JPS6315707B2 - - Google Patents
Info
- Publication number
- JPS6315707B2 JPS6315707B2 JP16141480A JP16141480A JPS6315707B2 JP S6315707 B2 JPS6315707 B2 JP S6315707B2 JP 16141480 A JP16141480 A JP 16141480A JP 16141480 A JP16141480 A JP 16141480A JP S6315707 B2 JPS6315707 B2 JP S6315707B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hot plate
- soldering
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 22
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55161414A JPS5785292A (en) | 1980-11-18 | 1980-11-18 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55161414A JPS5785292A (en) | 1980-11-18 | 1980-11-18 | Soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5785292A JPS5785292A (en) | 1982-05-27 |
| JPS6315707B2 true JPS6315707B2 (enExample) | 1988-04-06 |
Family
ID=15734638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55161414A Granted JPS5785292A (en) | 1980-11-18 | 1980-11-18 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5785292A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4672402B2 (ja) * | 2005-03-16 | 2011-04-20 | 日立マクセル株式会社 | 微細接合方法および装置 |
-
1980
- 1980-11-18 JP JP55161414A patent/JPS5785292A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5785292A (en) | 1982-05-27 |
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