JPS6315707B2 - - Google Patents
Info
- Publication number
- JPS6315707B2 JPS6315707B2 JP16141480A JP16141480A JPS6315707B2 JP S6315707 B2 JPS6315707 B2 JP S6315707B2 JP 16141480 A JP16141480 A JP 16141480A JP 16141480 A JP16141480 A JP 16141480A JP S6315707 B2 JPS6315707 B2 JP S6315707B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- hot plate
- soldering
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 22
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 230000004907 flux Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
この発明は、プリント基板の銅箔電極から外部
電極を取出す場合に、プリント基板の銅箔電極
と、外部電極を形成するコムリードとを接続する
ための半田付装置の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a soldering device for connecting a copper foil electrode of a printed circuit board and a comb lead forming an external electrode when taking out an external electrode from a copper foil electrode of a printed circuit board. It is about improvement.
次に、プリント基板の銅箔電極とコムリードと
を半田付接続するための、従来の半田付装置につ
いて説明する。 Next, a conventional soldering device for soldering connection between a copper foil electrode of a printed circuit board and a com lead will be described.
プリント基板の銅箔電極とコムリードとの半田
付は、第１図に示すごとく所定の銅箔パターンを
所定ピツチ間隔に加工処理したプリント基板１０
のパイロツト穴１１を第４図Ａ，Ｂに示すパレツ
ト４０のプリント基板位置決めピン４１へ挿入す
る。次に第２図に示す半田デイツプ加工およびフ
ラツクス塗布が予め行なわれているコムリード２
０のパイロツト穴２１を上記パレツト４０のパイ
ロツトピン４２へ挿入して第３図に示されるよう
に組立てた後、コムリード２０の浮き上りを防止
するための押え棒４３を所定場所に配置する。そ
の後、プリント基板１０とコムリード２０とが所
定位置に載置されたパレツト４０を第５図に示す
半田付装置の所定位置、すなわちパレツト４０の
側面と２本の位置決めピン５１，５１が接触し、
かつパレツト４０に保持されたプリント基板１０
とコムリード２０が重なつている半田付接合部分
へ半田付装置５０の熱板５２の半田溶融面５３が
接触する位置にパレツト４０を載置する。次に操
作スイツチをONすることによりエアーシリンダ
ー５４により断熱材５５を介して熱板５２が下降
し、パレツト４０の所定位置に置乗されたプリン
ト基板１０、及びコムリード２０の重なつた部分
に、半田溶融面５３をタイマで制御される所定時
間（数秒）だけ押圧し、その部分の半田を溶融さ
せてプリント基板１０の銅箔１２とコムリード２
０との半田付作業を実施していた。 Soldering between the copper foil electrodes of the printed circuit board and the com lead is carried out using the printed circuit board 10, which has a predetermined copper foil pattern processed at a predetermined pitch interval, as shown in FIG.
Insert the pilot hole 11 into the printed circuit board positioning pin 41 of the pallet 40 shown in FIGS. 4A and 4B. Next, COMLEAD 2, which has been subjected to solder dip processing and flux application as shown in Fig.
After inserting the pilot hole 21 of No. 0 into the pilot pin 42 of the pallet 40 and assembling it as shown in FIG. 3, a presser bar 43 for preventing the com lead 20 from floating up is placed in a predetermined position. Thereafter, the pallet 40 with the printed circuit board 10 and the com lead 20 placed in the predetermined position is moved to a predetermined position of the soldering apparatus shown in FIG. ,
and the printed circuit board 10 held on the pallet 40
The pallet 40 is placed at a position where the solder melting surface 53 of the hot plate 52 of the soldering device 50 comes into contact with the soldering joint portion where the com lead 20 and the com lead 20 overlap. Next, by turning on the operation switch, the hot plate 52 is lowered by the air cylinder 54 through the heat insulating material 55, and the printed circuit board 10 placed at a predetermined position on the pallet 40 and the overlapping part of the com lead 20 are touched. , the solder melting surface 53 is pressed for a predetermined time (several seconds) controlled by a timer, and the solder in that area is melted, and the copper foil 12 of the printed circuit board 10 and the com lead 2 are melted.
