JPH08298246A - Wafer boat - Google Patents

Wafer boat

Info

Publication number
JPH08298246A
JPH08298246A JP10375195A JP10375195A JPH08298246A JP H08298246 A JPH08298246 A JP H08298246A JP 10375195 A JP10375195 A JP 10375195A JP 10375195 A JP10375195 A JP 10375195A JP H08298246 A JPH08298246 A JP H08298246A
Authority
JP
Japan
Prior art keywords
wafer
wafer boat
boat
support member
entrance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10375195A
Other languages
Japanese (ja)
Inventor
Noriko Koga
徳子 古閑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10375195A priority Critical patent/JPH08298246A/en
Publication of JPH08298246A publication Critical patent/JPH08298246A/en
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: To obtain a wafer boat which is simpler in structure, lower in manufacturing cost, and used in a vertical thermal treatment furnace, wherein wafers can be stably supported without causing stress to them. CONSTITUTION: A wafer 8 is inserted into a wafer boat through an outlet/inlet 6 and placed on a seat 5a, wherein a U-shaped support member 5 provided with the seats 5a which are mounted on a support pole 4 as tilted downwards from the outlet/inlet 6 by an angle of θ with a horizontal plane is provided.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、縦型熱処理炉に使用す
るウェーハボートに関し、特に、複数のウェーハを垂直
方向に並べ収納する縦型のウェーハボートに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer boat used in a vertical heat treatment furnace, and more particularly to a vertical wafer boat for storing a plurality of wafers in a vertical direction.

【0002】[0002]

【従来の技術】従来、この種のウェーハボートは、挿入
されるウェーハを囲むように垂直に並べ配置された支持
棒にウェーハの板厚より若干広い矩形状の溝を形成し、
この溝部でウェーハ端部とウェーハ裏面周囲が面接触し
ウェーハを支持していた。
2. Description of the Related Art Conventionally, a wafer boat of this type has a support rod vertically arranged so as to surround a wafer to be inserted with a rectangular groove slightly wider than the thickness of the wafer.
At this groove, the edge of the wafer and the periphery of the back surface of the wafer were in surface contact with each other to support the wafer.

【0003】しかしながら、石英製の支持棒に比べシリ
コンウェーハの熱膨張係数は大きく、ウェーハを支持す
る複数の支持棒の溝によってウェーハの端部は局部的に
熱応力を受けスリップなどの結晶欠陥を発生するという
欠点がある。
However, the coefficient of thermal expansion of a silicon wafer is larger than that of a quartz support rod, and the edges of the wafer are locally subjected to thermal stress due to the grooves of a plurality of support rods for supporting the wafer, causing crystal defects such as slips. It has the drawback of occurring.

【0004】この問題を解消するウェーハボートとして
特開平2一102523号公報に開示されている。この
ウェーハボートは、ウェーハの裏面を部分的あるいは円
状に線接触してウェーハを保持し、ウェーハへの接触を
小さくしウェーハ表面への熱応力を小さくしスリップの
発生を抑えていることを特徴としていた。
A wafer boat that solves this problem is disclosed in Japanese Patent Laid-Open No. 1022523/1992. This wafer boat holds the wafer by partially or circularly making line contact with the backside of the wafer, reducing the contact with the wafer, reducing the thermal stress on the wafer surface, and suppressing the occurrence of slippage. I was trying.

【0005】[0005]

【発明が解決しようとする課題】上述した従来のウェー
ハボートでは、線接触で与えるウェーハへの熱応力を小
さくすることができるものの、ウェーハの支持が不安定
でウェーハボートを回転する際に、ウェーハボートのウ
ェーハ出入口よりウェーハがずり落ちるという問題がし
ばしば起きた。また、支持棒から突出するウェーハ支持
部は各支持棒から独立して派生しており、炉内で受ける
熱サイクルによってそれぞれ変形し、ウェーハ支持部の
線接触部を同一面内に維持することが困難になり、益々
ウェーハのすべり落ちる問題が起きる。
In the conventional wafer boat described above, although the thermal stress applied to the wafer by the line contact can be reduced, the wafer support is unstable and the wafer boat is rotated. The problem often occurred that the wafer slipped from the wafer entrance / exit of the boat. Further, the wafer supporting portions protruding from the supporting rods are independently derived from the respective supporting rods, and can be deformed by the thermal cycle received in the furnace to maintain the line contact portion of the wafer supporting portion in the same plane. It becomes difficult and the problem of the wafer slipping down occurs more and more.

【0006】また、各支持棒からウェーハ支持部を独立
して派生することは構造を複雑なものにし、製作するに
しても手作業による工数が多くを必要とし非常に高価に
なるという欠点がある。
Further, independently deriving the wafer supporting portion from each supporting rod complicates the structure and requires a large number of man-hours even if it is manufactured, which is very expensive. .

