JPS6315085U - - Google Patents
Info
- Publication number
- JPS6315085U JPS6315085U JP10716286U JP10716286U JPS6315085U JP S6315085 U JPS6315085 U JP S6315085U JP 10716286 U JP10716286 U JP 10716286U JP 10716286 U JP10716286 U JP 10716286U JP S6315085 U JPS6315085 U JP S6315085U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- protrusion
- sealed container
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
及び第３図は本実施例の封止容器の平面図および
裏面図、第４図は他の実施例を示す断面図、第５
図及び第６図は従来例を示す断面図である。
１…封止容器、２…混成集積回路基板、３…封
止箱部、４…外部リード、５…ガイド部、６…第
１の突出部、７…第２の突出部。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIGS. 2 and 3 are a plan view and a back view of the sealed container of this embodiment, and FIG. 4 is a sectional view showing another embodiment. 5
FIG. 6 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... sealed container, 2... hybrid integrated circuit board, 3... sealed box part, 4... external lead, 5... guide part, 6... first protrusion part, 7... second protrusion part.
Claims (1)
着される封止容器と、前記混成集積回路基板の少
なくとも一側辺から所定ピツチを有して導出され
前記封止容器に直角に曲折され且つ先端部がＪ型
に曲折された外部リードとを具備する混成集積回
路において、前記封止容器のガイド部側面の外側
に所定間隔を有して第１の突出部を設け、該第１
の突出部と対応して前記ガイド部の側面の内側に
第２の突出部を設け、前記外部リードの中間部を
前記第１の突出部間に配し、その先端部を前記第
２の突出部間に配置して位置規制することを特徴
とする混成集積回路。 a hybrid integrated circuit board; a sealed container fixed to the hybrid integrated circuit board; In a hybrid integrated circuit comprising an external lead whose portion is bent into a J-shape, a first protruding portion is provided at a predetermined interval on the outside of a side surface of the guide portion of the sealed container, and the first protruding portion
A second protrusion is provided on the inner side of the side surface of the guide part corresponding to the protrusion, the intermediate part of the external lead is disposed between the first protrusions, and the tip thereof is connected to the second protrusion. A hybrid integrated circuit characterized by being placed between parts to regulate its position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10716286U JPH0536297Y2 (en) | 1986-07-11 | 1986-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10716286U JPH0536297Y2 (en) | 1986-07-11 | 1986-07-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6315085U true JPS6315085U (en) | 1988-02-01 |
| JPH0536297Y2 JPH0536297Y2 (en) | 1993-09-14 |
Family
ID=30983188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10716286U Expired - Lifetime JPH0536297Y2 (en) | 1986-07-11 | 1986-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536297Y2 (en) |
-
1986
- 1986-07-11 JP JP10716286U patent/JPH0536297Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0536297Y2 (en) | 1993-09-14 |
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