0 was conducting soldering work.
しかし、このような半田付装置では、熱板５２
の半田溶融面５３へ直接にコムリード２０に予め
施された半田及びフラツクスが接触するので、数
回程度連続して作業を行なうと、熱板５２の半田
溶融面５３がフラツクスで汚れ、熱伝導率が低下
して半田付状態が悪くなる。このため半田付作業
を数回連続して実施した後には、紙ヤスリで熱板
５２の半田溶融面５３を研磨する必要があつた。
しかしながら紙ヤスリで削り過ると半田溶融面５
３の平行度が悪くなり半田付状態が劣化するの
で、この研磨作業には熟練を要した。 However, in such a soldering device, the hot plate 52
Since the solder and flux previously applied to the com lead 20 come into direct contact with the solder melting surface 53 of the hot plate 52, if the operation is performed several times in succession, the solder melting surface 53 of the hot plate 52 will be contaminated with flux and the heat conduction will be affected. The rate decreases and the soldering condition deteriorates. Therefore, after performing the soldering work several times in succession, it was necessary to polish the solder melting surface 53 of the hot plate 52 with sandpaper.
However, if you sand too much with sandpaper, the solder melting surface 5
This polishing work required skill because the parallelism of the parts 3 and 3 deteriorated and the soldering condition deteriorated.
さらには、コムリード２０に予め施した半田の
厚みが１コム内でバラついているため、熱板５２
の半田溶融面５３とコムリード２０とが点接触と
なり熱板５２の長手方向のどちらか一方の半田付
状態が悪くなり、安定した半田付作業を行なうこ
とができない等の問題があつた。 Furthermore, since the thickness of the solder applied to the com lead 20 in advance varies within one com, the hot plate 52
The solder melting surface 53 and the com lead 20 come into point contact, resulting in a poor soldering condition on either side of the hot plate 52 in the longitudinal direction, resulting in problems such as the inability to perform stable soldering work.
この発明の目的は、このような問題を解消した
半田付装置を提供することである。次に、この発
明の半田付装置の実施例を図面に基づいて説明す
る。第６図は、この発明の半田付装置に使用され
るパレツトの構造を示すものであつて、同図Ａは
平面図であり、ＢはＸ−X′における断面図であ
る。このパレツト６０は、プリント基板１０とコ
ムリード２０を所定位置へ載置するパイロツトピ
ン６１，６２とプリント基板１０の各電極１２を
個々に後述する半田付装置の熱板の半田溶融面に
密着させる摺動可能な複数個の押圧ピン６３と、
押圧ピン６３と同数の穴を有する摺動台６４とで
構成されている。摺動台６４には、４本の段付軸
６５が固定されており、この段付軸６５はベース
６６の穴と円滑に摺動する。通常、摺動台６４
は、圧縮バネ６７により最上方（図中Ｙ方向）に
位置している。さらに、ベース６６には、摺動可
能な状態に複数個の押圧ピン６３が所定ピツチ間
隔、すなわちコムリード２０と同一ピツチで保持
されている。この押圧ピン６３は、摺動台６４が
最上方の位置にあるとき、摺動台６４の押圧ピン
挿入穴６８の上面より所定量だけ下つた位置まで
圧縮バネ６９により押し上げられている。 An object of the present invention is to provide a soldering device that eliminates such problems. Next, an embodiment of the soldering device of the present invention will be described based on the drawings. FIG. 6 shows the structure of a pallet used in the soldering apparatus of the present invention, in which A is a plan view and B is a sectional view taken along line X-X'. This pallet 60 brings the pilot pins 61, 62, which place the printed circuit board 10 and the com lead 20 into predetermined positions, and each electrode 12 of the printed circuit board 10 into close contact with the solder melting surface of a hot plate of a soldering device, which will be described later. A plurality of sliding press pins 63;
It is composed of a pressing pin 63 and a sliding base 64 having the same number of holes. Four stepped shafts 65 are fixed to the sliding table 64, and these stepped shafts 65 slide smoothly into holes in the base 66. Usually, the sliding table 64
is located at the uppermost position (in the Y direction in the figure) by a compression spring 67. Furthermore, a plurality of pressing pins 63 are slidably held on the base 66 at predetermined pitch intervals, that is, at the same pitch as the com lead 20. This pressing pin 63 is pushed up by a compression spring 69 to a position below the upper surface of the pressing pin insertion hole 68 of the sliding table 64 by a predetermined amount when the sliding table 64 is at the uppermost position.
