JPH01169001U - - Google Patents
Info
- Publication number
- JPH01169001U JPH01169001U JP6440088U JP6440088U JPH01169001U JP H01169001 U JPH01169001 U JP H01169001U JP 6440088 U JP6440088 U JP 6440088U JP 6440088 U JP6440088 U JP 6440088U JP H01169001 U JPH01169001 U JP H01169001U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical member
- insulating layer
- conductive material
- electrically connected
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係る部品の実装例を示す断面
図、第２図は本考案に係る実装部品の斜視図。
１０…基板、１１…スルーホール、１６…リー
ド、２２…高密度用実装部品、２４…第１の円筒
部材、２６…第２の円筒部材、２８…絶縁層、３
２…機能素子。
FIG. 1 is a sectional view showing an example of mounting components according to the present invention, and FIG. 2 is a perspective view of the mounted components according to the present invention. DESCRIPTION OF SYMBOLS 10... Board, 11... Through hole, 16... Lead, 22... High-density mounting component, 24... First cylindrical member, 26... Second cylindrical member, 28... Insulating layer, 3
2...Functional element.
Claims (1)
電気良導材から成る第１の筒部材２４を、外側に
電気良導材から成る第２の筒部材２６を配設し、
これら筒部材２４，２６の一端側に配設されてい
ると共に、一端子を前記第１の筒部材と電気的に
接続し、他端子を前記第２の筒部材と電気的に接
続した機能素子３２を具備したことを特徴とする
高密度用実装部品。 A first cylindrical member 24 made of an electrically conductive material is disposed inside the electrically insulating layer 28, and a second cylindrical member 26 made of an electrically conductive material is disposed outside the electrically insulating layer 28.
A functional element disposed on one end side of these cylindrical members 24 and 26, having one terminal electrically connected to the first cylindrical member and the other terminal electrically connected to the second cylindrical member. A high-density mounting component characterized by comprising: 32.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440088U JPH01169001U (en) | 1988-05-18 | 1988-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6440088U JPH01169001U (en) | 1988-05-18 | 1988-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169001U true JPH01169001U (en) | 1989-11-29 |
Family
ID=31289867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6440088U Pending JPH01169001U (en) | 1988-05-18 | 1988-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169001U (en) |
-
1988
- 1988-05-18 JP JP6440088U patent/JPH01169001U/ja active Pending