JPS63140641U - - Google Patents
Info
- Publication number
- JPS63140641U JPS63140641U JP3176687U JP3176687U JPS63140641U JP S63140641 U JPS63140641 U JP S63140641U JP 3176687 U JP3176687 U JP 3176687U JP 3176687 U JP3176687 U JP 3176687U JP S63140641 U JPS63140641 U JP S63140641U
- Authority
- JP
- Japan
- Prior art keywords
- mounted electronic
- coating agent
- electronic component
- substrate
- soft coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、この考案の一実施例を示す半導体装
置の平面図、第２図ないし第４図は従来の半導体
装置を説明するための図であり、第２図Ａは、基
板の平面図、同図Ｂは、その側面図、第３図は、
基板の所定の面搭載型電子部品および外部リード
を配置した状態の平面図、同図Ｂは、同図ＢのＡ
―Ａ線に沿う断面図、第４図は、パウダモールド
を施して完成した半導体装置を示し、同図Ａは、
その平面図、同図Ｂは、その側面図である。
１……基板、２ａ，２ｂ……導体パターン、３
……面搭載型電子部品。
FIG. 1 is a plan view of a semiconductor device showing an embodiment of this invention, FIGS. 2 to 4 are diagrams for explaining a conventional semiconductor device, and FIG. 2A is a plan view of a substrate. , Figure B is its side view, and Figure 3 is
A plan view of the board with predetermined surface-mounted electronic components and external leads arranged, Figure B is similar to A in Figure B.
-A cross-sectional view taken along line A, Figure 4 shows a semiconductor device completed by powder molding;
Its plan view and Figure B are its side view. 1...Substrate, 2a, 2b...Conductor pattern, 3
...Surface-mounted electronic components.
Claims (1)
ーンが形成された基板を有し、この基板の導体パ
ターン上に樹脂封止された面搭載型電子部品が搭
載・固着され、この面搭載型電子部品の近傍に軟
質コート剤が塗布され、前記面搭載型電子部品お
よび前記基板全体を樹脂封止してなる半導体装置
。 (2) 前記軟質コート剤は、耐熱性を有し、かつ
硬化反応しないグリース状の軟質コート剤である
実用新案請求の範囲第１項記載の半導体装置。[Claims for Utility Model Registration] (1) A substrate having a conductive pattern formed thereon for mounting surface-mounted electronic components, and a surface-mounted electronic component sealed with resin is mounted on the conductive pattern of this substrate. - A semiconductor device in which the surface-mounted electronic component and the entire substrate are sealed with a resin, with a soft coating agent applied near the surface-mounted electronic component. (2) The semiconductor device according to claim 1, wherein the soft coating agent is a grease-like soft coating agent that has heat resistance and does not undergo curing reaction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176687U JPS63140641U (en) | 1987-03-04 | 1987-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3176687U JPS63140641U (en) | 1987-03-04 | 1987-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140641U true JPS63140641U (en) | 1988-09-16 |
Family
ID=30837804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3176687U Pending JPS63140641U (en) | 1987-03-04 | 1987-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140641U (en) |
-
1987
- 1987-03-04 JP JP3176687U patent/JPS63140641U/ja active Pending
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