JP2000216516A - Mounting structure of light emitting element - Google Patents

Mounting structure of light emitting element

Info

Publication number
JP2000216516A
JP2000216516A JP1286599A JP1286599A JP2000216516A JP 2000216516 A JP2000216516 A JP 2000216516A JP 1286599 A JP1286599 A JP 1286599A JP 1286599 A JP1286599 A JP 1286599A JP 2000216516 A JP2000216516 A JP 2000216516A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
substrate
mounting structure
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1286599A
Other languages
Japanese (ja)
Inventor
Hiroyuki Arai
裕之 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Funai Electric Co Ltd
Original Assignee
Funai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Funai Electric Co Ltd filed Critical Funai Electric Co Ltd
Priority to JP1286599A priority Critical patent/JP2000216516A/en
Publication of JP2000216516A publication Critical patent/JP2000216516A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of a light emitting element wherein the light emitting element can be simply positioned to a board almost horizontally and laterally, other components are unnecessary, and the number of components, cost and production manhour can be reduced. SOLUTION: In a mounting structure of a light emitting element where a light emitting element 2 is mounted in the longitudinal direction on a board 1 by making a main body part 3 almost perpendicular to the board 1, a protruding part 5 which is inserted in the board 1 and used for positioning and fixing when the main body part 3 of the light emitting element 2 is arranged almost horizontally and laterally to the board 1 is formed on the tip side of the light emitting element 2. As a result, the light emitting element 2 can be simply positioned and fixed to the board 1 almost horizontally and laterally, other components are unnecessary, and the number of components, cost and production manhour can be reduced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板に発光素子を
実装するようにした発光素子の実装構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device mounting structure in which a light emitting device is mounted on a substrate.

【0002】[0002]

【従来の技術】従来、基板に発光素子を略垂直な縦向き
に実装してから、その本体部を基板と略平行な横向きに
して取り付けるには、図3に示すように、別部品である
位置決め用成形品からなるホルダー100を用いて、こ
のホルダー100で発光素子110を基板120と略平
行な横向きに保持して取り付けていた。ところがこれに
おいては、ホルダー100を用いるために、部品点数が
多くなって、コスト高となるとともに生産工数が多くな
るという問題があった。
2. Description of the Related Art Conventionally, in order to mount a light emitting element on a substrate in a substantially vertical vertical direction and then mount the main body portion in a horizontal direction substantially parallel to the substrate, as shown in FIG. The light emitting element 110 was held and mounted in a horizontal direction substantially parallel to the substrate 120 using the holder 100 made of a molded product for positioning. However, in this case, since the holder 100 is used, there is a problem that the number of parts is increased, the cost is increased, and the number of production steps is increased.

【0003】また、実開昭62−74359号公報に
は、リード付回路部品の基板への装着構造が記載されて
いる。これは、図4、図5、図6に示すように、第1及
び第2の孔205a、205bを有する基板205と、
回路部と発光部202の下部の受座部203と受座部2
03より下方へ突出するリード204とを有し、受座部
下面のリード204が突出する部分に半田収納用凹部2
03cを設け、かつ受座部下面の他の部分に係止凸部3
03bを設けたリード付回路部品201とよりなり、リ
ード付回路部品201を基板205に対し、リード20
4を基板205のプリントに半田付するよう構成したも
のである。ところがこれにおいては、リード付回路部品
201が基板205に対して縦向きに装着するものにだ
けしか応用できなかった。
Further, Japanese Utility Model Laid-Open Publication No. Sho 62-74359 describes a mounting structure of a leaded circuit component on a substrate. This comprises a substrate 205 having first and second holes 205a and 205b, as shown in FIGS.
Receiving part 203 and receiving part 2 below circuit part and light emitting part 202
And a lead 204 protruding downward from the lower end of the solder receiving recess 2.
03c, and a locking projection 3 is provided on another portion of the lower surface of the receiving portion.
03b provided with a circuit component 201 having a lead.
4 is configured to be soldered to a print on the substrate 205. However, in this case, it can be applied only to the one in which the circuit component with lead 201 is vertically mounted on the substrate 205.

