JPH0343755Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a mounting device for a heat-generating electronic component that is electrically connected to a printed wiring board provided with a conductive portion and generates heat when energized.

[Conventional technology]

Generally, electronic components such as resistors, capacitors, and transistors are electrically connected to a printed wiring board provided with a conductive portion made of a material with good electrical conductivity, such as copper foil, to form a predetermined electric circuit.

When the printed wiring board is mounted along a board such as the outer surface of an instrument case of a vehicle instrument, the printed wiring board can be bent and fitted along the board even if the board has uneven parts, and it can be made thinner and more compact. An FPC board (flexible printed circuit board) is suitable because it can be lightweight.

Conventionally, as a configuration for electrically connecting the electronic component to the FPC board, as disclosed in Japanese Utility Model Publication No. 57-49416, leads of the electronic component are connected to the conductive part of the FPC board mounted on the resin case. A configuration is known in which terminals are soldered and the electronic component is held between a pair of holding pieces provided oppositely to each other in the case.

However, in the configuration described above, heat-generating electronic components such as resistors that generate heat when energized in an electric circuit may transfer heat directly to the resin case and melt the case, causing damage to the case, FPC board, conductive parts, and even Because there is a risk that other electronic components placed near this heat-generating electronic component may be affected by the heat, generally speaking, considering the safety of the electrical circuit, the FPC board is installed as shown in Figure 7. can be attached to.

That is, the heat-generating electronic component 1 has a pair of lead terminals 2, and a through hole 5 is provided in an FPC board 4 on one surface of which is provided with a conductive part 3 made of a material with good electrical conductivity such as copper foil, and a through hole 5 is provided to connect the leads. The terminal 2 is inserted into the through hole 5, the tip is bent, and the terminal 2 is electrically connected to the conductive part 3 with solder 6, and is fixed to the FPC board 4 with a space around it. And said FPC
The plate 4 is mounted along the substrate 7.

In this way, the heat-generating electronic component 1 is attached to the FPC board 4 through the lead terminals 2, and even if it generates heat, it is dissipated into the air.

[Problem that the invention attempts to solve]

However, in the conventional example, the lead terminal 2
Because the heat-generating electronic component 1 is fixed to the FPC board 4 by simply soldering the tip of the , it should not be used in locations where the worker's hands or other assembly components placed nearby come into contact with each other during assembly work, or where vibration is applied after assembly. When attached to a PC, there was a problem in that stress was concentrated at the soldering points and they were easily damaged.

Also, to increase the mechanical strength of the connection point,
A hollow disk-shaped connection terminal is provided at the tip of the lead terminal 2, and this connection terminal is brought into contact with the conductive part 3 of the FPC 2, and a screw is inserted into the hollow part of the connection terminal and the through hole 5, and then tightened to the board 7. Although a fixing configuration has been proposed, it has the problem that the installation work is extremely complicated.

[Purpose of invention]

This idea was devised by focusing on the problems of the conventional example, and maintains a good electrical connection between the heat-generating electronic components through simple installation work while maintaining space around the heat-generating electronic components. The purpose of the present invention is to provide a mounting device for heat-generating electronic components that can be mounted on a heat-generating electronic component.

[Summary of the idea]

In order to achieve the above-mentioned purpose, this invention
A lead terminal of a heat-generating electronic component is electrically connected to a conductive part of a plate, and the heat-generating electronic component is attached to a board with a gap, in which a part is opened and the lead terminal is press-fitted into engagement. A support portion in which an engagement hole is formed is provided on the substrate.

[Effect of invention]

Lead terminals of the heat-generating electronic component are fixed to the FPC board at electrical connection points, and are held to the case by the support portion.

〔Example〕

1 to 3 show an embodiment of this invention, and the same or equivalent parts as in the conventional example shown in FIG. 7 will be described with the same reference numerals.

