafer from one carrier jig to another carrier jig. It can be done.

FIG. 7 shows a configuration in which a wafer stored in carrier jig I is transferred to carrier jig II. Two jigs are used to transfer this wafer: 1. The wafer 1 is placed horizontally in II with the element forming surface IA facing upward. That is, two jigs 1. If the upper surfaces of the jigs are placed opposite each other so that the front leg 2a of the lI is on top and the rear leg 2b is on the bottom, the partition plates of the opposing jigs will be in a symmetrical position with respect to the mating surface 0-OK. On the other hand, the wafer can be easily transferred.

The present invention can be used not only for semiconductor wafers, but also as a carrier jig for transporting thin plates made of brittle material such as thin glass masks.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an example of a conventional carrier jig. FIG. 2 is a front view of a longitudinal cross-section taken along the line A-A in FIG. 1. FIG. 3 is an enlarged vertical sectional view of a part of FIG. 2. FIG. 4 is a partially longitudinal cross-sectional front view showing an example of the carrier jig according to the present invention. FIG. 5 is an enlarged vertical sectional view of a part of FIG. 4. FIG. 6 is an overall perspective view of the carrier jig according to the present invention. FIG. 7 is a front view of wafer transfer using the carrier jig according to the present invention. DESCRIPTION OF SYMBOLS 1... Wafer, 2... Frame leg, 3... Frame side plate, 4... Partition plate, butt... Groove. Agent Patent Attorney Susuki 1) Toshiyuki ・No. 1 Figure-A'-2 Figure 2 Figure 3 Figure 4/γ, No. 5,,)O

Claims (1)

[Scope of Claims] (1) A thin plate carrier jig consisting of a frame having alternating grooves and partition plates for leaning the thin plate; 1. A thin plate carrier jig characterized by having a slanted partition plate. 2. Form each partition plate perpendicular to the top surface of the frame body, which is the opening side, and one of the legs of the frame body. The thin plate carrier jig according to claim 1, wherein the diaphragm is tilted by making the diaphragm higher than the other.