JPS6314470Y2 - - Google Patents
Info
- Publication number
- JPS6314470Y2 JPS6314470Y2 JP1981004759U JP475981U JPS6314470Y2 JP S6314470 Y2 JPS6314470 Y2 JP S6314470Y2 JP 1981004759 U JP1981004759 U JP 1981004759U JP 475981 U JP475981 U JP 475981U JP S6314470 Y2 JPS6314470 Y2 JP S6314470Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- main body
- semiconductor device
- package
- package main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000000605 extraction Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981004759U JPS6314470Y2 (pt) | 1981-01-16 | 1981-01-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981004759U JPS6314470Y2 (pt) | 1981-01-16 | 1981-01-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57119548U JPS57119548U (pt) | 1982-07-24 |
JPS6314470Y2 true JPS6314470Y2 (pt) | 1988-04-22 |
Family
ID=29803160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981004759U Expired JPS6314470Y2 (pt) | 1981-01-16 | 1981-01-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6314470Y2 (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7195964B2 (ja) * | 2019-02-14 | 2022-12-26 | 株式会社東芝 | スイッチング装置および電子機器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52156559A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Small electronic device packaging package |
JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
-
1981
- 1981-01-16 JP JP1981004759U patent/JPS6314470Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52156559A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Small electronic device packaging package |
JPS55153362A (en) * | 1979-05-18 | 1980-11-29 | Matsushita Electric Ind Co Ltd | Chip type semiconductor part |
Also Published As
Publication number | Publication date |
---|---|
JPS57119548U (pt) | 1982-07-24 |
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