A heat-generating electronic component 1 such as a resistor that generates heat when energized is provided with a pair of lead terminals 2, and a conductive part 3 is formed at the tip of the lead terminal 2 in a through hole 5 of an FPC board (flexible printed wiring board) 4. The lead terminal 2 is inserted from the side where the conductive part 3 is not formed to the side where the conductive part 3 is formed, and then the tip of the lead terminal 2 is bent and electrically connected to the conductive part 3 with the solder 6, and the FPC board is Fixed to 4.

The FPC board 4 is mounted along the board 7, and is separated from the part of the FPC board 4 that runs along the board 7, and has a tongue piece 8 which is elastically raised and deformable. The tongue piece 8 includes a peripheral portion of the through hole 5 of the conductive part 3 which is integrally formed with the FPC board 4 and to which the through hole 5 and the lead terminal 2 are soldered.

The board 7 includes a rising wall portion 9 that elastically deforms the tongue piece 8 of the FPC board 4 and abuts against it, and a cutout recess 10 formed in the rising wall portion 9 so that the lead terminal 2 passes through the rising wall portion 9. , a pair of support parts 11 standing upright on the side opposite to the tongue piece 8 with respect to the rising wall part 9, and a lead terminal formed with a part open in the support part 11, into which the lead terminal 2 is inserted. 2, the guide groove portion 12 is wider at the rear than the front in the insertion direction, and this guide groove portion 12
An engagement hole 13 is provided which is connected to the engagement hole 13 and into which the lead terminal 2 is press-fitted.

That is, the heat-generating electronic component 1 is attached to the substrate 7.
Attach the FPC board 4 and attach the tongue piece 8 to the rising wall part 9.
While bending the lead terminal 2 so as to substantially follow it, insert the distal end side of the lead terminal 2 into the notch recess 10, insert the proximal end side of the lead terminal 2 near the electronic component 1 into the guide groove section 12, and then insert it into the engagement hole section 13. It is fixed by press-fitting.

Therefore, the heat-generating electronic component 1 has a space around the board 7 by press-fitting the lead terminal 2 into the engagement hole 13 of the support part 11, and can be easily installed. Even if external interference, vibration, etc. are applied, stress concentration on the soldering portions of the lead terminals 2 can be prevented, good electrical connection can be maintained, and the installation can be made strong.

Moreover, especially in this embodiment, the heat-generating electronic component 1
Since it is supported at a position lower than the tip of the support part 11, there is an effect that external interference to the electronic component 1 can be prevented at the tip of the support part 11. Note that the height at which the heat-generating electronic component 1 is supported is determined by the depth of the engagement groove 13, and it goes without saying that this depth may be set as appropriate.

Further, in the above embodiment, the locking pin 15 of the board 7 is press-fitted into the through hole 14 formed at the base of the tongue piece 8, and as the tongue piece 8 rises, the locking pin 15 of the board 7 is pressed into the through hole 14.
This prevents the FPC board 4 from lifting up,
The positions and numbers of the through holes 14 and locking pins 15 may be appropriately selected so that the FPC board 4 can be fixed to the substrate 7.

FIG. 4 shows a second embodiment of this invention, and the same or equivalent parts as in the previous embodiment are given the same reference numerals, and detailed explanation thereof will be omitted.

A second support part 16 is provided on the substrate 7 to be perpendicular to each support part 11, and this second support part 1
6 is formed with a second engagement hole 17 that is partially open.

The heat-generating electronic component 1 has each lead terminal 2
The supporting portion 13 and the second supporting portion 16 are orthogonal to each other.
An engagement hole 13 and a second engagement hole 17 formed in
By press-fitting into the tongue piece 8, vertical positioning with respect to the tongue piece 8 is performed by the engagement hole portion 13, and horizontal direction positioning with respect to the tongue piece 8 is performed with the second engaging hole portion 17, respectively. Since it is supported at an accurate mounting position, it is possible to suppress the resonance of the lead terminal 2 that occurs when the lead terminal 2 is tilted or vibrated during mounting, and to prevent stress concentration on the soldering location.

