495898 7531twf.doc/006 A7 B7 五 經濟部智慧財產局員工消費合作社印製 發明說明（I ) 本發明是有關於一種高度調整工具，且特別是有關於 一種用於冷熱板晶圓承接支撐桿之調整工具及使用此調整 工具調整冷熱板晶圓承接支擦桿的方法。 在半導體的製程中包括許多熱製程，除了薄膜的成長 需要在高溫的環境下進行之外，擴散的製程及微影製程中 的光阻烘烤’也都需要程度不等的加熱環境。此外，半導 體製程裡is包括3午多其他的熱處理（Thermal Treatment)步 驟’如·用以改Μ材料結構的回火（Annealing)，及增加絕 緣體流動能力的熱流(Flow)等。因此，熱能在半導體製程 上的應用，非常的廣泛。一般熱氧化、回火、熱流/再熱流、 擴散製程及一般薄膜材料的固化作用，均採用熱爐管來進 行。然而在光阻的烘烤上，不使用熱爐管而是使用冷熱板 來進行，係因爲各種光阻的烘烤溫度都相當的低(攝氏200 度以下），而且此作法能與微影製程的其他步驟相結合， 並防止光阻內溶劑蒸發的不均勻性。因此，業界通常都使 用冷熱板來進行光阻的軟烤(Soft Bake)、曝光後的烘烤(Post Exposure Baking)、及硬烤(Hard Bake)，而不使用熱爐管進 行。 然而，在塗佈有光阻之晶圓置於冷熱板上烘烤的過程 中，係昇起位於冷熱板加熱區內的數根晶圓承接支撐桿至 晶圓引導裝置處承接晶圓，再緩緩下降支撐桿，直到晶圓 平穩地放置於冷熱板上，以進行光阻的軟烤、曝光後的烘 烤、或硬烤。 在上述晶圓之承接與下降過程中，各晶圓承接支撐桿 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------^--------^---------線 (請先閱讀背面之注意事項再填寫本頁) 495898 7 S 31twf . doc /0 0 6 A7 B7 經濟部智慧財產局員工消費合作社印製 發明說明（)495898 7531twf.doc / 006 A7 B7 The invention description printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (I) The present invention relates to a height adjustment tool, and in particular to a type of support rod for hot and cold plate wafer receiving Adjustment tool and method for adjusting hot and cold plate wafer receiving support wiper rod using the adjustment tool. There are many thermal processes in the semiconductor manufacturing process. In addition to the film growth under high temperature environment, the diffusion process and photoresist baking in the lithography process also require different degrees of heating environment. In addition, the semi-conductor system is composed of more than 3 pm other thermal treatment steps (such as Annealing to modify the structure of the M material, and heat flow to increase the flow capacity of the insulator). Therefore, the application of thermal energy in semiconductor processes is very wide. General thermal oxidation, tempering, heat flow / reheat flow, diffusion process, and curing of general thin film materials are all performed using hot furnace tubes. However, in the baking of photoresistors, instead of using hot furnace tubes, hot and cold plates are used, because the baking temperature of various photoresists is quite low (below 200 degrees Celsius), and this method can be used with the lithography process. Combine the other steps and prevent the non-uniformity of solvent evaporation within the photoresist. Therefore, the industry usually uses hot and cold plates for soft bake, post exposure baking, and hard bake, instead of hot oven tubes. However, during the process of baking the photoresist-coated wafer on a hot and cold plate, several wafer supporting rods located in the hot and cold plate heating area are raised to the wafer guiding device to receive the wafer, and then Slowly lower the support bar until the wafer is smoothly placed on the hot and cold plate for soft baking of the photoresist, baking after exposure, or hard baking. In the process of receiving and lowering the above wafers, each wafer receives support rods. 3 paper sizes are applicable to China National Standard (CNS) A4 specifications (210 X 297 mm) ------------ ^ -------- ^ --------- line (please read the notes on the back before filling in this page) 495898 7 S 31twf .doc / 0 0 6 A7 B7 Employees of Intellectual Property Bureau, Ministry of Economic Affairs Consumer Cooperatives Printed Invention Notes ()