【0004】また、実開昭61−183553号公報に
は、発光素子の実装構造が記載されている。これは、図
7、図8に示すように、発光素子301の一面から引き
出した二本のリード線303、303を、プリント基板
302に設けた挿通孔304、304に差込んで発光素
子301を搭載する発光素子の実装構造において、発光
素子301のプリント基板302との当接面に、リード
線間位置で円錐形状の突起305を設けると共に、プリ
ント基板302の突起305との対応位置に、突起の最
大径以下の孔径を有する突起固定孔306を設けたもの
である。ところがこれにおいては、発光素子301をプ
リント基板302に対して縦向きに実装するものにだけ
しか応用できなかった。
[0004] Japanese Utility Model Laid-Open Publication No. Sho 61-183553 describes a mounting structure of a light emitting element. As shown in FIGS. 7 and 8, two lead wires 303, 303 drawn from one surface of the light emitting element 301 are inserted into insertion holes 304, 304 provided in the printed circuit board 302, and the light emitting element 301 is inserted. In the mounting structure of the light emitting element to be mounted, a conical projection 305 is provided on the contact surface of the light emitting element 301 with the printed board 302 at the position between the lead wires, and the projection is provided at a position corresponding to the projection 305 on the printed board 302. Is provided with a projection fixing hole 306 having a diameter equal to or less than the maximum diameter. However, in this case, it can be applied only to a device in which the light emitting element 301 is mounted vertically on the printed circuit board 302.

【0005】[0005]

【発明が解決しようとする課題】本発明は、上記従来の
問題を解消し、発光素子を基板に対して略水平な横向き
に簡単に位置決め固定することができ、しかも別部品を
必要とせずに部品点数を削減できてコストダウンを図る
ことができるとともに、生産工数の削減を図ることがで
きる発光素子の実装構造を提供することを目的としてい
る。
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and can easily position and fix a light-emitting element in a substantially horizontal lateral direction with respect to a substrate, without requiring any separate parts. It is an object of the present invention to provide a light-emitting element mounting structure capable of reducing the number of components and reducing costs and reducing the number of production steps.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、請求項1に記載の発明は、基板に発光素子の本体部
を前記基板と略垂直な縦向きにして実装するようにした
発光素子の実装構造において、前記発光素子の先端側
に、前記発光素子の本体部を前記基板と略平行な横向き
にした時に、前記基板に挿入して位置決め固定するため
の突出部を設けたことを特徴としている。請求項2に記
載の発明は、前記突出部は先端部に向けて鋭角形状をし
ていることを特徴としている。
In order to achieve the above object, according to the first aspect of the present invention, there is provided a light emitting device in which a main body of a light emitting element is mounted on a substrate in a vertical direction substantially perpendicular to the substrate. In the mounting structure of the element, it is preferable that a protruding portion for inserting and positioning and fixing the main body of the light emitting element to the substrate when the main body of the light emitting element is in a horizontal direction substantially parallel to the substrate is provided on the tip side of the light emitting element. Features. The invention according to claim 2 is characterized in that the protruding portion has an acute angle toward the tip.

【0007】[0007]

【発明の実施の形態】以下、本発明に係る発光素子の実
装構造の実施の形態について、図を参照しつつ説明す
る。図1は本発明の第1実施形態の発光素子の実装構造
を示す側面図である。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a light emitting device mounting structure according to the present invention. FIG. 1 is a side view showing a mounting structure of the light emitting device according to the first embodiment of the present invention.

【0008】第1実施形態の発光素子の実装構造は、図
1に示すように、基板1に略垂直な縦向きにして実装さ
れる発光素子2の先端側に、発光素子2の本体部3を基
板1と略平行な横向きにした時に、基板1に穿設された
鋭角形状の凹孔4に挿入して位置決め固定するための鋭
角形状の突出部5を設けている。従って、発光素子2を
基板1と略平行な縦向きにしたときに、発光素子2の突
出部5が基板の凹孔4に挿入されて位置決め固定される
ので、発光素子2を基板1に対して略水平な横向きに簡
単に位置決め固定することができ、しかも別部品を必要
としないので、部品点数を削減できてコストダウンを図
ることができ、生産工数の削減を図ることができる。
As shown in FIG. 1, the mounting structure of the light emitting element of the first embodiment is such that a main body 3 of the light emitting element 2 is mounted on a front end side of the light emitting element 2 mounted vertically in a direction substantially perpendicular to the substrate 1. When the substrate 1 is turned sideways substantially parallel to the substrate 1, an acute-angled projection 5 is provided to be inserted into an acute-angled concave hole 4 formed in the substrate 1 for positioning and fixing. Therefore, when the light emitting element 2 is set in the vertical direction substantially parallel to the substrate 1, the projection 5 of the light emitting element 2 is inserted into the concave hole 4 of the substrate and is positioned and fixed. Since it can be easily positioned and fixed in a substantially horizontal horizontal direction and does not require a separate component, the number of components can be reduced, the cost can be reduced, and the number of production steps can be reduced.

