JPS6316443U - - Google Patents
Info
- Publication number
- JPS6316443U JPS6316443U JP11096186U JP11096186U JPS6316443U JP S6316443 U JPS6316443 U JP S6316443U JP 11096186 U JP11096186 U JP 11096186U JP 11096186 U JP11096186 U JP 11096186U JP S6316443 U JPS6316443 U JP S6316443U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- hole
- resin plate
- lead frame
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
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- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11096186U JPS6316443U (enExample) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11096186U JPS6316443U (enExample) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316443U true JPS6316443U (enExample) | 1988-02-03 |
Family
ID=30990444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11096186U Pending JPS6316443U (enExample) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316443U (enExample) |
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1986
- 1986-07-18 JP JP11096186U patent/JPS6316443U/ja active Pending