的高度必須相同，否則會產生問題。請參照第1A〜1B圖， 其中第1A圖所示爲習知之冷熱板晶圓承接支撐桿高度不 同時之上視(Top View)圖，第1B圖所示爲第1A圖沿II-II 方向之結構剖面圖。 請同時參照第1A圖與第1B圖所示，當由此數個晶圓 承接支撐桿102所構成之晶圓承接面108不爲水平面而成 一傾斜面時，則在晶圓承接支撐桿102由晶圓引導裝置（未 繪示）處承接晶圓106後，晶圓106會受此晶圓承接面1〇8 與晶圓106本身重量之影響而產生下滑現象，而使晶圓1〇6 之一側邊緣與位於冷熱板100加熱區110邊緣的加熱區標 示物112相接觸。 接著’當晶圓承接支擦桿102降到最低點時，晶圓106 會與冷熱板100之表面以一定之傾斜角度相接觸，致使位 於晶圓106表面之光阻液產生流動現象，且造成晶圓106 表面受熱不均，而使經由熱製程後之晶圓106表面之光阻 層的平坦性降低。 習知爲解決晶圓承接面傾斜之問題，係在支撐桿固定 基座上升至最高點時，直接使用直尺，以目測之方法調整 晶圓承接支撐桿102之突出冷熱板100之高度，將位於加 熱區110內的所有晶圓承接支撐桿102之高度調整爲相 同，以改善晶圓承接面傾斜之問題。 然而，習知在進行晶圓承接支撐桿高度調整時，由於 進行目測會受到量測空間的限制而有視角上的誤差（目測 者無法直接在與晶圓承接支撐桿之頂面水平處進行量測， 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 裝---- 訂---------線· 495898 7 5 3 1twf . doc /0 0 6 A7The heights must be the same, otherwise problems will occur. Please refer to Figures 1A to 1B, where Figure 1A shows the conventional Top View when the height of the hot and cold plate wafer receiving support rods is different, and Figure 1B shows Figure 1A along the II-II direction Sectional view of the structure. Please refer to FIG. 1A and FIG. 1B at the same time. When the wafer receiving surface 108 formed by the plurality of wafer receiving support rods 102 is not a horizontal plane and an inclined surface, the wafer receiving support rod 102 is formed by After the wafer 106 is received at a wafer guiding device (not shown), the wafer 106 will be affected by the weight of the wafer receiving surface 108 and the weight of the wafer 106 to cause a sliding phenomenon. One side edge is in contact with the heating area marker 112 located on the edge of the heating area 110 of the hot and cold plate 100. Then 'when the wafer receiving support rod 102 is lowered to the lowest point, the wafer 106 will contact the surface of the hot and cold plate 100 at a certain inclination angle, causing the photoresist liquid on the surface of the wafer 106 to flow and cause The surface of the wafer 106 is unevenly heated, which reduces the flatness of the photoresist layer on the surface of the wafer 106 after the thermal process. To solve the problem of tilting the wafer receiving surface, when the fixed base of the supporting rod is raised to the highest point, use a ruler directly to adjust the height of the protruding hot and cold plate 100 of the wafer receiving supporting rod 102 by visual inspection. The heights of all wafer receiving support rods 102 located in the heating zone 110 are adjusted to be the same to improve the problem of wafer receiving surface tilt. However, it is known that when performing the height adjustment of the wafer receiving support rod, there is an error in the viewing angle because the visual inspection will be limited by the measurement space. (Visual inspectors cannot directly measure the level of the wafer receiving support rod directly. 4 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling this page) 495898 7 5 3 1twf .doc / 0 0 6 A7
五、發明說明（3 ) 、 _ 必須以一定之俯視角進彳了量測）’因而造成量測及g周整上 之不準確，導致各晶圓承接支撐桿的高度不一致’而在晶 圓傳送時，使晶圓在晶圓承接支撐桿上產生滑動現象’並 使晶圓在冷熱板上的位置產生偏移，影響晶圓加熱或冷卻 的均勻度。 又，當晶圓承接支撐桿的高度過高時，會與晶圓引導 裝置相碰撞，而造成晶圓表面產生裂縫，甚至使晶圓發生 破片的情形，致使生產成本提高。 本發明提出一種冷熱板晶圓承接支撐桿調整工具’可 以使各晶圓承接支撐桿之高度調整至相同高度’以使由各 晶圓承接支撐桿所構成之晶圓承接面呈一水平狀態’而防 止晶圓於晶圓承接支撐桿上之滑動問題。 另外，本發明提出一種冷熱板晶圓承接支撐桿調整工 具，可使晶圓承接支撐桿的高度符合熱製程時之適當高 度，以防止晶圓承接支撐桿與晶圓引導裝置發生擦撞情 形，以降低生產失誤率，而降低生產成本。 本發明提出一種冷熱板晶圓承接支撐桿之調整工具， 係置於具有可向上伸出之多個晶圓承接支撐桿之冷熱板 請 先 閱 讀 背 意 事 項 再丨 填 本 頁 裝 訂V. Description of the invention (3), _ must be measured with a certain angle of view) 'As a result, the measurement and the g-period are inaccurate, resulting in inconsistent heights of the wafer support rods' During the transfer, the wafer is caused to slip on the wafer receiving support bar, and the position of the wafer on the hot and cold plate is shifted, which affects the uniformity of the wafer heating or cooling. In addition, when the height of the wafer receiving support rod is too high, it may collide with the wafer guiding device, which may cause cracks on the surface of the wafer, or even cause the wafer to break, resulting in increased production costs. The invention proposes a hot and cold plate wafer receiving support rod adjustment tool 