【0009】更に、発光素子2に設けた突出部5が鋭角
形状に形成されているので、発光素子2を基板1に対し
て略平行な横向きにしたときに、この鋭角形状の突出部
5を基板1に穿設した凹孔4にスムーズに挿入すること
ができて、発光素子2の位置決め固定を容易に行うこと
ができる。
Furthermore, since the projection 5 provided on the light emitting element 2 is formed in an acute angle shape, when the light emitting element 2 is turned sideways substantially parallel to the substrate 1, the acute angle projection 5 is formed. The light emitting element 2 can be smoothly inserted into the concave hole 4 formed in the substrate 1 and the positioning and fixing of the light emitting element 2 can be easily performed.

【0010】図2は第2実施形態の発光素子の実装構造
を示す側面図である。第2実施形態の発光素子の実装構
造は、図2に示すように、発光素子2の根元側に、鋭角
形状の突出部5を設け、発光素子2を基板1に略水平な
横向きにしたときに、この突出部5を基板1に穿設され
た凹孔4に挿入して、発光素子2を基板1に位置決め固
定するようにしている。この第2実施形態の発光素子の
実装構造の作用効果は、上記した第1実施形態の発光素
子の実装構造と同様なので、その説明を省略する。
FIG. 2 is a side view showing a mounting structure of the light emitting device of the second embodiment. As shown in FIG. 2, the mounting structure of the light emitting element according to the second embodiment is such that, when the light emitting element 2 is provided with an acute-angled protruding portion 5 on the base side of the light emitting element 2 and Then, the protrusion 5 is inserted into the concave hole 4 formed in the substrate 1 so that the light emitting element 2 is positioned and fixed to the substrate 1. The operational effects of the light emitting element mounting structure of the second embodiment are the same as those of the light emitting element mounting structure of the first embodiment described above, and a description thereof will be omitted.

【0011】[0011]

【発明の効果】以上説明したように、請求項1に記載の
発明によれば、基板に発光素子の本体部を基板と略垂直
な縦向きにして実装した後、発光素子の本体部を基板と
略平行な横向きにした時に、発光素子の先端側に設けた
突出部を基板に挿入して位置決め固定するようにしたの
で、発光素子を基板に対して略水平な横向きに簡単に位
置決め固定することができ、しかも別部品を必要とせず
に部品点数を削減できてコストダウンを図ることができ
るとともに、生産工数の削減を図ることができる。 請
求項2に記載の発明によれば、突出部は先端部に向けて
鋭角形状をしているので、この突出部を基板にスムーズ
に挿入することができる。
As described above, according to the first aspect of the present invention, after the main body of the light emitting element is mounted on the substrate in a vertical direction substantially perpendicular to the substrate, the main body of the light emitting element is mounted on the substrate. When the light emitting device is set in a horizontal direction substantially parallel to the substrate, the protrusion provided on the front end side of the light emitting element is inserted into the substrate and positioned and fixed, so that the light emitting device can be easily positioned and fixed substantially horizontally in the horizontal direction with respect to the substrate. In addition, the number of parts can be reduced without the necessity of separate parts, so that the cost can be reduced and the number of production steps can be reduced. According to the second aspect of the present invention, since the protrusion has an acute angle toward the tip, the protrusion can be smoothly inserted into the substrate.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施形態の発光素子の実装構造を
示す側面図である。
FIG. 1 is a side view showing a mounting structure of a light emitting device according to a first embodiment of the present invention.

【図2】第2実施形態の発光素子の実装構造を示す側面
図である。
FIG. 2 is a side view illustrating a mounting structure of a light emitting device according to a second embodiment.

【図3】従来の発光素子の実装構造を示す側面図であ
る。
FIG. 3 is a side view showing a conventional light emitting element mounting structure.

【図4】従来のリード付回路部品の基板の装着構造を示
す分解斜視図である。
FIG. 4 is an exploded perspective view showing a conventional structure for mounting a circuit board with leads on a circuit board.

【図4】同発光ダイオードの下方斜視図である。FIG. 4 is a lower perspective view of the light emitting diode.

【図5】同一部切欠きした側面図である。FIG. 5 is a side view in which the same portion is cut away.

【図6】従来の発光素子の実装構造を示す分解斜視図で
ある。
FIG. 6 is an exploded perspective view showing a mounting structure of a conventional light emitting element.

【図7】同整列用治具の取付け前の分解斜視図である。FIG. 7 is an exploded perspective view of the alignment jig before attachment.

【符号の説明】[Explanation of symbols]

1 基板 2 発光素子 3 本体部 5 突出部 DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting element 3 Main part 5 Projection

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成11年4月21日(1999.4.2
1)
[Submission date] April 21, 1999 (1999.4.2
1)

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図面の簡単な説明[Correction target item name] Brief description of drawings

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施形態の発光素子の実装構造を
示す側面図である。
FIG. 1 is a side view showing a mounting structure of a light emitting device according to a first embodiment of the present invention.