第７図は、この発明に基づく半田付装置の斜視
図であつて、図において熱板７１が断熱材７２を
介して固定された移動ベース７３の両端には、２
本のアーム７４，７４′が結合されており、一方
のアーム７４には、アルミニユーム箔テープ送り
出しリール７５が、他方のアーム７４′には、モ
ーター７６を介して駆動されるアルミニユーム箔
テープ巻取りリール７５′が保持されている。ア
ルミニユーム箔テープ７７は、熱板７１の半田溶
融面７１′を覆うごとく、送り出しリール７５と
巻取りリール７５′との間に張架されている。 FIG. 7 is a perspective view of the soldering apparatus based on the present invention, and in the figure, there are two
Two arms 74, 74' are connected, one arm 74 has an aluminum foil tape delivery reel 75, and the other arm 74' has an aluminum foil tape take-up reel driven via a motor 76. 75' is retained. The aluminum foil tape 77 is stretched between the delivery reel 75 and the take-up reel 75' so as to cover the solder melting surface 71' of the hot plate 71.
次に、このように構成されたパレツト６０と半
田付装置７０とを使用してプリント基板１０とコ
ムリード２０とを半田付する手順について説明す
る。第６図Ａ，Ｂに示すパレツト６０の摺動台６
４のパイロツトピン６１，６１に所定の処理を施
こしたプリント基板１０を挿入し、次にパイロツ
トピン６２，６２へ半田デイツプ加工、フラツク
ス塗布を施こしたコムリード２０を挿入する。そ
の後コムリード２０の浮き上りを防止するため
に、第４図に示されたような押え棒４３を置乗す
る。 Next, a procedure for soldering the printed circuit board 10 and the com lead 20 using the pallet 60 and the soldering device 70 configured as described above will be described. Slide table 6 of pallet 60 shown in FIGS. 6A and B
The printed circuit board 10 which has been subjected to a predetermined treatment is inserted into the pilot pins 61 and 61 of No. 4, and then the com lead 20 which has been subjected to solder dip processing and flux coating is inserted into the pilot pins 62 and 62. Thereafter, in order to prevent the com lead 20 from floating up, a presser bar 43 as shown in FIG. 4 is placed on it.
このような準備を行なつたパレツト６０を第７
図に示す半田付装置７０の所定位置に配置する。
すなわち、パレツト６０に保持されたプリント基
板１０とコムリード２０の重なつた部分（半田付
接合部分）に熱板７１の半田溶融面７１′が、規
定どうりに接触するよう半田付装置７０のベース
に配設されている３本の位置決めピン７８，７
８，７８に、パレツト６０の２つの側面が当接す
る状態に配置する。 Palette 60 prepared in this way is
It is placed at a predetermined position in the soldering device 70 shown in the figure.
That is, the soldering device 70 is operated so that the solder melting surface 71' of the hot plate 71 comes into contact with the overlapping part (soldering joint part) of the printed circuit board 10 and the com lead 20 held on the pallet 60 as specified. Three positioning pins 78, 7 arranged on the base
8 and 78, the two sides of the pallet 60 are placed in contact with each other.