'can adjust the height of each wafer receiving support rod to the same height' so that the wafer receiving surface formed by each wafer receiving support rod is in a horizontal state ' This prevents the wafer from sliding on the wafer receiving support bar. In addition, the present invention provides a hot and cold plate wafer receiving support rod adjustment tool, which can make the height of the wafer receiving support rod conform to the appropriate height during the thermal process, so as to prevent the wafer receiving support rod from colliding with the wafer guiding device. To reduce the production error rate and reduce production costs. The present invention provides an adjustment tool for a hot and cold plate wafer receiving support rod, which is placed on a hot and cold plate with a plurality of wafer receiving support rods that can be extended upwards. Please read the memorandum items first and then fill this page to bind
濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 上，且此調整工具係具有由底座及連接底座之螺桿所構成 之基座、可套接於螺桿上之多個調整墊片、可套接於螺桿 上且覆蓋區域足以涵蓋所有的晶圓承接支撐桿之校正盤、 以及可套接於螺桿上之螺帽。 本發明提出一種調整冷熱板晶圓承接支撐桿的方法， 此使用方法係爲將多個調整墊片依序套接於螺桿上，再將 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 495898 7 5 3 1twf . doc/0 0 6 A7 B7 五、發明說明（屮） (請先閱讀背面之注意事項再填寫本頁) 校正盤套接於螺桿上，之後，使用螺帽固定校正盤與已套 接於螺桿上之調整墊片於基座上，以完成調整工具之組 裝，再於冷熱板上放置已組裝之調整工具，使得校正盤之 覆蓋區域涵蓋全部之晶圓承接支撐桿，接著，昇起晶圓承 接支撐桿，且使每一晶圓承接支撐桿與校正盤接觸，最後， 鎖緊晶圓承接支撐桿以完成其高度之校正。 利用本發明之調整墊片組與基座所構成之高度，且配 合使用校正盤，可使各晶圓承接支撐桿之高度調整至相同 高度，以使由各晶圓承接支撐桿所構成之晶圓承接面呈一 水平狀態，而防止晶圓於晶圓承接支撐桿上之滑動問題。 另外，本發明可藉由基座與調整墊片之整體高度之調 整，以控制待校正之晶圓承接支撐桿的高度，且使晶圓承 接支撐桿的高度符合熱製程時之適當高度，並防止因晶圓 承接支撐桿高度過高所造成之晶圓承接支撐桿與晶圓引導 裝置擦撞之情形，以降低生產失誤率，而降低生產成本。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一較佳實施例，並配合所附圖式，作詳 細說明如下： 圖式之簡單說明 經濟部智慧財產局員工消費合作社印製 第1A圖所示爲習知之冷熱板晶圓承接支撐桿高度不 冋時之上視（Top View)圖。 第1B圖所示爲第ία圖沿Η-Π方向之結構剖面圖。 第2圖所示爲本發明較佳實施例之冷熱板晶圓承接支 撐桿調整工具之分解圖。 6 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 五、發明說明（f) 第3圖所示爲第2圖所示之冷熱板晶圓承接支撐桿調 整工具的使用方法之示意圖。 圖式之標記說明= 100，200 :冷熱板 102，220 :晶圓承接支撐桿 104，224 :支撐桿固定基座 495898 7531twf.d〇c/006 ^ B7 106 ： 晶圓 108 ： 晶圓承接面 110 ·· 加熱區 112， 222 :加熱區標示物 202 :底座 204 :螺桿 206 :基座 208 :調整墊片 210，214，217 :貫穿孔 212 :校正盤 216 :螺帽 218 :調整裝置 實施例 第2圖所不爲本發明較佳實施例之冷熱板晶圓承接支 撐桿調整工具之分解圖。第3圖所示爲第2圖所示之冷熱 板晶圓承接支撐桿調整工具的使用方法之示意圖。 請爹照第2圖與第3圖所示，調整裝置218由下而上 依序由含有螺桿之基座206、多個調整墊片208、校正盤 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Ministry of Intellectual Property Bureau, and the adjustment tool has a base consisting of a base and a screw connected to the base, a plurality of adjusting pads that can be sleeved on the screw, and can be sleeved on the screw And the coverage area is enough to cover all the calibration discs of the wafer receiving support rods and the nut that can be sleeved on the screw. The invention proposes a method for adjusting the hot and cold plate wafer receiving support rod. This method of use is to sequentially mount a plurality of adjusting pads on the screw, and then apply the paper size to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 495898 7 5 3 1twf .doc / 0 0 6 A7 B7 V. Description of the invention (屮) (Please read the precautions on the back before filling in this page) The calibration disk is sleeved on the screw, after that, use the screw The cap fixes the calibration disc and the adjustment pad that has been sleeved on the screw on the base to complete the assembly of the adjustment tool. The assembled adjustment tool is placed on the hot and cold plate so that the coverage area of the calibration disc covers all the wafers. After receiving the supporting rod, the wafer receiving supporting rod is raised, and each wafer receiving supporting rod is brought into contact with the calibration disk. Finally, the wafer receiving supporting rod