JPS6316451U - - Google Patents
Info
- Publication number
- JPS6316451U JPS6316451U JP11084586U JP11084586U JPS6316451U JP S6316451 U JPS6316451 U JP S6316451U JP 11084586 U JP11084586 U JP 11084586U JP 11084586 U JP11084586 U JP 11084586U JP S6316451 U JPS6316451 U JP S6316451U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- insertion hole
- step portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す斜視組立て分解
図、第２図は本実施例の固定部材の断面図、第３
図は従来例を示す断面図、第４図は従来の側面図
である。
１…混成集積回路基板、２…外部リード、３…
固定部材、４…封止容器、５…封止蓋部、６…ガ
イド部、７…溝、８…レール、９…挿入孔、１０
，１１…段差部。
Fig. 1 is a perspective exploded view showing an embodiment of the present invention, Fig. 2 is a sectional view of the fixing member of this embodiment, and Fig. 3
The figure is a sectional view showing a conventional example, and FIG. 4 is a side view of the conventional example. 1... Hybrid integrated circuit board, 2... External lead, 3...
Fixing member, 4... Sealing container, 5... Sealing lid part, 6... Guide part, 7... Groove, 8... Rail, 9... Insertion hole, 10
, 11...Stepped portion.
Claims (1)
着される封止容器と、前記混成集積回路基板の一
側辺から所定ピツチを有して複数本導出された外
部リードと、該外部リードのピツチ間と対応して
挿入孔が設けられ前記封止容器あるいは前記混成
集積回路基板に固定される固定部材とから成る混
成集積回路において、前記外部リードに段差部を
設け、該段差部と対応して前記挿入孔に段差部を
設け、前記外部リードの段差部と前記挿入孔の段
差部とを当接させることを特徴とする混成集積回
路。 A hybrid integrated circuit board, a sealing container fixed to the hybrid integrated circuit board, a plurality of external leads led out at a predetermined pitch from one side of the hybrid integrated circuit board, and a pitch of the external leads. In the hybrid integrated circuit, the external lead is provided with a stepped portion, and a fixing member is provided with an insertion hole corresponding to the gap and is fixed to the sealed container or the hybrid integrated circuit board, A hybrid integrated circuit characterized in that the insertion hole is provided with a step portion, and the step portion of the external lead and the step portion of the insertion hole are brought into contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11084586U JPS6316451U (en) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11084586U JPS6316451U (en) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316451U true JPS6316451U (en) | 1988-02-03 |
Family
ID=30990224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11084586U Pending JPS6316451U (en) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316451U (en) |
-
1986
- 1986-07-18 JP JP11084586U patent/JPS6316451U/ja active Pending
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