JPS63157166U - - Google Patents

Info

Publication number
JPS63157166U
JPS63157166U JP1987049117U JP4911787U JPS63157166U JP S63157166 U JPS63157166 U JP S63157166U JP 1987049117 U JP1987049117 U JP 1987049117U JP 4911787 U JP4911787 U JP 4911787U JP S63157166 U JPS63157166 U JP S63157166U
Authority
JP
Japan
Prior art keywords
circuit board
hole
protrusion
conductive film
shield case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987049117U
Other languages
Japanese (ja)
Other versions
JPH0455418Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987049117U priority Critical patent/JPH0455418Y2/ja
Publication of JPS63157166U publication Critical patent/JPS63157166U/ja
Application granted granted Critical
Publication of JPH0455418Y2 publication Critical patent/JPH0455418Y2/ja
Expired legal-status Critical Current

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  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例の断面図、第２図
は従来例の斜視図、第３図は従来例の断面図であ
る。 １……基板、２……導電性被膜、３……回路基
板、６……シールドケース、１１……貫通孔、１
２……導電性被膜、１４……突起、１６……ハン
ダ。 FIG. 1 is a sectional view of an embodiment of this invention, FIG. 2 is a perspective view of a conventional example, and FIG. 3 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Board, 2... Conductive film, 3... Circuit board, 6... Shield case, 11... Through hole, 1
2... Conductive film, 14... Protrusion, 16... Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の表面に導電性被膜が形成されてなる回路
基板と、この回路基板を収納するシールドケース
とを備え、上記電子回路基板には、内面が導電性
被膜で覆われた貫通孔が形成され、上記シールド
ケースには、上記貫通孔に挿入される突起が形成
されるとともに、貫通孔内面の導電性被膜と突起
とが鑞付けされていることを特徴とする電子回路
基板の接地構造。 A circuit board having a conductive film formed on the surface of the board, and a shield case housing the circuit board, the electronic circuit board having a through hole whose inner surface is covered with the conductive film, A grounding structure for an electronic circuit board, wherein the shield case is formed with a protrusion to be inserted into the through hole, and the protrusion is brazed to a conductive coating on the inner surface of the through hole.
JP1987049117U 1987-04-01 1987-04-01 Expired JPH0455418Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987049117U JPH0455418Y2 (en) 1987-04-01 1987-04-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987049117U JPH0455418Y2 (en) 1987-04-01 1987-04-01

Publications (2)

Publication Number Publication Date
JPS63157166U true JPS63157166U (en) 1988-10-14
JPH0455418Y2 JPH0455418Y2 (en) 1992-12-25

Family

ID=30871269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987049117U Expired JPH0455418Y2 (en) 1987-04-01 1987-04-01

Country Status (1)

Country Link
JP (1) JPH0455418Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49137088U (en) * 1973-03-28 1974-11-26
JPS5511181U (en) * 1978-07-10 1980-01-24
JPS5552779U (en) * 1978-10-05 1980-04-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49137088U (en) * 1973-03-28 1974-11-26
JPS5511181U (en) * 1978-07-10 1980-01-24
JPS5552779U (en) * 1978-10-05 1980-04-08

Also Published As

Publication number Publication date
JPH0455418Y2 (en) 1992-12-25

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