次に、半田付装置７０の図示されていない押釦
スイツチをONすることにより、エアーシリンダ
ー７９を介して移動ベース７３と共に熱板７１及
びアルミニユーム箔テープ７７が定位置まで下降
し、プリント基板１０とコムリード２０の接合部
を押圧する。その結果、パレツト６０の摺動台６
４が下つて押圧ピン６３がプリント基板１０の底
面を押圧する状態となる。アルミニユーム箔テー
プ７７を介して熱板７１の半田溶融面を所定時間
だけ当接することによりコムリード２０に予め施
されていた半田が溶融され、タイマーからの指令
により一定時間の加熱後、移動ベース７３と共に
熱板７１及びアルミニユーム箔テープ７７が上昇
し、プリント基板１０の電極１２とコムリード２
０とが規定どうりに半田付される。そして、この
アルミニユーム箔テープ７７は、所定回数の半田
付を作業を行なつた後、自動的に一定ピツチ、す
なわち熱板７１の長手方向の長さ分だけモーター
７６によつて巻き取られる。 Next, by turning on a push button switch (not shown) of the soldering device 70, the hot plate 71 and the aluminum foil tape 77 are lowered together with the moving base 73 via the air cylinder 79 to a fixed position, and the printed circuit board 10 and the comb Press the joint of the lead 20. As a result, the slide table 6 of the pallet 60
4 is lowered, and the pressing pin 63 is in a state of pressing the bottom surface of the printed circuit board 10. By contacting the solder melting surface of the hot plate 71 for a predetermined time via the aluminum foil tape 77, the solder previously applied to the com lead 20 is melted, and after heating for a predetermined time according to a command from the timer, the movable base 73 At the same time, the hot plate 71 and the aluminum foil tape 77 rise, and the electrodes 12 of the printed circuit board 10 and the com lead 2
0 and are soldered as specified. After the aluminum foil tape 77 has been soldered a predetermined number of times, it is automatically wound up by the motor 76 at a predetermined pitch, that is, by the length of the hot plate 71 in the longitudinal direction.
以上、述べたように、この発明の半田付装置に
おいては、プリント基板の銅箔電極とコムリード
との接合部を、交換可能なアルミニユーム箔テー
プを介して加熱するように構成されているので、
常に一定した熱伝達を得ることができると共に、
このアルミニユーム箔テープによつて熱板へのフ
ラツクス付着が防止されるので熱板の半田溶融面
の腐蝕等による凹凸の発生を防止することがで
き、さらには熱板の半田溶融面をプリント基板と
密着させるための個々に独立した押圧ピンをプリ
ント基板の裏面より当接するように構成されてい
るので、一本毎のコムリードの半田デイツプに厚
みのバラつきがあつても、これが緩和され、緩和
するもので安定した半田付状態が得られる。 As described above, the soldering apparatus of the present invention is configured to heat the joint between the copper foil electrode of the printed circuit board and the com lead through the replaceable aluminum foil tape.
It is possible to always obtain constant heat transfer, and
Since this aluminum foil tape prevents flux from adhering to the hot plate, it is possible to prevent the occurrence of unevenness due to corrosion etc. on the solder melting surface of the hot plate.Furthermore, the solder melting surface of the hot plate can be connected to the printed circuit board. Since the individual press pins are configured to come into contact with the back side of the printed circuit board to ensure close contact, even if there is variation in the thickness of the solder dip of each com lead, this can be alleviated and alleviated. A stable soldering condition can be obtained.