is locked to complete the height correction. By using the height of the spacer group and the base of the present invention and using a calibration disc, the height of each wafer receiving support rod can be adjusted to the same height, so that the crystals formed by each wafer receiving support rod can be adjusted to the same height. The round receiving surface is in a horizontal state to prevent the wafer from sliding on the wafer receiving support rod. In addition, the present invention can adjust the overall height of the base and the adjustment pad to control the height of the wafer receiving support rod to be corrected, and make the height of the wafer receiving support rod consistent with the appropriate height during the thermal process, and To prevent the wafer receiving support rod from colliding with the wafer guiding device due to the high height of the wafer receiving support rod, so as to reduce the production error rate and reduce the production cost. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is exemplified below, and in conjunction with the accompanying drawings, the detailed description is as follows: Brief description of the drawings Figure 1A, printed by the Bureau ’s Consumer Cooperative, shows the top view of the conventional hot and cold plate wafer receiving support bar when the height is not high. FIG. 1B is a sectional view of the structure of FIG. Figure 2 is an exploded view of a hot and cold plate wafer receiving support rod adjustment tool according to a preferred embodiment of the present invention. 6 This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm). 5. Description of the invention (f) Figure 3 shows the use of the hot and cold plate wafer receiving support rod adjustment tool shown in Figure 2. Schematic illustration of the method. Description of drawing symbols = 100, 200: hot and cold plates 102, 220: wafer receiving support rods 104, 224: support rod fixing bases 495898 7531twf.doc / 006 ^ B7 106: wafer 108: wafer receiving surface 110 ·· Heating zone 112, 222: Heating zone indicator 202: Base 204: Screw 206: Base 208: Adjustment pads 210, 214, 217: Through hole 212: Calibration disk 216: Nut 218: Adjustment device embodiment Figure 2 is not an exploded view of the hot and cold plate wafer receiving support rod adjustment tool of the preferred embodiment of the present invention. Fig. 3 is a schematic diagram showing a method of using the hot- and cold-plate wafer receiving support rod adjustment tool shown in Fig. 2. Please refer to Figures 2 and 3 for the adjustment device 218 from the bottom to the top in order from the base 206 containing the screw, a plurality of adjustment pads 208, the calibration disc 7 This paper size applies to Chinese National Standards (CNS) A4 size (210 x 297 mm) (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
經濟部智慧財產局員工消費合作社印製 495898 7 5 3 1twf . doc/ 0 0 6 ^ B7 五、發明說明（g) 212、以及螺帽216所構成，詳細說明如後。 基座206係由具有一定重量之底座202以及連接於底 座202之螺桿204所構成，其中底座202之材質例如是金 屬，然並不以此爲限，底座2〇2之材質也可以爲其他具有 足夠重量之非金屬材質或合金。底座202係爲之截面形狀 爲圓形之柱狀體’然並不以此爲限，底座202之橫截面形 狀也可以爲矩形、三角形、星形、多邊形或任意形狀。 調整墊片208係爲圓盤狀體，且在中心處具有一個對 應套接於螺桿204之貫穿孔210。另外，各調整墊片208 之厚度可以相同’也可以不同，係視實際需要而定。又， 調整墊片208之截面尺寸可與底座202之截面尺寸相同、 或小於底座202之截面尺寸、或大於底座202之截面尺寸， 視實際需要而定，其中較佳爲與底座202之截面尺寸相同。 在此實施例中雖以調整墊片208爲圓盤狀體爲例進行說 明，然並不以此爲限，調整墊片208也可以爲截面形狀爲 矩形、三角形、星形、多邊形或是任意形狀的盤狀物。 校正盤212係爲圓盤狀物，且在中心處具有一個對應 套接於螺桿204之貫穿孔214。又，校正盤212之厚度係 視實際需要而定。在此實施例中雖以校正盤212爲圓盤狀 體爲例進行說明，然並不以此爲限，校正盤212也可以爲 截面形狀爲矩形、三角形、星形、多邊形或是任意形狀的 盤狀物。 螺帽216係具有一個與螺桿204對應套接之貫穿螺 孔，且可利用螺帽216將套接於螺桿204之多個調整墊片 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝---- 訂---------線· 495898 7 5 3 1twf ·doc/〇 〇 6 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（β) 208與校正盤212緊密固定於基座206上，以完成調整裝 置218之組裝。