【0007】従って、本発明の目的は、ウェーハにスト
レスを与えることなく安定してウェーハを支持すること
ができ、より簡単な構造で安価なウェーハボートを提供
することである。
Therefore, an object of the present invention is to provide a wafer boat which can stably support a wafer without giving stress to the wafer and which has a simpler structure and is inexpensive.

【0008】[0008]

【課題を解決するための手段】本発明の特徴は、半導体
基板であるウェーハが挿入あるいは引出される出入口の
部分以外の該ウェーハの外周部を囲み垂直に立てて並び
配置される複数本の支持棒部材と、これら支持棒部材の
内側より該ウェーハの中心に向って所定の長さで伸び前
記ウェーハの周辺部分を載置する座面を有しかつこの座
面が前記出入口から奥に向って下るように傾斜している
支持部材とを備えるウェーハボートである。
A feature of the present invention is that a plurality of supports that surround the outer peripheral portion of a wafer, which is a semiconductor substrate, other than the entrance / exit portion of the wafer, are vertically arranged side by side. There is a bar member and a seat surface that extends from the inside of these support bar members toward the center of the wafer by a predetermined length and mounts the peripheral portion of the wafer, and this seat surface extends from the entrance to the back. It is a wafer boat provided with the support member which inclines so that it may descend.

【0009】[0009]

【実施例】次に、本発明について図面を参照して説明す
る。
Next, the present invention will be described with reference to the drawings.

【0010】図1(a)〜(c)は本発明のウェーハボ
ートの一実施例を示す熱処理炉に収納された状態を示す
図(a)およびA部を拡大した図(b)ならびに上から
見た図(c)である。図1(a)の熱処理炉9に収納さ
れたウェーハボード1は、図1(b)および(c)に示
すように、ウェーハ8が挿入あるいは引出される出入口
6の部分以外のウェーハ8の外周部を囲み垂直に立てて
並び配置される複数本の支持棒4と、これら支持棒4の
内側よりウェーハの中心に向って所定の長さLで伸びウ
ェーハ8の周辺部分を載置する座面5aを有しかつこの
座面5aが出入口6側から奥に向って下るようにθ度傾
斜している馬蹄形支持部材5とを備えている。
1 (a) to 1 (c) are views (a) showing a state of being housed in a heat treatment furnace showing an embodiment of a wafer boat of the present invention, an enlarged view of part A (b), and from above. It is the figure seen (c). As shown in FIGS. 1B and 1C, the wafer board 1 housed in the heat treatment furnace 9 of FIG. 1A has an outer periphery of the wafer 8 other than a portion of the entrance / exit 6 into which the wafer 8 is inserted or withdrawn. A plurality of support rods 4 surrounding the portions and arranged vertically side by side, and a seat surface on which the peripheral portion of the wafer 8 is mounted, which extends from the inside of these support rods 4 toward the center of the wafer by a predetermined length L. And a horseshoe-shaped support member 5 having a seat surface 5a that is inclined by θ degrees from the entrance / exit 6 side toward the back.

【0011】ここで、ウェーハ8を支える座面5aの傾
きθは3度から5度の範囲が望ましい。また、馬蹄形支
持部材5は支持棒4と同じ材質である石英材から製作
し、座面は表面が円滑な面をもたせるために、表面を高
熱に加熱しリフロー状態にし、表面を自由表面と同じ状
態にし仕上げることが望ましい。
Here, the inclination θ of the seat surface 5a supporting the wafer 8 is preferably in the range of 3 degrees to 5 degrees. The horseshoe-shaped support member 5 is made of quartz, which is the same material as the support rod 4, and the seating surface has a smooth surface so that the surface is heated to high heat to be in a reflow state, and the surface is the same as the free surface. It is desirable to finish it.

【0012】このように座面を円滑な表面にし平坦度の
精度を向上させれば、ウェーハ8の裏面との接触面積が
大きくなり、自重による荷重が分散されウェーハ8に加
わる応力が小さくなり表面も滑らかになり、ウェーハ8
の出し入れのときに、ウェーハ8に傷を発生させること
はない。
If the seating surface is made a smooth surface and the accuracy of the flatness is improved in this way, the contact area with the back surface of the wafer 8 becomes large, the load due to its own weight is dispersed, and the stress applied to the wafer 8 becomes small, so Also smoothed, wafer 8
The wafer 8 is not scratched at the time of loading and unloading.

