JPS63144956A - 平面ラツピング装置 - Google Patents
平面ラツピング装置Info
- Publication number
- JPS63144956A JPS63144956A JP61288023A JP28802386A JPS63144956A JP S63144956 A JPS63144956 A JP S63144956A JP 61288023 A JP61288023 A JP 61288023A JP 28802386 A JP28802386 A JP 28802386A JP S63144956 A JPS63144956 A JP S63144956A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- surface plate
- lapping
- support
- recognition device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61288023A JPS63144956A (ja) | 1986-12-03 | 1986-12-03 | 平面ラツピング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61288023A JPS63144956A (ja) | 1986-12-03 | 1986-12-03 | 平面ラツピング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63144956A true JPS63144956A (ja) | 1988-06-17 |
| JPH055632B2 JPH055632B2 (enExample) | 1993-01-22 |
Family
ID=17724811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61288023A Granted JPS63144956A (ja) | 1986-12-03 | 1986-12-03 | 平面ラツピング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63144956A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011083852A (ja) * | 2009-10-15 | 2011-04-28 | Hallys Corp | 研削装置 |
| JP2015013320A (ja) * | 2013-07-03 | 2015-01-22 | 浜井産業株式会社 | ワーク嵌合装置および嵌合方法 |
| TWI476854B (zh) * | 2012-03-08 | 2015-03-11 | Lg Cns Co Ltd | Led晶圓的提供裝置及方法 |
| US9045827B2 (en) | 2012-03-09 | 2015-06-02 | Lg Cns Co., Ltd. | Apparatus and method for supplying light-emitting diode (LED) wafer |
| CN105904324A (zh) * | 2015-05-28 | 2016-08-31 | 海宁奇晟轴承有限公司 | 一种自动双盘研磨机 |
| CN115870868A (zh) * | 2022-12-27 | 2023-03-31 | 西安奕斯伟材料科技有限公司 | 装卸装置、方法及硅片双面抛光设备 |
| JP2024151787A (ja) * | 2023-04-13 | 2024-10-25 | 株式会社太陽 | 両面研磨装置 |
-
1986
- 1986-12-03 JP JP61288023A patent/JPS63144956A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011083852A (ja) * | 2009-10-15 | 2011-04-28 | Hallys Corp | 研削装置 |
| TWI476854B (zh) * | 2012-03-08 | 2015-03-11 | Lg Cns Co Ltd | Led晶圓的提供裝置及方法 |
| US9045827B2 (en) | 2012-03-09 | 2015-06-02 | Lg Cns Co., Ltd. | Apparatus and method for supplying light-emitting diode (LED) wafer |
| JP2015013320A (ja) * | 2013-07-03 | 2015-01-22 | 浜井産業株式会社 | ワーク嵌合装置および嵌合方法 |
| CN105904324A (zh) * | 2015-05-28 | 2016-08-31 | 海宁奇晟轴承有限公司 | 一种自动双盘研磨机 |
| CN115870868A (zh) * | 2022-12-27 | 2023-03-31 | 西安奕斯伟材料科技有限公司 | 装卸装置、方法及硅片双面抛光设备 |
| JP2024151787A (ja) * | 2023-04-13 | 2024-10-25 | 株式会社太陽 | 両面研磨装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH055632B2 (enExample) | 1993-01-22 |
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