JPS63137996U - - Google Patents
Info
- Publication number
- JPS63137996U JPS63137996U JP2906887U JP2906887U JPS63137996U JP S63137996 U JPS63137996 U JP S63137996U JP 2906887 U JP2906887 U JP 2906887U JP 2906887 U JP2906887 U JP 2906887U JP S63137996 U JPS63137996 U JP S63137996U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- generating electronic
- lead terminal
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Details Of Resistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図〜第３図はこの考案の一実施例を示すも
のであり、第１図、第２図はいずれも斜視図、第
３図は要部断面図、第４図はこの考案の第２実施
例を示す斜視図、第５図はこの考案の他の実施例
を示すものであり、第５図Ａは斜視図、第５図Ｂ
，Ｃはいずれも要部断面図、第６図はさらに他の
実施例を示す要部斜視図、第７図は従来例を示す
断面図である。
１……発熱型電子部品、２……リード端子、３
……導電部、４……ＦＰＣ板、７……基板、１１
，１６，１８，２３……支持部、１３，１７，１
９，２４……係合穴部。
Figures 1 to 3 show an embodiment of this invention; Figures 1 and 2 are perspective views, Figure 3 is a sectional view of the main parts, and Figure 4 is a cross-sectional view of the main parts. FIG. 5 is a perspective view showing another embodiment of the invention, FIG. 5A is a perspective view, and FIG. 5B is a perspective view showing the second embodiment.
, C are sectional views of essential parts, FIG. 6 is a perspective view of essential parts showing still another embodiment, and FIG. 7 is a sectional view of a conventional example. 1... Heat-generating electronic component, 2... Lead terminal, 3
... Conductive part, 4 ... FPC board, 7 ... Substrate, 11
, 16, 18, 23...support part, 13, 17, 1
9, 24...Engagement hole portion.
Claims (1)
子を電気的接続し、かつ前記発熱型電子部品を基
板に間隔を有して取り付けるものにおいて、一部
を開放して前記リード端子を圧入係合する係合穴
部が形成された支持部を前記基板に設けたことを
特徴とする発熱型電子部品の取付装置。 In a device in which a lead terminal of a heat-generating electronic component is electrically connected to a conductive part of an FPC board, and the heat-generating electronic component is attached to a board with a gap, a part of the heat-generating electronic component is opened and the lead terminal is press-fitted into engagement. A mounting device for a heat-generating electronic component, characterized in that the substrate is provided with a support portion in which an engagement hole is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2906887U JPH0343755Y2 (en) | 1987-02-28 | 1987-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2906887U JPH0343755Y2 (en) | 1987-02-28 | 1987-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63137996U true JPS63137996U (en) | 1988-09-12 |
| JPH0343755Y2 JPH0343755Y2 (en) | 1991-09-12 |
Family
ID=30832619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2906887U Expired JPH0343755Y2 (en) | 1987-02-28 | 1987-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343755Y2 (en) |
-
1987
- 1987-02-28 JP JP2906887U patent/JPH0343755Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0343755Y2 (en) | 1991-09-12 |
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