JPS6316444U - - Google Patents
Info
- Publication number
- JPS6316444U JPS6316444U JP1986110962U JP11096286U JPS6316444U JP S6316444 U JPS6316444 U JP S6316444U JP 1986110962 U JP1986110962 U JP 1986110962U JP 11096286 U JP11096286 U JP 11096286U JP S6316444 U JPS6316444 U JP S6316444U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- resin plate
- electronic circuit
- circuit device
- thicker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
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- H10W72/884—
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- H10W90/734—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986110962U JPS6316444U (enExample) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986110962U JPS6316444U (enExample) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316444U true JPS6316444U (enExample) | 1988-02-03 |
Family
ID=30990446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986110962U Pending JPS6316444U (enExample) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316444U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498760A (enExample) * | 1972-05-24 | 1974-01-25 |
-
1986
- 1986-07-18 JP JP1986110962U patent/JPS6316444U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498760A (enExample) * | 1972-05-24 | 1974-01-25 |