另外，螺帽216之最大截面尺寸必需大於 校正盤212之貫穿孔217之截面尺寸，且螺帽216之貫穿 螺孔之紋路需與螺桿204之紋路緊密配合。 接著，對本發明之冷熱板晶圓承接支撐桿調整工具之 使用方法進行詳細地敘述。首先，由前述之多個調整墊片 208中挑選出部分調整墊片208，以使此部分調整墊片208 與底座202之高度總和符合晶圓承接支撐桿220之待調整 高度。再將所挑出之多個調整墊片208依序套接於基座206 之螺桿204上。 接著，將校正盤212套接於基座206之螺桿204上， 且校正盤212疊置於已套接於螺桿204上之調整墊片208 上。再利用螺帽216將已套接於螺桿204上之調整墊片208 與校正盤212固定於基座206上以完成調整裝置218 (調 整工具）之組裝。 接著，再將調整裝置218放置於由位於冷熱板200之 加熱區標示物222內之全部晶圓承接支撐桿220所構成之 區域內，此時，校正盤212之橫截面所涵蓋之範圍包括全 部晶圓承接支撐桿220所構成之區域。之後，昇起晶圓承 接支撐桿220至最高位置，以使全部之晶圓承接支撐桿220 之頂面與校正盤212之靠近底座202之表面相接觸。由於 調整裝置218本身具有之重量超過昇起晶圓承接支撐桿220 時所施加之力量，因此，當晶圓承接支撐桿220昇至與校 正盤212相接觸之後，此與校正盤212接觸之晶圓承接支 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) #: 裝 · •線. 495898 77 經濟部智慧財產局員工消費合作社印製 7531twf·doc/006 發明說明（β) 撐桿220即受到調整裝置218之阻力而停止其昇起之動 作。 當晶圓承接支撐桿220與校正盤212接觸後，將此晶 圓承接支撐桿220鎖緊於支撑桿固定基座224上，直到全 部之晶圓承接支撐桿220皆已鎖緊於支撐桿固定基座224 後，即完成冷熱板晶圓承接支撐桿220之高度調整動作。 另外，本發明之調整裝置雖然以置於由晶圓承接支撐 桿所圍成之區域中之實施狀態爲例進行說明，然並非用以 限定本發明，只要可使待調整之全部晶圓承接支撐桿皆位 於調整裝置的校正盤所涵蓋之範圍內，本發明之調整裝置 亦可置於加熱板之任何位置上。 又，本發明之調整裝置雖然以調整位於冷熱板之晶_ 承接支撐桿之高度爲例進行說明，然並非用以限定本發 明，在不脫離本發明之精神和範圍內，本發明之調整裝寶 也可以用以調整各種具有可向上伸出之承接桿的裝置中的 承接桿的高度。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍內，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者爲準。 10 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 495898 7 5 3 1twf .doc / 0 0 6 ^ B7 V. Description of invention (g) 212 and nut 216, detailed description is as follows. The base 206 is composed of a base 202 with a certain weight and a screw 204 connected to the base 202. The material of the base 202 is, for example, metal, but it is not limited to this. The material of the base 202 can also be other materials. Sufficient weight of non-metallic materials or alloys. The base 202 is a cylindrical body whose cross-sectional shape is a circular shape. Of course, the cross-sectional shape of the base 202 may be rectangular, triangular, star-shaped, polygonal, or any shape. The adjusting washer 208 is a disc-shaped body, and has a through hole 210 correspondingly sleeved on the screw 204 at the center. In addition, the thicknesses of the adjustment pads 208 may be the same or different, depending on actual needs. In addition, the cross-sectional size of the adjusting pad 208 may be the same as the cross-sectional size of the base 202, or smaller than the cross-sectional size of the base 202, or larger than the cross-sectional size of the base 202, and it is preferably determined according to actual needs. the same. In this embodiment, although the adjusting spacer 208 is a disc-shaped body as an example, it is not limited to this. The adjusting spacer 208 may be rectangular, triangular, star-shaped, polygonal, or any shape. Shaped discs. The calibration disc 212 is a disc-shaped object, and has a through hole 214 corresponding to the screw 204 at the center. The thickness of the calibration disc 212 depends on actual needs. In this embodiment, although the correction disk 212 is a disc-shaped body for example, it is not limited thereto. The correction disk 212 may be rectangular, triangular, star-shaped, polygonal, or any shape. Dish. The nut 216 is provided with a through screw hole corresponding to the screw 204, and the nut 216 can be used to adjust a plurality of adjusting pads sleeved on the screw 204. The paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) Packing ---- Order --------- Line · 495898 7 5 3 1twf · doc / 〇〇6 A7 B7 Ministry of Economic Affairs Printed by the Intellectual Property Bureau's Consumer Cooperative. V. Description of Invention (β) 208 and calibration plate 212 are tightly fixed on the base 206 to complete the assembly of the adjustment device 218. In addition, the maximum cross-sectional size of the nut 216 must be larger than the cross-sectional