JPS63155650U - - Google Patents

Info

Publication number
JPS63155650U
JPS63155650U JP1987049712U JP4971287U JPS63155650U JP S63155650 U JPS63155650 U JP S63155650U JP 1987049712 U JP1987049712 U JP 1987049712U JP 4971287 U JP4971287 U JP 4971287U JP S63155650 U JPS63155650 U JP S63155650U
Authority
JP
Japan
Prior art keywords
external lead
unconnected
wide
external
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987049712U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451489Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987049712U priority Critical patent/JPH0451489Y2/ja
Publication of JPS63155650U publication Critical patent/JPS63155650U/ja
Application granted granted Critical
Publication of JPH0451489Y2 publication Critical patent/JPH0451489Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987049712U 1987-03-31 1987-03-31 Expired JPH0451489Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987049712U JPH0451489Y2 (https=) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987049712U JPH0451489Y2 (https=) 1987-03-31 1987-03-31

Publications (2)

Publication Number Publication Date
JPS63155650U true JPS63155650U (https=) 1988-10-12
JPH0451489Y2 JPH0451489Y2 (https=) 1992-12-03

Family

ID=30872419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987049712U Expired JPH0451489Y2 (https=) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPH0451489Y2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0393257A (ja) * 1989-09-05 1991-04-18 Toshiba Corp 樹脂封止型半導体装置
JP2008060597A (ja) * 2001-05-18 2008-03-13 Sanyo Electric Co Ltd 電源回路装置
JP2010016289A (ja) * 2008-07-07 2010-01-21 Mitsubishi Electric Corp 半導体パッケージおよび半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0393257A (ja) * 1989-09-05 1991-04-18 Toshiba Corp 樹脂封止型半導体装置
JP2008060597A (ja) * 2001-05-18 2008-03-13 Sanyo Electric Co Ltd 電源回路装置
JP2010016289A (ja) * 2008-07-07 2010-01-21 Mitsubishi Electric Corp 半導体パッケージおよび半導体装置

Also Published As

Publication number Publication date
JPH0451489Y2 (https=) 1992-12-03

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