【0013】また、従来のようにウェーハ8の周囲をは
め込む溝のような構造ではなく、ウェーハ8の単に乗せ
るだけの構造であるので、熱履歴によってウェーハ8に
熱応力を与えることがなくなる。さらに、この座面5a
はウェーハ8の出入口6から奥に向って下るように傾斜
しているので、ウェーハボート1を回転してウェーハ8
を処理する場合でも、ウェーハ8が出入口6からすべり
落ちることはない。
Further, since the wafer 8 is not placed in a groove-like structure that fits around the wafer 8 as in the prior art, but is simply put on the wafer 8, thermal stress is not applied to the wafer 8 due to thermal history. Furthermore, this seat surface 5a
Is inclined downward from the entrance / exit 6 of the wafer 8 so that the wafer boat 1 is rotated to rotate the wafer 8
The wafer 8 does not slide down from the entrance / exit 6 even when processing the above.

【0014】一方、製作するのに際しても、馬蹄形支持
部材は一体の単純な板材であるので、この馬蹄形支持部
材5の座面5aを平坦度を精度良く予じめ製作してか
ら、支持棒4に取付ければ良い。なお、馬蹄形支持部材
5は厚みがあるし、座面5aの平坦度を狂わせることな
く取付けることができる。これに対し従来のように、各
支持棒の同じ所定位置に個々のウェーハ支持部の線接触
部を同一平面内に精度良く取付けるのに比べ容易に取り
付けることができる。
On the other hand, in manufacturing the horseshoe-shaped support member, since it is an integral simple plate member, the seating surface 5a of the horseshoe-shaped support member 5 is manufactured with a high degree of flatness, and then the support rod 4 is manufactured. You can attach it to. The horseshoe-shaped support member 5 is thick and can be attached without disturbing the flatness of the seat surface 5a. On the other hand, as in the conventional case, it is possible to easily attach the line contact portions of the individual wafer support portions at the same predetermined position of each support rod in the same plane with high precision.

【0015】また、この馬蹄形支持部材5は板厚も厚く
何度も熱サイクルを受けても変形を生ずることはない。
Further, the horseshoe-shaped support member 5 has a large plate thickness and is not deformed even if it is subjected to many heat cycles.

【0016】[0016]

【発明の効果】以上説明したように本発明は、ウェーハ
が挿入され載置される座面をウェーハの出入口から奥に
向って下るように傾斜して取付ける一体化した厚みのあ
る馬蹄形支持部材を設けることによって、広い面積で支
え自重による荷重を分散し応力を小さくしウェーハに傷
やスリップを発生させるストレスを与えることはない。
As described above, according to the present invention, there is provided an integrated thick horseshoe-shaped support member for mounting a seat surface on which a wafer is inserted and placed so as to incline so as to descend from the entrance of the wafer toward the back. By providing it, it is supported in a wide area, the load due to its own weight is dispersed, the stress is reduced, and the stress that causes scratches and slips on the wafer is not given.

【0017】また、馬蹄形支持部材を板厚をもつ一体化
した板材としたので構造も簡単になるとともに支持棒に
座面の平坦度を失なうことなく容易に取付けることがで
き安価で変形を起すことがないという効果がある。
Further, since the horseshoe-shaped support member is an integrated plate material having a plate thickness, the structure is simple, and it can be easily attached to the support rod without losing the flatness of the seating surface, and it is inexpensive and deformable. It has the effect that it will not occur.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のウェーハボートの一実施例を示す熱処
理炉に収納された状態を示す図(a)およびA部を拡大
した図(b)ならびに上から見た図(c)である。
FIG. 1 is a diagram (a) showing a state of being housed in a heat treatment furnace showing an embodiment of a wafer boat of the present invention, a diagram (b) in which an A part is enlarged, and a diagram (c) seen from above.

【符号の説明】[Explanation of symbols]

1 ウェーハボート 4 支持棒 5 馬蹄形支持部材 5a 座面 6 出入口 8 ウェーハ 9 熱処理炉 DESCRIPTION OF SYMBOLS 1 Wafer boat 4 Support rod 5 Horseshoe-shaped support member 5a Seating surface 6 Inlet / outlet 8 Wafer 9 Heat treatment furnace

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 半導体基板であるウェーハが挿入あるい
は引出される出入口の部分以外の該ウェーハの外周部を
囲み垂直に立てて並び配置される複数本の支持棒部材
と、これら支持棒部材の内側より該ウェーハの中心に向
って所定の長さで伸び前記ウェーハの周辺部分を載置す
る座面を有しかつこの座面が前記出入口から奥に向って
下るように傾斜している支持部材とを備えることを特徴
とするウェーハボート。
1. A plurality of support rod members which are vertically arranged side by side around the outer peripheral portion of the wafer other than the entrance / exit portion into which the wafer, which is a semiconductor substrate, is inserted or pulled out, and the inside of these support rod members. A support member having a seating surface that extends toward the center of the wafer by a predetermined length and mounts the peripheral portion of the wafer, and the seating surface is inclined downward from the entrance to the back. A wafer boat comprising:
JP10375195A 1995-04-27 1995-04-27 Wafer boat Pending JPH08298246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10375195A JPH08298246A (en) 1995-04-27 1995-04-27 Wafer boat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10375195A JPH08298246A (en) 1995-04-27 1995-04-27 Wafer boat