第１図は、プリント基板の平面図、第２図は、
前記プリント基板の銅箔電極に半田付されるコム
リードの平面図、第３図は、プリント基板とコム
リードとの組立状態を示す平面図、第４図は、従
来のパレツトの構造を示す図であつて、Ａは平面
図であり、ＢはＸ−X′における断面図、第５図
は、従来の半田付装置の斜視図、第６図は、この
発明の半田付装置に使用されるパレツトの一実施
例を示す図であつて、Ａは平面図であり、ＢはＸ
−X′における断面図、第７図は、この発明の半
田付装置の一実施例を示すための斜視図である。
１０……プリント基板、２０……コムリード、
４０……パレツト、４３……押え棒、５０……半
田付装置、５１……位置決めピン、５２……熱
板、５３……半田溶融面、５４……エアーシリン
ダー、５５……断熱材、６０……パレツト、６
１，６２……パイロツトピン、６３……押圧ピ
ン、６４……摺動台、６５……段付軸、６６……
ベース、６７……圧縮バネ、６８……押圧ピン挿
入穴、６９……圧縮バネ、７０……半田付装置、
７１……熱板、７１′……半田溶融面、７２……
断熱材、７３……移動ベース、７４，７４′……
アーム、７５，７５′……リール、７６……モー
ター、７７……アルミニユーム箔テープ、７８…
…位置決めピン。
Figure 1 is a plan view of the printed circuit board, Figure 2 is
A plan view of the com lead soldered to the copper foil electrode of the printed circuit board, FIG. 3 is a plan view showing the assembled state of the printed board and the com lead, and FIG. 4 is a diagram showing the structure of a conventional pallet. A is a plan view, B is a sectional view taken along line X-X', FIG. 5 is a perspective view of a conventional soldering device, and FIG. 6 is a soldering device used in the present invention. FIG. 3 is a diagram showing an example of a palette, in which A is a plan view and B is an X
7 is a perspective view showing an embodiment of the soldering device of the present invention. 10...Printed circuit board, 20...Comlead,
40...Pallet, 43...Press bar, 50...Soldering device, 51...Positioning pin, 52...Hot plate, 53...Solder melting surface, 54...Air cylinder, 55...Insulating material, 60 ...Palette, 6
1, 62...Pilot pin, 63...Press pin, 64...Sliding base, 65...Stepped shaft, 66...
Base, 67... Compression spring, 68... Press pin insertion hole, 69... Compression spring, 70... Soldering device,
71... Hot plate, 71'... Solder melting surface, 72...
Insulation material, 73...Moving base, 74, 74'...
Arm, 75, 75'... Reel, 76... Motor, 77... Aluminum foil tape, 78...
…Positioning pin.
Claims (1)
係に載置可能で、かつ摺動可動な押圧ピンを所定
ピツチで複数箇所に各々独立して前記プリント基
板の裏面より当接可能に配設したパレツトと、下
降、上昇運動して、前記プリント基板とコムリー
ドとの重なり接合部分を加熱する熱板とを具備
し、前記プリント基板とコムリードとの接合部を
前記熱板で加熱するのに際し、アルミニユーム箔
テープを介して前記熱板を当接するようにしたこ
とを特徴とする半田付装置。1. A pallet on which a printed circuit board and a com lead can be placed in a predetermined positional relationship, and in which sliding movable press pins are arranged at a plurality of locations at a predetermined pitch so that they can each be brought into contact with the back surface of the printed circuit board independently. and a hot plate that moves downward and upward to heat the overlapping joint portion of the printed circuit board and the com lead, and when heating the joint portion of the printed circuit board and the com lead with the hot plate, A soldering device characterized in that the hot plate is brought into contact with the hot plate through an aluminum foil tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16141480A JPS5785292A (en) | 1980-11-18 | 1980-11-18 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16141480A JPS5785292A (en) | 1980-11-18 | 1980-11-18 | Soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5785292A JPS5785292A (en) | 1982-05-27 |
| JPS6315707B2 true JPS6315707B2 (en) | 1988-04-06 |
Family
ID=15734638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16141480A Granted JPS5785292A (en) | 1980-11-18 | 1980-11-18 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5785292A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4672402B2 (en) * | 2005-03-16 | 2011-04-20 | 日立マクセル株式会社 | Fine joining method and apparatus |
-
1980
- 1980-11-18 JP JP16141480A patent/JPS5785292A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5785292A (en) | 1982-05-27 |
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