size of the through-hole 217 of the calibration disc 212, and the pattern of the through-the-hole of the nut 216 must closely match the pattern of the screw 204. Next, the method of using the hot and cold plate wafer receiving support rod adjustment tool of the present invention will be described in detail. First, a part of the adjusting shims 208 is selected from the aforementioned plurality of adjusting shims 208 so that the total height of this part of the adjusting shims 208 and the base 202 conforms to the height to be adjusted of the wafer receiving support bar 220. Then, the selected adjusting pads 208 are sequentially sleeved on the screw 204 of the base 206. Next, the calibration disc 212 is sleeved on the screw 204 of the base 206, and the calibration disc 212 is stacked on the adjustment pad 208 which has been sleeved on the screw 204. The nut 216 is then used to fix the adjusting pad 208 and the calibration disc 212 that have been sleeved on the screw 204 to the base 206 to complete the assembly of the adjusting device 218 (adjusting tool). Next, the adjustment device 218 is placed in the area formed by all the wafer receiving support rods 220 located in the heating area marker 222 of the hot and cold plate 200. At this time, the range covered by the cross section of the calibration plate 212 includes all The wafer receives the area formed by the supporting rod 220. After that, the wafer receiving support rods 220 are raised to the highest position so that the top surfaces of all the wafer receiving support rods 220 are in contact with the surface of the calibration disc 212 near the base 202. Since the weight of the adjusting device 218 exceeds the force applied when the wafer receiving support bar 220 is lifted, after the wafer receiving support bar 220 is raised to contact the calibration disc 212, the crystal contacting the calibration disc 212 contacts the wafer. Round receiving branch 9 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) #: 装 · • 线. 495898 77 Intellectual Property Bureau, Ministry of Economic Affairs Printed by the employee consumer cooperative. 7531twf · doc / 006 Description of the Invention (β) The stay 220 is stopped by the adjustment device 218 to stop its raising operation. After the wafer receiving support rod 220 is in contact with the calibration disk 212, the wafer receiving support rod 220 is locked on the support rod fixing base 224 until all the wafer receiving support rods 220 are locked on the support rod. After the base 224, the height adjustment of the hot and cold plate wafer receiving support rod 220 is completed. In addition, although the adjustment device of the present invention is described by taking an implementation state placed in an area surrounded by a wafer receiving support bar as an example, it is not intended to limit the present invention, as long as all wafers to be adjusted can be supported. The rods are all within the range covered by the calibration disc of the adjustment device, and the adjustment device of the present invention can also be placed on any position of the heating plate. In addition, although the adjusting device of the present invention is described by taking as an example the adjustment of the height of the crystal located on the hot and cold plate_receiving support rod, it is not intended to limit the present invention. The adjusting device of the present invention does not depart from the spirit and scope of the present invention. Po can also be used to adjust the height of the post in various devices with an upwardly extending post. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application. 10 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -----