JPS63167730U - - Google Patents
Info
- Publication number
- JPS63167730U JPS63167730U JP6097887U JP6097887U JPS63167730U JP S63167730 U JPS63167730 U JP S63167730U JP 6097887 U JP6097887 U JP 6097887U JP 6097887 U JP6097887 U JP 6097887U JP S63167730 U JPS63167730 U JP S63167730U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- liquid
- semiconductor wafer
- temperature control
- supply tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Description
第１図は本考案の一実施例を示すライン構成図
、第２図は従来の半導体ウエハエツチング装置を
示すライン構成図である。
１：ウエハチヤツクヘツド、２：半導体ウエハ
、３：エツチング槽、４：エツチング液、５：液
温コントロール槽、６：ヒータ、７：ポンプ、８
：フイルタ、１０：エツチング液貯留供給槽、１
１：支持柱、１２：バルブ、１３：ＰＨメータ、
１４：モータ。
FIG. 1 is a line configuration diagram showing an embodiment of the present invention, and FIG. 2 is a line configuration diagram showing a conventional semiconductor wafer etching apparatus. 1: Wafer chuck head, 2: Semiconductor wafer, 3: Etching bath, 4: Etching liquid, 5: Liquid temperature control bath, 6: Heater, 7: Pump, 8
: Filter, 10: Etching liquid storage supply tank, 1
1: Support pillar, 12: Valve, 13: PH meter,
14: Motor.
Claims (1)
液温コントロール槽と、この液温コントロール槽
から供給された前記エツチング液で半導体ウエハ
をエツチングするエツチング槽とを備えた半導体
ウエハエツチング装置において、前記液温コント
ロール槽と前記エツチング槽との間で、上下方向
に移動可能に支持されかつ前記エツチング槽より
も高所に位置させられたオーバフロウ式エツチン
グ液貯留供給槽と、このエツチング液貯留供給槽
に設けられ、前記エツチング液の濃度を測定する
ＰＨメータと、このＰＨメータからの信号に基づ
いて前記エツチング液貯留供給槽を上下動させる
モータとを設け、前記エツチング液貯留供給槽に
発生する水圧によつて前記エツチング液を前記半
導体ウエハへ噴流させてエツチングすることを特
徴とする半導体ウエハエツチング装置。 In a semiconductor wafer etching apparatus comprising a liquid temperature control bath for controlling an etching liquid at a constant temperature, and an etching bath for etching a semiconductor wafer with the etching liquid supplied from the liquid temperature control bath, the liquid temperature control bath and the etching tank, an overflow type etching liquid storage and supply tank supported movably in the vertical direction and located at a higher place than the etching tank; A PH meter that measures the concentration of the etching solution and a motor that moves the etching solution storage and supply tank up and down based on the signal from the PH meter are provided, and the etching solution is controlled by the water pressure generated in the etching solution storage and supply tank. A semiconductor wafer etching apparatus characterized in that etching is performed by jetting a liquid onto the semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6097887U JPS63167730U (en) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6097887U JPS63167730U (en) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167730U true JPS63167730U (en) | 1988-11-01 |
Family
ID=30893888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6097887U Pending JPS63167730U (en) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167730U (en) |
-
1987
- 1987-04-22 JP JP6097887U patent/JPS63167730U/ja active Pending