【図2】第2実施形態の発光素子の実装構造を示す側面
図である。
FIG. 2 is a side view illustrating a mounting structure of a light emitting device according to a second embodiment.

【図3】従来の発光素子の実装構造を示す側面図であ
る。
FIG. 3 is a side view showing a conventional light emitting element mounting structure.

【図4】従来のリード付回路部品の基板の装着構造を示
す分解斜視図である。
FIG. 4 is an exploded perspective view showing a conventional structure for mounting a circuit board with leads on a circuit board.

【図5】同発光ダイオードの下方斜視図である。FIG. 5 is a lower perspective view of the light emitting diode.

【図6】同一部切欠きした側面図である。FIG. 6 is a side view in which the same portion is cut out.

【図7】従来の発光素子の実装構造を示す分解斜視図で
ある。
FIG. 7 is an exploded perspective view showing a conventional light emitting element mounting structure.

【図8】同整列用治具の取付け前の分解斜斜視図であ
る。
FIG. 8 is an exploded oblique perspective view before the alignment jig is attached.

【符号の説明】 1 基板 2 発光素子 3 本体部 5 突出部[Description of Signs] 1 Substrate 2 Light-Emitting Element 3 Main Body 5 Projection

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 基板に発光素子の本体部を前記基板と略
垂直な縦向きにして実装するようにした発光素子の実装
構造において、前記発光素子の先端側に、前記発光素子
の本体部を前記基板と略平行な横向きにした時に、前記
基板に挿入して位置決め固定するための突出部を設けた
ことを特徴とする発光素子の実装構造。
1. A light-emitting element mounting structure in which a main body of a light-emitting element is mounted on a substrate in a vertical direction substantially perpendicular to the substrate, wherein the main body of the light-emitting element is provided on a tip side of the light-emitting element. A mounting structure for a light emitting element, comprising: a protruding portion that is inserted into the substrate and fixed to be positioned when the device is turned sideways substantially parallel to the substrate.
【請求項2】 前記突出部は先端部に向けて鋭角形状を
していることを特徴とする請求項1に記載の発光素子の
実装構造。
2. The light emitting device mounting structure according to claim 1, wherein the projecting portion has an acute angle toward the tip.
JP1286599A 1999-01-21 1999-01-21 Mounting structure of light emitting element Pending JP2000216516A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1286599A JP2000216516A (en) 1999-01-21 1999-01-21 Mounting structure of light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1286599A JP2000216516A (en) 1999-01-21 1999-01-21 Mounting structure of light emitting element

Publications (1)

Publication Number Publication Date
JP2000216516A true JP2000216516A (en) 2000-08-04

Family

ID=11817319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1286599A Pending JP2000216516A (en) 1999-01-21 1999-01-21 Mounting structure of light emitting element

Country Status (1)

Country Link
JP (1) JP2000216516A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013024752A (en) * 2011-07-21 2013-02-04 Ricoh Co Ltd Optical sensor and image formation apparatus
KR101591272B1 (en) * 2015-02-16 2016-02-04 리모트솔루션주식회사 PCB Middle Mount Infrared Ray LED

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013024752A (en) * 2011-07-21 2013-02-04 Ricoh Co Ltd Optical sensor and image formation apparatus
KR101591272B1 (en) * 2015-02-16 2016-02-04 리모트솔루션주식회사 PCB Middle Mount Infrared Ray LED

Similar Documents

Publication Publication Date Title
JP2000216516A (en) Mounting structure of light emitting element
JP3782626B2 (en) LCD illumination device
JP2566011Y2 (en) Display tube fixture
JP3330752B2 (en) Lead frame for surface mount hybrid integrated circuit device
JPH03151686A (en) Printed wiring board
JP2816067B2 (en) Horizontal LED lamp
JP2007184469A (en) Fixing structure of electronic component using bush
JPH0343755Y2 (en)
JPH02111093A (en) Surface-mounting structure of semiconductor device
JPH0353477Y2 (en)
JP3503280B2 (en) Equipment for mounting electrical components
JP2588674Y2 (en) LED
JPH06188535A (en) Spacer for fixing led
JPS62223Y2 (en)
JPS6322689Y2 (en)
JP2007258212A (en) Method for mounting led onto circuit board
JPH05243459A (en) Hybrid ic
JP2005276898A (en) Printed wiring board
JP2005159228A (en) Printed wiring board
JPH08139431A (en) Hybrid integrated circuit device
JP2003069079A (en) Mounting structure of led
JPH11212486A (en) Liquid crystal display device
JPH0536445A (en) Dip type connector
JPH11233701A (en) Electronic part, and its mounting method
JP2002198632A (en) Surface mounting component of printed substrate and its mounting method