Note that the support section 13 and the second support section 16
If at least one of the lead terminals 2 is provided so that each lead terminal 2 is supported, electrical connection can be maintained sufficiently better than in the conventional example.

[Other Examples]

5A, B, and C show still another embodiment of this invention, in which a pair of support parts 1 are provided on the substrate 7.
8 are erected, and an engagement hole 19 is formed in this support part 18 with a part open and into which the lead terminal 2 is press-fitted. A storage groove portion 20 is formed continuously from the engagement hole portion 19 along the direction to accommodate the vertical portion of the lead terminal 2.

Further, the FPC board 4 is formed with a through-hole portion 21 into which the support portion 18 can be inserted, and a through-hole portion 21 that protrudes oppositely into the through-hole portion 21 for electrical connection with the tip of the lead terminal 2. A pair of tongue pieces 22 on which the conductive portion 3 is provided are formed.

That is, the heat-generating electronic component 1 is assembled into the support part 1 by mounting the FPC board 4 along the board 7 and press-fitting the lead terminal 2 into the engagement hole part 19.
At this time, the vertical portion of the lead terminal 2 is stored in the storage groove 20, and the tongue piece 22 protruding into the through hole 21 is bent by the support portion 18 and raised.

Therefore, by press-fitting and engaging the lead terminals 2 into the engagement holes 19, the heat-generating electronic component 1 can be mounted securely without concentrating stress on the electrical connection points with a simple installation process by leaving a space around the periphery. In addition to the holding force generated by press-fitting the lead terminal 2 into the engagement hole 19, the lead terminal 2
Since the vertical part of is stored in the storage groove 20,
Even when vibration is applied, horizontal movement can be reliably suppressed and stress concentration at electrical connection points can be suppressed.

In any of the embodiments described above, in order to strengthen the holding force of the lead terminal in each engagement groove, as shown in FIG. It is also possible to provide convex portions 25 protruding from both sides of the engagement hole portion 24 so that the lead terminal 2 is press-fitted between the convex portions 25 .

Further, the FPC board is not necessarily limited to being mounted along the board surface on which the support part is provided; for example, the FPC board may be mounted on the back surface of the instrument case, and the support part may be erected on the side surface of the instrument case, The tongue piece may be extended laterally so that the heat-generating electronic component is engaged with the support portion.

[Effect of idea]

This invention electrically connects the lead terminals of heat-generating electronic components to the conductive part of the FPC board, and attaches the heat-generating electronic components to the board with a gap between them, with a part open and the lead terminals The substrate is provided with a support portion formed with an engagement hole for press-fitting the heat-generating electronic components to the FPC board with a simple installation process while maintaining a space around them. It is possible to provide a heat-generating electronic component mounting device that can be easily mounted and has extremely high practical value.

[Brief explanation of drawings]

Figures 1 to 3 show one embodiment of this invention. Figures 1 and 2 are both perspective views, Figure 3 is a sectional view of the main part, and Figure 4 is an embodiment of this invention. FIG. 5 is a perspective view showing another embodiment of the invention, FIG. 5A is a perspective view, FIGS. 5B and C are both sectional views of essential parts, and FIG. 7 is a perspective view of a main part showing still another embodiment, and FIG. 7 is a sectional view showing a conventional example. 1... Heat-generating electronic component, 2... Lead terminal, 3
... Conductive part, 4 ... FPC board, 7 ... Substrate, 11,
16, 18, 23...Support part, 13, 17, 1
9, 24...Engagement hole portion.

Claims (1)

[Scope of utility model registration request] A device in which a lead terminal of a heat-generating electronic component is electrically connected to a conductive part of an FPC board, and the heat-generating electronic component is attached to the board with a gap, and a part of the heat-generating electronic component is opened and the lead terminal is press-fitted into engagement. A mounting device for a heat-generating electronic component, characterized in that the substrate is provided with a support portion in which an engagement hole is formed.