Publications (1)

Publication Number Publication Date
JPH08298246A true JPH08298246A (en) 1996-11-12

Family

ID=14362280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10375195A Pending JPH08298246A (en) 1995-04-27 1995-04-27 Wafer boat

Country Status (1)

Country Link
JP (1) JPH08298246A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105825035A (en) * 2016-05-16 2016-08-03 中国航空工业集团公司西安飞机设计研究所 Equivalent treating method for surface distribution force generated when wing supporting poles are axially pressed
CN115662928A (en) * 2022-11-16 2023-01-31 杭州盾源聚芯半导体科技有限公司 Silicon boat for reducing silicon wafer damage

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61247048A (en) * 1985-04-24 1986-11-04 Nec Corp Port for vertical diffusion furnace
JPS6228437B2 (en) * 1979-12-13 1987-06-19 Hitachi Ltd
JPH05326431A (en) * 1990-12-31 1993-12-10 Fukui Shinetsu Sekiei:Kk Vertical-type housing jig
JPH06188306A (en) * 1992-12-17 1994-07-08 Toshiba Ceramics Co Ltd Jig for vertical-type semiconductor heat treatment
JPH06268048A (en) * 1993-03-15 1994-09-22 Hitachi Ltd Method of positioning wafer and semiconductor manufacturing device using same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228437B2 (en) * 1979-12-13 1987-06-19 Hitachi Ltd
JPS61247048A (en) * 1985-04-24 1986-11-04 Nec Corp Port for vertical diffusion furnace
JPH05326431A (en) * 1990-12-31 1993-12-10 Fukui Shinetsu Sekiei:Kk Vertical-type housing jig
JPH06188306A (en) * 1992-12-17 1994-07-08 Toshiba Ceramics Co Ltd Jig for vertical-type semiconductor heat treatment
JPH06268048A (en) * 1993-03-15 1994-09-22 Hitachi Ltd Method of positioning wafer and semiconductor manufacturing device using same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105825035A (en) * 2016-05-16 2016-08-03 中国航空工业集团公司西安飞机设计研究所 Equivalent treating method for surface distribution force generated when wing supporting poles are axially pressed
CN105825035B (en) * 2016-05-16 2019-03-22 中国航空工业集团公司西安飞机设计研究所 The equivalent way of surface distributed force when a kind of wing strut axial compression
CN115662928A (en) * 2022-11-16 2023-01-31 杭州盾源聚芯半导体科技有限公司 Silicon boat for reducing silicon wafer damage
CN115662928B (en) * 2022-11-16 2023-08-29 杭州盾源聚芯半导体科技有限公司 Silicon boat for reducing silicon wafer damage

Similar Documents

Publication Publication Date Title
US5219079A (en) Wafer jig
KR100235078B1 (en) Wafer boat for vertical diffusion and vapor growth furnace
JP2005191585A (en) Semiconductor wafer boat
JP2004006841A (en) Vertical base structure without slipping
JPH10321543A (en) Wafer support and vertical boat
US6939132B2 (en) Semiconductor workpiece apparatus
JPH08298246A (en) Wafer boat
JPH10284429A (en) Wafer supporting device
JPH09199437A (en) Semiconductor wafer supporting device
JP3316068B2 (en) Boat for heat treatment
JPH09237781A (en) Heat treatment boat
JP4826070B2 (en) Method for heat treatment of semiconductor wafer
JP2001176811A (en) Wafer support device
JPH11243064A (en) Wafer supporting plate
JP4282208B2 (en) Heat treatment apparatus, boat, heat treatment method, and semiconductor manufacturing method
JPH09298236A (en) Substrate supporting jig and substrate supporting means
JP2005311291A (en) Vertical-type boat
JP4360114B2 (en) Silicon carbide semiconductor device manufacturing apparatus and silicon carbide semiconductor device manufacturing method using the manufacturing apparatus
JPH1140659A (en) Heat treating vertical boat for semiconductor wafer
KR200377160Y1 (en) Semiconductor Wafer Boat
JPH02123736A (en) Wafer boat for longitudinal heat treatment furnace
TW495898B (en) Adjustment tool and its application of support member
JP2000106349A (en) Wafer supporter
JPH07283162A (en) Vertical heat treatment oven wafer boat
KR20070101457A (en) Wafer boat

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19971021